A method and an apparatus for producing a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for dielectric heating; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.

A sealing plate for use with a packaging machine that integrates a seal formed indicia into a portion of a package seal. A package having a seal formed indicia integrated into the package seal, which when the package is opened undergoes undergo a visual transformation, and a method of making the same.

A sonic label welding device for welding multiple labels together using ultrasonic welding is disclosed. The sonic label welding device comprises a digital controls main menu screen which includes touch screen buttons that are utilized to go to specific screens to program the device to perform in a certain manner. For example, a user can press the cut to length button if wanting to cut a label to a specific length, or the label weld count button to specify the number of labels being sonically welded. Further, the sonic label welding device comprises a head for allowing multiple labels to be assembled under pressure and an anvil for directing the high frequency vibrations. A method of manufacturing a multi-layer care label is also disclosed.

A laser welding method and system for joining portions of first and second workpieces of thermoplastic material that is partially permeable to a laser beam but absorbs radiation from the laser beam. The first and second workpieces, which are made of material that absorbs radiation from a laser beam, are clamped together. A mask is placed on a first surface of the first workpiece, the first surface being opposite the surface engaging the second workpiece. The mask is impermeable to a laser beam and forms a slot for passing a laser beam to the portion of the first surface of the upper workpiece exposed by the slot, so that heating and melting of the material of the workpieces is limited to the width of the slot. A laser beam is directed onto the slot and moved in a manner to illuminate the slot to melt and join the workpieces.

A method for welding a first hose end at a joint with a second hose end in a seam that extends on a circumference of the first hose end, the method comprising the steps: applying a protective layer at the joint to an inside of the first hose end; pushing the second hose end beyond the joint over the first hose end; pressing the first hose end and the second hose end together flat at the joint between two first damping jaws that are moved towards each other; welding the first hose end and the second hose end together by two first partial seams while pressed together, wherein the protective layer prevents a welding of the inside of the first hose end; releasing the first hose end and the second hose end from the two first clamping jaws after welding the two first partial seams.

A binding machine comprising: a feeding device for feeding a binding element (3) in the form of a wire or strap in a loop around one or more objects to be bound and subsequently retracting the binding element to draw it tightly around said objects; and a laser welding device for forming a welded joint between a section at the leading end of the binding element and an adjoining section at the trailing end of the part (3a) of the binding element fed in a loop around said objects to thereby secure this part of the binding element in a loop around the objects. The laser welding device is configured to apply an identification marking on an outer surface of the binding element by means of a laser beam (14) emitted from a laser welding head of the laser welding device.

A laser welding method and system for joining portions of first and second workpieces of thermoplastic material that is partially permeable to a laser beam but absorbs radiation from the laser beam. The first and second workpieces, which are made of material that absorbs radiation from a laser beam, are clamped together. A mask is placed on a first surface of the first workpiece, the first surface being opposite the surface engaging the second workpiece. The mask is impermeable to a laser beam and forms a slot for passing a laser beam to the portion of the first surface of the upper workpiece exposed by the slot, so that heating and melting of the material of the workpieces is limited to the width of the slot. A laser beam is directed onto the slot and moved in a manner to illuminate the slot to melt and join the workpieces.

One or more implementations of a multi-film thermoplastic structure include a first film having a first appearance in contact with a second film having a second appearance at one or more visually-distinct contact areas arranged into a text. Wherein the one or more visually-distinct contact areas, cause the first film to take on the second appearance of the second film. In one or more implementations the multi-film thermoplastic structure comprises a thermoplastic bag and text comprises a suffocation warning.

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency dielectric heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

An apparatus for vacuumizing and sealing a package includes a plurality of platens and vacuum chambers, each chamber adapted to mate with a dedicated one of the platens; a conveying system for conveying the platens and chambers along a generally angular path having a single axis of rotation; an automated loading assembly having a linear component and configured to load a package onto each of the platens; an automated unloading assembly having a linear portion and configured to unload a vacuumized, sealed package from each loaded platen onto an outfeed conveyor; and a vacuumizing/sealing system configured to cause relative movement of each chamber/platen pair, along a portion of the angular path, to form therebetween an air-tight enclosure accommodating the package and effect vacuumization and sealing of the package.