Provided is a manufacturing method of a liquid ejection head, and the manufacturing method includes steps of: providing an ejection orifice forming member on one surface of a wafer, in which an energy-generating element is provided on the one surface of the wafer; forming a recess on the other surface of the wafer; and dicing the wafer along a plurality of dicing lines. The plurality of dicing lines include a dicing line extending in one direction and a dicing line extending in a direction crossing the one direction, and the recess is formed on each of positions overlapping the dicing lines except for an intersection part where the dicing line extending in the one direction intersects the dicing line extending in the direction crossing the one direction.

In a substrate, a first flow channel opened in a first surface of a silicon base material having a crystal orientation of <110>, and a second flow channel opened in a second surface of the silicon base material opposite the first surface are formed to communicate with each other. The second flow channel has an opening width narrower than an opening width of the first flow channel, and a groove portion shallower than a depth of the second flow channel is formed close to the opening of the second flow channel in a region that is inside the opening of the first flow channel and outside the opening of the second flow channel in the second surface.

A liquid ejection head has at least a structure including an ejection orifice forming member having an ejection orifice for ejecting a liquid and a flow path communicating with the ejection orifice and a flow path forming substrate having a liquid introduction flow path communicating with the flow path and supplying the liquid, and includes: a first titanium oxide film with a pure water contact angle of 40° or less; and a second titanium oxide film with a pure water contact angle of 70° or more, wherein the first titanium oxide film covers the structure including inner walls of the flow path and the liquid introduction flow path and is exposed in the flow path and the liquid introduction flow path, and the second titanium oxide film has a portion covering the first titanium oxide film in a vicinity of an opening end.

In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

In an example, a printhead includes a memristor, in which the memristor may include a first electrode, a second electrode positioned in a crossed relationship with the first electrode to form a junction, and a switching element positioned at the junction between the first electrode and the second electrode, in which the switching layer includes a via formed in the switching element to reduce an area of the switching element.

A method for processing a silicon substrate includes forming a structure having a bottom surface and a depth of 200 μm or more or 300 μm or more from a first surface of a silicon substrate, forming a protective film on an inner wall of the structure, and performing plasma etching so as to selectively remove the protective film disposed on the bottom surface of the structure with respect to the protective film disposed on the substantially perpendicular side wall of the structure, wherein the plasma etching is performed under the condition in which plasma with a sheath length at least 10 times the depth when the depth is 200 μm or more, or at least 5 time the depth when the depth is 300 μm or more, is generated and a mean free path of ions generated in the plasma is longer than the sheath length.

An inkjet print head includes a print element substrate having an ejection port array of a plurality of ejection ports arranged and an ink supply port that supplies the ink to the ejection ports. A support member has a partition and an opening that supplies the ink to the ink supply port, in which the print element substrate and the support member are bonded by an adhesive. The partition includes a first portion and a second portion. The second portion is located between individual extension lines of two surfaces of the first portion. An end of the surface of the print element substrate facing the second portion is located between an extension line of the surface of the first portion and an extension line of a surface of the second portion.

Provided are a liquid ejection head, a liquid ejection apparatus, a method of manufacturing a liquid ejection head in which an element substrate and a support member differing in the pitches between liquid supply ports are fluidly connected by a channel member. To that end, supply paths in the element substrate and resin supply paths in the support member are connected by channels formed in the channel member and including expanding portions.

A printing element is used, which includes a substrate, an intermediate layer, and a channel forming member layered in this order. The substrate has a common liquid chamber. The channel forming member has a second surface that is a surface facing the substrate via the intermediate layer, and a first surface that is an opposite surface to the second surface. The first surface is formed with a plurality of ejection ports that eject liquid from the common liquid chamber. The second surface is formed with a plurality of channels that make each of the plurality of ejection ports and the common liquid chamber communicate with each other, and a plurality of substantially parallel beam structures, the plurality of beam structures forming a slit portion therebetween.

An element substrate of a liquid ejection head includes an ejection element for ejecting a liquid, a plurality of electrode pads for receiving power for causing the ejection element to eject the liquid, and a sensor for detecting that the liquid has invaded the vicinity of the plurality of electrode pads. The sensor has first wiring connected with one electrode pad of the plurality of electrode pads and second wiring connected with one electrode pad different from the electrode pad connected with the first wiring.