Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a plurality of transmission filters, a resin layer, and a shield layer. The mounting substrate has a first major surface and a second major surface opposite to each other. The plurality of transmission filters is mounted on the first major surface of the mounting substrate. The resin layer is disposed on the first major surface of the mounting substrate and covers at least part of an outer peripheral surface of each of the plurality of transmission filters. The shield layer covers the resin layer and at least part of each of the plurality of transmission filters. At least part of a major surface of each of the plurality of transmission filters on an opposite side to the mounting substrate side is in contact with the shield layer.

This invention provides opportunity for diamond and bi-wafer microstructures to be implemented in advanced ICs and advanced IC packages to form a new breed of ICs and SiPs that go beyond the limitations of silicon at the forefront of IC advancement due primarily to diamond's extreme heat dissipating ability. Establishing the diamond and bi-wafer microstructure capabilities and implementing them in advanced ICs and advanced IC packages gives IC and package architects and designers an extra degree of design freedom in achieving extreme IC performance, particularly when thermal management presents a challenge. Diamond's extreme heat spreading ability can be used to dissipate hotspots in processors and other high-power chips such as GaN HEMT, resulting in performance and reliability enhancement for IC and package applications covering HPC, AI, photonics, 5G RF/mmWave, power and IoT, and at the system level propelling the migration from traditional computing to near-memory computing and in-memory computing.

A semiconductor device has a substrate and an electrical component disposed over the substrate. An encapsulant is deposited over the electrical component and substrate. A shielding layer has a graphene core shell formed on a surface of the encapsulant. The shielding layer can be printed on the encapsulant. The graphene core shell includes a copper core. The shielding layer has a plurality of cores covered by graphene and the graphene is interconnected within the shielding layer to form an electrical path. The shielding layer also has thermoset material or polymer or composite epoxy type matrix and the graphene core shell is embedded within the matrix. A shielding material can be disposed around the electrical component. The electrical path dissipates any charge incident on shielding layer, such as an ESD event, to reduce or inhibit the effects of EMI, RFI, and other inter-device interference.

Apparatuses relating generally to a microelectronic package having protection from electromagnetic interference are disclosed. In an apparatus thereof, a platform has an upper surface and a lower surface opposite the upper surface and has a ground plane. A microelectronic device is coupled to the upper surface of the platform. Wire bond wires are coupled to the ground plane with a pitch. The wire bond wires extend away from the upper surface of the platform with upper ends of the wire bond wires extending above an upper surface of the microelectronic device. The wire bond wires are spaced apart from one another to provide a fence-like perimeter to provide an interference shielding cage. A conductive layer is coupled to at least a subset of the upper ends of the wire bond wires for electrical conductivity to provide a conductive shielding layer to cover the interference shielding cage.

A method of forming a semiconductor structure includes forming a photoresist over a first conductive pattern. The method further includes patterning the photoresist to define a plurality of first openings. The method further includes depositing a conductive material in each of the plurality of first openings. The method further includes disposing a molding material over the first conductive pattern, wherein the molding material surrounds a die. The method further includes removing a portion of the molding material to form a second opening. The method further includes disposing a dielectric material into the opening to form a dielectric member. The method further includes forming a redistribution structure over the molding material and the dielectric member, wherein the redistribution structure includes an antenna structure over the dielectric member and electrically connected to the die.

In one example, an electronic device includes a substrate having an upper side, a lower side opposite to the upper side, a lateral side connecting the upper side to the lower side, and a conductive structure. An electronic component is coupled to the conductive structure at the upper side of the substrate. An encapsulant covers a lateral side of the electronic component and the upper side of the substrate and having an encapsulant top side and an encapsulant lateral side. The electronic device includes first metallic coating having a first metallic coating top side, a first metallic coating sidewall; and a first metallic coating thickness. The electronic device includes a second metallic coating having a second metallic coating thickness that is greater than the first metallic coating thickness. In the present example, the first metallic coating top side is over the encapsulant top side, the first metallic coating sidewall is over the encapsulant lateral side, and the second metallic coating is over the encapsulant top side. Other examples and related methods are also disclosed herein.

An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillars that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillars are conductive wires. A package body encapsulates the electronic component and the conductive pillars. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive pillars. In one embodiment, the electrical connection is made through the package body. In another embodiment, the electrical connection is made through the substrate.