A printhead of a printer includes a nozzle plate having a first layer, a second layer, and an intermediate channel. The first layer can have at least one fluid chamber for holding an immiscible fluid, and a plurality of ejection fluid chamber for holding an ejection fluid. The second layer can have a plurality of ejection fluid nozzles, one ejection fluid nozzle being in fluid communication with one ejection fluid chamber. The intermediate channel can form a passage between the first layer and the second layer. Further, the intermediate channel is in fluid communication with the fluid chambers to carry the immiscible fluid from the fluid chambers towards each of the ejection fluid nozzles for forming a layer of the immiscible fluid over the ejection fluid chambers to maintain the printhead.

There is provided a head unit including: head modules; a plurality of first tubes; and a plurality of second tubes. Each of the head modules includes: energy-applying mechanisms; supply buffer chambers; and return buffer chambers. The supply buffer chambers of the plurality of head module are connected in series via the plurality of first tubes. The return buffer chambers of the plurality of head modules are connected in series via the plurality of second tubes.

There is used a liquid ejection head including: a plurality of nozzles for ejecting liquid; a plurality of pressure chambers corresponding to the plurality of nozzles; a plurality of pressure generating elements arranged in the plurality of pressure chambers, and for generating a pressure for ejection; a plurality of first flow passages corresponding to the plurality of pressure chambers; a second flow passage communicating with the plurality of first flow passages, and common to the plurality of pressure chambers; and a damper that is elastically deformed when a pressure of the liquid is increased by the pressure generating element. The liquid is supplied to each of the plurality of pressure chambers from the common second flow passage via the plurality of first flow passages, and a Young's modulus of the second flow passage member configuring the second flow passage is 65 GPa or less.

A printing element is used, which includes a substrate, an intermediate layer, and a channel forming member layered in this order. The substrate has a common liquid chamber. The channel forming member has a second surface that is a surface facing the substrate via the intermediate layer, and a first surface that is an opposite surface to the second surface. The first surface is formed with a plurality of ejection ports that eject liquid from the common liquid chamber. The second surface is formed with a plurality of channels that make each of the plurality of ejection ports and the common liquid chamber communicate with each other, and a plurality of substantially parallel beam structures, the plurality of beam structures forming a slit portion therebetween.

One example provides a fluidic die including a nozzle layer disposed on a substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is exposed to the upper surface of the nozzle layer and extends proximate to a portion of the nozzle orifices, an impedance of the conductive trace indicative of a surface condition of the upper surface of the nozzle layer.

A liquid circulating device has: a supply flow path through which a liquid is supplied from a liquid supply source that stores the liquid to a liquid ejecting head that ejects the liquid; a collection flow path through which the liquid collected from the liquid ejecting head is returned to the supply flow path; and a liquid flowing portion that causes the liquid to flow in a circulation flow path including the supply flow path, the liquid ejecting head, and the collection flow path. An air capturing portion can capture bubbles and is provided in at least one of the supply flow path and collection flow path. The air capturing portion is disposed at a position higher than the position of the liquid ejecting head.

A liquid ejection head includes ejection orifices for ejecting liquid, common liquid chambers connected to the ejection orifices, common flow passages, and pitch conversion flow passages that connects the common flow passages and liquid chambers to each other. The pitch conversion flow passages includes a periphery formed with resin. In a case where a number of pitch conversion flow passages in a group is minimum on a condition that one or more of the pitch conversion flow passages are respectively included in the group, the pitch conversion flow passages have a repeating pattern in which the group is repeatedly arranged. At least one of two pitch conversion flow passages adjoining an m-th pitch conversion flow passage (m is all integers from 1 to n−2, where n is an integer of 3 or more) is one of first to (m+1)-th pitch conversion flow passages.

A wafer structure is disclosed and includes a chip substrate and plural inkjet chips having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

A liquid ejection head includes a liquid ejection head substrate having ejection elements that generate liquid ejecting energy, an ejection port formation member having ejection ports, and liquid chambers between the liquid ejection head substrate and the ejection port formation member to house liquid to be ejected through the ejection ports. The liquid ejection head substrate includes a substrate, an insulating film stacked on the substrate to insulate the ejection elements, communication ports in the substrate and the insulating film to communicate with the liquid chambers, and a liquid-resistant insulating film adherent to the ejection port formation member. The liquid-resistant insulating film covers the insulating film at its ejection port formation member side and includes a first portion partially contacting the ejection port formation member and a second portion covering the inner surfaces of the communication ports in the insulating film, the first and second portions being continuous.