Patent classifications
B41J2/1606
NOZZLE PLATE, LIQUID DISCHARGE HEAD, LIQUID DISCHARGE DEVICE, AND APPARATUS FOR DISCHARGING LIQUID
A nozzle plate includes a nozzle base member including a plurality of nozzle holes formed therethrough, the plurality of nozzle holes serving as nozzles that discharge droplets; and a liquid-repellent film of a liquid-repellent material formed on a droplet discharge surface of the nozzle base member, the liquid-repellent material containing a liquid-repellent group. Each of the plurality of nozzle holes includes a straight hole part, the straight hole part extending from the droplet discharge surface of the nozzle base member and having a constant diameter in a thickness direction of the nozzle base member. The liquid-repellent group contained in the liquid-repellent material is attached to an inner nozzle wall of the straight hole part. When the nozzle hole is supplied with pure water, a meniscus of the pure water stays in the straight hole part.
MANUFACTURING METHOD FOR FILM AND MANUFACTURING METHOD FOR LIQUID EJECTION HEAD
Provided is a manufacturing method for a film containing a condensate of hydrolyzable silane compounds, the manufacturing method including: forming, on a base material, a layer containing a condensate of a hydrolyzable silane compound having an epoxy group and a hydrolyzable silane compound having a fluorine-containing group, and a solvent; and curing the layer, the solvent containing one of ethanol and methanol serving as a first alcohol component, and at least one kind of alcohol having a boiling point of from 90° C. to 200° C. serving as a second alcohol component, the solvent having a content of the second alcohol component of from 2.00 mass % to 60.00 mass %, the condensate having a degree of condensation of from 20% to 80%.
Liquid discharge head and method of manufacturing the same
A liquid discharge head provided with a member having discharge ports formed configured to discharge liquid thereon, wherein a discharge port surface of the member having discharge ports arrayed thereon includes fumed silica.
Liquid discharge head and method for producing liquid discharge head
A liquid discharge head is provided which has a substrate, a flow channel forming member provided on a substrate surface of the substrate and forming a flow channel of a liquid, and a discharge port forming member provided on the flow channel forming member and having a discharge port through which a liquid is discharged, wherein the discharge port forming member and the flow channel forming member are formed of materials different from each other, a thickness of the flow channel forming member is greater than a thickness of the discharge port forming member in a direction perpendicular to the substrate surface, the discharge port forming member is a cured product of a photosensitive resin composition, and the flow channel forming member contains at least one resin selected from the group consisting of a polyether amide resin, a polyether imide resin and a polyether amide-imide resin.
COATING APPARATUS AND IMAGE FORMING SYSTEM
A coating apparatus includes a coating member, a pressing member, an abutment member, and a restriction member. The coating member coats a sheet with a coating agent. The pressing member is movable and abuts on the coating member to form a nip. The abutment member abuts on the coating member at a position different from a position of the nip. The restriction member restricts movement of the coating member in a separation direction in which the coating member separates from the abutment member.
Method for the surface treatment of a semiconductor substrate
To apply an anti-wetting coating to a substrate of a semiconductor material, a method includes applying to a support a solution of a hydrocarbon comprising at least one unsaturated bond and, optionally, at least one hetero-atom for obtaining a layer of hydrocarbons. The method also includes treating at least one surface of the substrate of the semiconductor material with an acid. The layer of hydrocarbons is transferred from the support to the surface of the substrate of the semiconductor material. The layer of hydrocarbons is chemically coupled with the surface of the substrate of the semiconductor material.
LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME
A liquid ejection head has at least a structure including an ejection orifice forming member having an ejection orifice for ejecting a liquid and a flow path communicating with the ejection orifice and a flow path forming substrate having a liquid introduction flow path communicating with the flow path and supplying the liquid, and includes: a first titanium oxide film with a pure water contact angle of 40° or less; and a second titanium oxide film with a pure water contact angle of 70° or more, wherein the first titanium oxide film covers the structure including inner walls of the flow path and the liquid introduction flow path and is exposed in the flow path and the liquid introduction flow path, and the second titanium oxide film has a portion covering the first titanium oxide film in a vicinity of an opening end.
THIN FILM MANUFACTURING METHOD AND METHOD OF MANUFACTURING SUBSTRATE
A thin film manufacturing method of manufacturing a laminate of a thin film of a coating film member and a support member includes a coating step of coating the coating film member on a surface of the support member, a sandwiching step of sandwiching the coating film member between the support member and a peeled-off member, a film thinning step of reducing a thickness of the coating film member by applying an external force to the coating film member sandwiched between the support member and the peeled-off member in a state where the coating film member is softened, and a peeling step of peeling the peeled-off member off the coating film member after the film thinning step.
INK JET HEAD
An ink jet head includes a base, walls attached to the base and defining flow paths between the walls, the flow paths including first and second flow paths alternating with one another, a nozzle plate comprising openings, each of which communicates with one of the first flow paths, an ink supply unit fluidly coupled to the first flow paths, electrodes on side surfaces of the walls, first and second wirings, each extending along the base and each being individually connected to one of the electrodes, a plurality of first protective layers on the base, the first wiring extending between a first pair of the first protective layers and the second wiring extending between a second pair of the first protective layers, and a second protective layer comprising an electrically insulating layer covering the first protective layers and the first and second wirings.
FLUID EJECTION DEVICE WITH PARTICLE TOLERANT LAYER EXTENSION
In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate. A primer layer is formed over the thin-film layer, and a chamber layer is formed over the primer layer that defines a fluidic channel leading to a firing chamber. The fluid ejection device includes a slot that extends through the substrate and into the chamber layer through an ink feed hole in the thin-film layer. The fluid ejection device also includes a particle tolerant extension of the primer layer that protrudes into the slot. In some implementations, the particle tolerant primer layer extension extends across a full width of the slot.