A liquid discharge head substrate includes a first heater row including a plurality of heaters arranged in a first direction, a first transistor configured to drive a first heater of the plurality of heaters, and a second transistor configured to drive the first heater. The first heater is arranged between the first transistor and the second transistor in a second direction crossing the first direction.

The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

A method of printing from an inkjet nozzle device having a thermal actuator. The method includes the steps of supplying a fluid to the inkjet nozzle device, the fluid comprising an acetylenic compound; and repeatedly actuating the thermal actuator so as to eject fluid droplets from a nozzle opening of the inkjet nozzle device. The acetylenic compound is present in an amount sufficient to increase the lifetime of the inkjet nozzle device.

An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.

In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.

In an embodiment, a fluid flow structure includes a micro device embedded in a molding, and a fluid feed hole formed through the micro device. A fluid channel is fluidically coupled to the fluid feed hole and includes a first compression molded channel segment and a second material ablated channel segment.

Methods and apparatus to selectively control ink evaporation in printhead nozzles are disclosed. An example printhead for use with a printer includes a plurality of nozzles (142) and a plurality of valves (144) positioned adjacent respective ones of the nozzles (142) to selectively control fluid flow through the respective nozzle (142).

Provided is a manufacturing method of a liquid ejection head, and the manufacturing method includes steps of: providing an ejection orifice forming member on one surface of a wafer, in which an energy-generating element is provided on the one surface of the wafer; forming a recess on the other surface of the wafer; and dicing the wafer along a plurality of dicing lines. The plurality of dicing lines include a dicing line extending in one direction and a dicing line extending in a direction crossing the one direction, and the recess is formed on each of positions overlapping the dicing lines except for an intersection part where the dicing line extending in the one direction intersects the dicing line extending in the direction crossing the one direction.

An Inkjet printer includes: an inkjet printhead having an exposed corrodible structure containing silicon nitride, borophosphosilicate glass (BPSG) or silicon oxide; and an ink reservoir containing said ink which is in fluid communication with said printhead. The ink includes: water; a dye; and a metal additive for minimizing corrosion of the exposed structure.

A liquid ejection head substrate includes a heating resistor array including a plurality of heating resistors and a protective film covering at least one of the heating resistors. The liquid ejection head substrate further includes a supply opening array and an electrode. The supply opening array is disposed on a side of a surface of the liquid ejection head substrate on which the protective film is provided. The supply opening array includes a plurality of supply openings through which a liquid is supplied arranged in a direction along the heating resistor array. The electrode is disposed on the side of the surface in a space between the supply openings adjacent to each other in a direction along the supply opening array. The electrode is configured such that a voltage is applied between the electrode and the protective film.