Provided is a method for manufacturing a liquid ejection head including an ejection orifice for ejecting a liquid, a substrate and a flow path forming member that is joined to the substrate to form a liquid flow path communicating with the ejection orifice, the method including: (1) forming a resin layer having a flow path mold pattern, on the substrate; (2) adding a hydrophilizing material represented by Chemical Formula 1 to an entire surface layer of the resin layer; (3) forming a covering resin layer serving as the flow path forming member, on the resin layer and forming a compatible layer containing the resin layer, the covering resin layer and the hydrophilizing material, at an interface between the resin layer and the covering resin layer; (4) forming the ejection orifice by exposing the covering resin layer; and (5) forming a flow path by removing the resin layer.

There is provided a liquid jetting apparatus, including: a first pressure chamber and a second pressure chamber arranged in a first direction; a first insulating film covering the first and second pressure chambers; a first piezoelectric element arranged to face the first pressure chamber with the first insulating film being intervened therebetween; a second piezoelectric element arranged to face the second pressure chamber with the first insulating film being intervened therebetween; a trace arranged between the first and the second piezoelectric elements adjacent to each other in the first direction; and a second insulating film covering the trace. An end, in the first direction, of a part of the second insulating film covering the trace between the first piezoelectric element and the second piezoelectric element is positioned inside an end of a partition wall partitioning the first pressure chamber and the second pressure chamber.

A liquid ejecting head includes a nozzle plate, a multilayer substrate, and a pressure chamber substrate. The multilayer substrate includes a liquid chamber wall portion. The liquid chamber wall portion has a first wall surface facing a common liquid chamber. The multilayer substrate has a supply flow path which has an inlet portion coupled to the first wall surface and via which the common liquid chamber communicates with the first pressure chamber. When a direction from the common liquid chamber toward the first pressure chamber is defined as a first direction, and a direction intersecting the first direction is defined as a second direction, the supply flow path includes a first portion having a first width in the inlet portion and a second portion having a second width, in a first cross section along the first direction and the second direction. The first width is narrower than the second width.

A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.

A liquid discharge head includes a first member in which a plurality of channels is arrayed in a longitudinal direction of the first member, a second member bonded to the first member with adhesive, and three or more holes formed in a bonding region between the first member and the second member. An inner volume of each of the three or more holes is different, an area of each of the three or more holes is different, the three or more holes includes a hole having a smallest inner volume among the three or more holes, and the hole is filled with the adhesive in the bonding region.

In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.

In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.

A method of bonding printed circuit sheets to one another, each of the printed circuit sheets having a pattern of electrically conductive tracks, and the bonding being carried out by applying an adhesive to one of the sheets in a connection zone where the tracks on the one sheet are to be connected to corresponding tracks on the other sheet, superposing the sheets in the connection zone such that the adhesive is sandwiched between the sheets, and aligning the sheets such that corresponding tracks on the two sheets are aligned with one another. The method includes a preparatory step of forming extra tracks on the two sheets such that, in the alignment and compression steps, the extra tracks are brought into engagement with one another and constitute a barrier for the adhesive.

In an embodiment, a fluid flow structure includes a micro device embedded in a molding, a fluid feed hole formed through the micro device, and a transfer molded fluid channel in the molding that fluidically couples the fluid feed hole with the channel.

An ejection material ejecting device includes: an ejection unit including an ejection opening configured to eject an ejection material; an electric substrate configured to control ejection of the ejection material; a first flexible cable connected to the ejection unit; a second flexible cable connected to the electric substrate; and a joint at which the first flexible cable and the second flexible cable are joined by an anisotropic conductive film, wherein the joint is covered with a sealant resistant to the ejection material.