A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays, proximate to a number of fluid feed holes. A number of address lines are disposed proximate to a number of logic circuits on a low-voltage side of the fluid feed holes. An address decoder circuit is coupled to at least a portion of the address lines to select a fluidic actuator in a fluidic actuator array for firing. The address decoder circuit is customized to select a different address for each fluidic actuator in the fluidic actuator array. A logic circuit triggers a driver circuit located in a high-voltage side of the plurality of fluid feed holes opposite the low-voltage side, based, at least in part, on a bit value for the fluidic actuator array, the fluidic actuator selected by the address decoder circuit, and a firing signal.

The present invention relates to an electrical component for a microelectromechanical systems (MEMS) device, in particular, but not limited to, an electromechanical actuator. In one aspect, the present invention provides an electrical component for a microelectromechanical systems device comprising: i) a substrate layer; ii) a plurality of adjacent electrical elements arranged over the substrate layer, where each electrical element is separated from a neighbouring electrical element by an intermediate region, each of the plurality of electrical elements comprising: a) a ceramic member; and b) first and second electrodes disposed adjacent the ceramic member such that a potential difference may be established between the first and second electrodes and through the ceramic member during operation; iii) a passivation layer, or a laminate of multiple passivation layers, at least partially overlying each of the plurality of electrical elements so as to provide electrical passivation between the first and second electrodes of each of the plurality of electrical elements; wherein the passivation layer, or at least an innermost layer of the laminate of passivation layers which is disposed adjacent each underlying electrical element, is discontinuous over at least one intermediate region between neighbouring electrical elements of the electrical component.

The present invention relates to an electrical component for a microelectromechanical systems (MEMS) device, in particular, but not limited to, an electromechanical actuator. In one aspect, the present invention provides an insulated electrical component for a microelectromechanical systems device comprising: i) a substrate layer comprising first and second sides spaced apart in a thickness direction; ii) one or more electrical elements arranged over the first side of the substrate layer, wherein each of the one or more electrical elements comprises: a) a ceramic member; and b) first and second electrodes disposed adjacent the ceramic member such that a potential difference may be established between the first and second electrodes and through the ceramic member during operation; iii) a continuous insulating layer, or laminate of insulating layers, arranged to overlie each of the one or more electrical elements arranged on the first side of the substrate layer; and iv) a passivation layer, or laminate of multiple passivation layers, disposed adjacent to, and at least partially overlying, each of the one or more electrical elements so as to provide electrical passivation between the first and second electrodes of each of the one or more electrical elements; wherein: a) the passivation layer, or at least an innermost layer of the laminate of multiple passivation layers which is disposed adjacent each of the one or more underlying electrical elements, is discontinuous; and/or b) the laminate of multiple passivation layers is recessed at a side which faces away from each of the underlying electrical elements, wherein a recess is provided in a region overlying each of the one or more electrical elements, such that the laminate of passivation layers is thinner in a thickness direction across the recess compared to other non-recessed regions of the laminate of passivation layers.

At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

A coating head includes: a plurality of nozzles; a plurality of pressure chambers communicating with the plurality of nozzles; an ink flow path communicating with the plurality of pressure chambers; and a coating layer that is at least partially provided on liquid contact surfaces of the plurality of nozzles, the plurality of pressure chambers, and the ink flow path.

Disclosed are an inkjet printhead and a method of manufacturing the same, the inkjet printhead including: a first layer including an inlet formed to penetrate a substrate and introduce ink therein, and a plurality of membranes; a second layer disposed beneath the first layer, and including a manifold formed to penetrate a substrate and communicate with the inlet or recessed on a top of the substrate, and a plurality of nozzle channels formed to penetrate the substrate below the membrane and allow the ink transferred from the manifold to flow therein; a third layer disposed beneath the second layer, and including a plurality of nozzles formed in a substrate and communicating the plurality of nozzle channels; a piezoelectric actuator formed on the first layer formed with the membrane, and including a lower first electrode, a piezoelectric body on the first electrode, and a second electrode on the piezoelectric body; a first voltage controller configured to oscillate the membrane by applying a pulse voltage to the first electrode and the second electrode; a third electrode disposed beneath the third layer, formed around each nozzle, and surrounded with an insulator; and a second voltage controller configured to discharge droplets of the ink based on induced electric force by applying voltage to the third electrode.

A method of constructing a micro-valve includes providing a substrate for an actuating beam of the micro-valve, the substrate including a first surface and a second surface. The method also includes forming a plurality of constituent layers on the first surface of the actuating beam, including a layer of piezoelectric material. The method also includes removing a portion of the substrate from at least one of the first surface or the second surface to define a cantilevered portion of the actuating beam. The method also includes providing an orifice plate including an orifice. The method also includes providing a valve seat on a surface of the orifice plate, the valve seat having an opening aligned with the orifice. The method also includes attaching the surface of the orifice plate to the second surface via an adhesive such that an overlapping portion of the cantilevered portion overlaps the orifice.

A liquid ejecting head includes a line of first pressure chambers, a line of second pressure chambers, a line of nozzles including nozzles arranged in a first direction, first piezoelectric bodies, first individual electrodes, a first common electrode, second piezoelectric bodies, second individual electrodes, a second common electrode, a wiring member, a first individual line that electrically couples the first individual electrode to the wiring member, a first common line that electrically couples the first common electrode to the wiring member, a second individual line that electrically couples the second individual electrode to the wiring member, and a second common line that electrically couples the second common electrode to the wiring member. The wiring member is electrically coupled to the first common line at a position shifted to one side in the first direction relative to a center in the first direction of the lines of first and second pressure chambers, and the wiring member is electrically coupled to the second common line at a position shifted to another side in the first direction relative to the center in the first direction of the lines of first and second pressure chambers.

A piezoelectric actuator includes a substrate, and a first piezoelectric device and a second piezoelectric device formed at the substrate. The first piezoelectric device includes a first lower electrode, a first piezoelectric body, and a first upper electrode. The second piezoelectric device includes a second lower electrode, a second piezoelectric body, and a second upper electrode. A side surface of the first lower electrode is not covered with the first piezoelectric body, and a side surface of the second lower electrode is not covered with the second piezoelectric body. The piezoelectric actuator further includes a common electrode formed at the substrate and coupled to the first upper electrode and the second upper electrode, and an insulating layer located between the common electrode and the first lower electrode and between the common electrode and the second lower electrode.

A method of bonding printed circuit sheets to one another, each of the printed circuit sheets having a pattern of electrically conductive tracks, and the bonding being carried out by applying an adhesive to one of the sheets in a connection zone where the tracks on the one sheet are to be connected to corresponding tracks on the other sheet, superposing the sheets in the connection zone such that the adhesive is sandwiched between the sheets, and aligning the sheets such that corresponding tracks on the two sheets are aligned with one another. The method includes a preparatory step of forming extra tracks on the two sheets such that, in the alignment and compression steps, the extra tracks are brought into engagement with one another and constitute a barrier for the adhesive.