A wafer structure is disclosed and includes a chip substrate and plural inkjet chips having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

A liquid ejection head includes a liquid ejection head substrate having ejection elements that generate liquid ejecting energy, an ejection port formation member having ejection ports, and liquid chambers between the liquid ejection head substrate and the ejection port formation member to house liquid to be ejected through the ejection ports. The liquid ejection head substrate includes a substrate, an insulating film stacked on the substrate to insulate the ejection elements, communication ports in the substrate and the insulating film to communicate with the liquid chambers, and a liquid-resistant insulating film adherent to the ejection port formation member. The liquid-resistant insulating film covers the insulating film at its ejection port formation member side and includes a first portion partially contacting the ejection port formation member and a second portion covering the inner surfaces of the communication ports in the insulating film, the first and second portions being continuous.

A liquid ejection head includes a liquid channel through which a first liquid and a second liquid flow in a predetermined direction, a first inlet port through which the first liquid flows into the liquid channel, a second inlet port through which the second liquid flows into the liquid channel, a pressure generation element which pressurizes the first liquid and an ejection orifice through which the second liquid is ejected by pressure received from the first liquid pressurized by the pressure generation element. A length of flow of the second liquid from the second inlet port to a position at which the second liquid is ejectable from the ejection orifice is shorter than a length of flow of the first liquid from the first inlet port to the position at which the second liquid is ejectable.

At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

A liquid ejection apparatus includes a first liquid storage container, a second liquid storage container, a first terminal member, a second terminal member, and a circuit board. The first liquid storage container stores liquid to be supplied to a liquid ejection head that ejects the liquid to an ejection medium. The second liquid storage container is arranged side by side in a first direction with respect to the first liquid storage container. The first terminal member comes into contact with the liquid stored within the first liquid storage container. The second terminal member comes into contact with liquid stored within the second liquid storage container. The circuit board comes into contact with the first terminal member and the second terminal member and relatively moves in the first direction with respect to the first liquid storage container.

A printing element includes a substrate, an intermediate layer, and a channel forming member layered in this order. The substrate has a common liquid chamber. The channel forming member has a second surface that is a surface facing the substrate via the intermediate layer, and a first surface that is an opposite surface to the second surface. The first surface is formed with a plurality of ejection ports that eject liquid from the common liquid chamber. The second surface is formed with a plurality of channels that allow each of the plurality of ejection ports and the common liquid chamber to communicate with each other, and a plurality of substantially parallel beam structures, the plurality of beam structures forming a slit portion therebetween.

A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

A liquid ejecting head includes a nozzle configured to eject ink, a filter chamber accommodating a filter, and a nozzle introduction port through which the ink flows out of the filter chamber. The filter chamber includes a first side and a second side that extend toward the nozzle introduction port in plan view in a direction perpendicular to the filter, and the nozzle introduction port is elongated along the first side in plan view in the direction perpendicular to the filter.

An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of first data lines, a second data line, a first memory element, and a second memory element. The first memory element is enabled in response to first data on the plurality of first data lines. The second memory element is enabled in response to second data on the second data line.

An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of first data lines, a second data line, a first memory element, and a second memory element. The first memory element is enabled in response to first data on the plurality of first data lines. The second memory element is enabled in response to second data on the second data line.