A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays, proximate to a number of fluid feed holes. A number of address lines are disposed proximate to a number of logic circuits on a low-voltage side of the fluid feed holes. An address decoder circuit is coupled to at least a portion of the address lines to select a fluidic actuator in a fluidic actuator array for firing. The address decoder circuit is customized to select a different address for each fluidic actuator in the fluidic actuator array. A logic circuit triggers a driver circuit located in a high-voltage side of the plurality of fluid feed holes opposite the low-voltage side, based, at least in part, on a bit value for the fluidic actuator array, the fluidic actuator selected by the address decoder circuit, and a firing signal.

An electronic device includes a first member configured by single crystal silicon, in which the first member includes a first surface configured by a {110} plane in the single crystal silicon, a second surface of an opposite side from the first surface, a through-hole which spans from the first surface to the second surface, a first recessed portion which is opened in the first surface and includes a wall surface configured by a {111} plane, the wall surface being inclined by an angle greater than 0° and less than 90° with respect to the first surface in the single crystal silicon, and a second recessed portion opened in the second surface, and a level difference surface having a different inclination to that of the {111} plane is provided in the middle of the wall surface of the first recessed portion in a depth direction.

An inkjet printing head includes a piezoelectric element that includes a lower electrode disposed on a movable film, a piezoelectric film formed on the lower electrode, and an upper electrode formed on the piezoelectric film, a hydrogen barrier film that covers, in a front surface of the piezoelectric element, at least, entireties of side surfaces of the upper electrode, the piezoelectric film, and the lower electrode, at least a part of an upper surface of the upper electrode, and an upper surface of the lower electrode, a first interlayer insulating film formed on a front surface other than an end surface of the hydrogen barrier film, a second interlayer insulating film formed so as to cover the end surface of the hydrogen barrier film and the first interlayer insulating film, and a wiring that is formed on the second interlayer insulating film and that is connected to the piezoelectric element.

In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.

A liquid discharge head includes an actuator substrate including a pressure chamber communicating with a nozzle from which a liquid is to be discharged and a pressure generator to apply pressure to the liquid in the pressure chamber, a frame bonded to the actuator substrate and having a through hole filled with a resin, and a temperature detector inserted into the through hole and attached to the actuator substrate with the resin to detect a temperature of the actuator substrate. The through hole has a first face facing the actuator substrate and a second face opposite to the first face and facing an opening of the frame. The resin in the through hole includes an uncured portion uncured and facing the first face and a cured portion cured and facing the second face. The uncured portion contacts the actuator substrate and is between the cured portion and the actuator substrate.

The present invention relates to an electrical component for a microelectromechanical systems (MEMS) device, in particular, but not limited to, an electromechanical actuator. In one aspect, the present invention provides an electrical component for a microelectromechanical systems device comprising: i) a substrate layer; ii) a plurality of adjacent electrical elements arranged over the substrate layer, where each electrical element is separated from a neighbouring electrical element by an intermediate region, each of the plurality of electrical elements comprising: a) a ceramic member; and b) first and second electrodes disposed adjacent the ceramic member such that a potential difference may be established between the first and second electrodes and through the ceramic member during operation; iii) a passivation layer, or a laminate of multiple passivation layers, at least partially overlying each of the plurality of electrical elements so as to provide electrical passivation between the first and second electrodes of each of the plurality of electrical elements; wherein the passivation layer, or at least an innermost layer of the laminate of passivation layers which is disposed adjacent each underlying electrical element, is discontinuous over at least one intermediate region between neighbouring electrical elements of the electrical component.

Examples include a fluid ejection die embedded in a molded panel. The fluid ejection die comprises a substrate, and the substrate includes an army of nozzles extending therethrough. The substrate has a first surface in which nozzle orifices are formed and a second surface, opposite the first surface, in which nozzle inlet openings are formed. The fluid ejection die is embedded in the molded panel such that the first surface of the substrate is approximately planar with a top surface of the molded panel. The molded panel has a fluid channel formed therethrough in fluid communication with the nozzle inlet openings of the array of nozzles.

An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.

Provided is a liquid ejection head comprising a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent ones of the device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

A liquid discharge head includes a first member in which a plurality of channels is arrayed in a longitudinal direction of the first member, a second member bonded to the first member with adhesive, and three or more holes formed in a bonding region between the first member and the second member. An inner volume of each of the three or more holes is different, an area of each of the three or more holes is different, the three or more holes includes a hole having a smallest inner volume among the three or more holes, and the hole is filled with the adhesive in the bonding region.