A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.

A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays, proximate to a number of fluid feed holes. A number of address lines are disposed proximate to a number of logic circuits on a low-voltage side of the fluid feed holes. An address decoder circuit is coupled to at least a portion of the address lines to select a fluidic actuator in a fluidic actuator array for firing. The address decoder circuit is customized to select a different address for each fluidic actuator in the fluidic actuator array. A logic circuit triggers a driver circuit located in a high-voltage side of the plurality of fluid feed holes opposite the low-voltage side, based, at least in part, on a bit value for the fluidic actuator array, the fluidic actuator selected by the address decoder circuit, and a firing signal.

An ink jet recording head includes an ejection chip in which a plurality of ejection orifices performing ejection are arranged; an external wiring board including an external wiring for applying an electric signal to the ejection chip from an outside; an electrical bonding portion where the external wiring of the external wiring board and the ejection chip are electrically bonded to each other; and a resin sealing portion that seals the electrical bonding portion, in which a corner of the external wiring board where a first end surface on an ejection chip side and a side end surface connected to the first end surface intersect has a chamfered portion which is chamfered, and the chamfered portion is positioned within a width of the ejection chip in an ejection orifice arrangement direction.

A liquid ejection head including a recording element substrate for ejecting liquid supported by a support member with an adhesive layer provided between the recording element substrate and the support member. A terminal is provided at an end portion of the recording element substrate with a sealing member covering the end portion of the recording element substrate including the terminal. The sealing member is in contact with a side surface of the end portion and an end surface of the adhesive layer. The adhesive layer comprises includes a first adhesive portion and a second adhesive portion positioned between the first adhesive portion and the sealing member. Rigidity of the second adhesive portion is less than the rigidity of the sealing member and less than the rigidity of the first adhesive portion.

A wafer structure is disclosed and includes a chip substrate and an inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of 12 inches. The inkjet chips are formed on the chip substrate by the semiconductor process and diced into the inkjet chip. The inkjet chip includes plural ink-drop generators generated by the semiconductor process on the chip substrate. Each of the plurality of ink-drop generators includes a nozzle. A diameter of the nozzle is in a range between 0.5 micrometers and 10 micrometers. A volume of an inkjet drop discharged from the nozzle is in a range between 1 femtoliter and 3 picoliters. The ink-drop generators form plural longitudinal axis array groups having a pitch and plural horizontal axis array groups having a central stepped pitch equal to or less than 1/600 inches.

A liquid ejection head includes a liquid ejection head substrate having ejection elements that generate liquid ejecting energy, an ejection port formation member having ejection ports, and liquid chambers between the liquid ejection head substrate and the ejection port formation member to house liquid to be ejected through the ejection ports. The liquid ejection head substrate includes a substrate, an insulating film stacked on the substrate to insulate the ejection elements, communication ports in the substrate and the insulating film to communicate with the liquid chambers, and a liquid-resistant insulating film adherent to the ejection port formation member. The liquid-resistant insulating film covers the insulating film at its ejection port formation member side and includes a first portion partially contacting the ejection port formation member and a second portion covering the inner surfaces of the communication ports in the insulating film, the first and second portions being continuous.

The present invention provides a fine bubble generating apparatus capable of generating fine bubbles efficiently. The present invention includes a fluid flow passage that includes a narrow portion in at least a part thereof, a heating part capable of heating a liquid flowing through the fluid flow passage, and a controlling unit that controls the heating part. The controlling unit controls the heating part to generate film boiling in the liquid to generate ultrafine bubbles.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process. At least one inkjet chip is directly formed on the chip substrate by the semiconductor process and diced into the at least one inkjet chip for inkjet printing. Each of the inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.

In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.