There are provided a head chip and a method of manufacturing the same, a liquid jet head, and a liquid jet recording device each capable of suppressing a stray capacitance to improve the image quality. The head chip according to an embodiment of the present disclosure is a head chip having an actuator plate adapted to apply pressure to liquid to jet the liquid. The actuator plate includes an obverse surface and a reverse surface, a channel extending in a predetermined direction and having a first opening provided to the obverse surface and a second opening which is provided to the reverse surface and is shorter in length in the predetermined direction than the first opening, and an electrode having an obverse surface side part disposed on a sidewall of the channel on the first opening side, and a reverse surface side part which is disposed on the sidewall closer to the second opening than the obverse surface side part and is one of equal to and larger than the obverse surface side part in size in the predetermined direction.

A bonding structure includes a first part including a first bonding surface and a second part including a second bonding surface to be bonded to the first bonding surface of the first part with a first adhesive and a second adhesive different from the first adhesive. At least one of the first bonding surface and the second bonding surface includes a first region on which the first adhesive is applied, a second region on which the second adhesive is applied, and a third region disposed between the first region and the second region, the third region having a water repellency higher than a water repellency of each of the first region and the second region.

A method for forming a fluid flow structure may include positioning rows of micro devices in a mold, wherein each of the micro devices comprising a chamber layer in which an ejection chamber is formed and an orifice layer over the chamber layer in which an orifice is formed. The method may further include molding an amorphous body to encapsulate the rows of the micro devices such that the amorphous body forms fluid channels such that each of the rows is fluidically coupled to a different one of the fluid channels.

Provided are a liquid ejection head capable of preventing deformation and breakage of a filter and a method of manufacturing the liquid ejection head. The liquid ejection head comprises: a substrate comprising a supply port through which to supply a liquid and an element configured to produce energy for ejecting the liquid; a resin layer comprising an ejection port through which the liquid is ejectable with the energy produced by the element, and a flow channel connecting the supply port and the ejection port; a filter disposed between the supply port and the flow channel; and a support portion supporting a surface of the filter on the supply port side and a surface of the filter on the flow channel side.

The present application relates to a method of manufacturing an ink-jet printhead comprising: providing a silicon substrate (10) including active ejecting elements (11); providing a hydraulic structure layer (20) for defining hydraulic circuits configured to enable a guided flow of ink; providing a silicon orifice plate (30) having a plurality of nozzles (31) for ejection of the ink; assembling the silicon substrate (10) with the hydraulic structure layer (20) and the silicon orifice plate (30); wherein providing the silicon orifice plate (30) comprises: providing a silicon wafer (40) having a planar extension delimited by a first surface (41) and a second surface (42) on opposite sides of the silicon wafer (40); performing a thinning step at the second surface (42) so as to remove from the second surface (42) a central portion (43) having a preset height (H), the silicon wafer (40) being formed, following the thinning step, by a base portion (44) having a planar extension and a peripheral portion (45) extending from the base portion (44), transversally with respect to the planar extension of the base portion (44); and forming in the silicon wafer (40) a plurality of through holes, each defining a respective nozzle (31) for ejection of the ink. The method according to the present invention is characterized in that the silicon wafer (40) is a silicon-on-insulator wafer, wherein the silicon-on-insulator wafer comprises a silicon device layer (38) adjacent to the first surface (41), a silicon handle layer (37) adjacent to the second surface (42) and an insulator layer (39) in-between.

A fluid dispenser may include fluid dispensing dies in an end-to-end staggered arrangement, a non-fluid dispensing die electronic device and a molding covering the fluid dispensing dies and the electronic device.

A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.

An inkjet head manufacturing method for an inkjet head that includes a head chip including; a nozzle ejecting ink; and a flow path substrate including an ink flow path which communicates with the nozzle and through which the ink flows, the method including; composite substrate manufacturing that is manufacturing a composite substrate including a plurality of regions which forms flow path substrates by being split; first protective film forming that is forming a first protective film on a surface of the composite substrate and an inner wall surface of the ink flow path; splitting that is splitting the composite substrate into the flow path substrates; and second protective film forming that is forming a second protective film on at least an exposed face in a split face of the flow path substrate generated in the splitting, the exposed face being exposed in a surface of the head chip.

There is provided a method of manufacturing a liquid discharge head, including: forming a stacked body having a structure and a protective member stacked on the structure, providing a first mask on an upper surface of the protective member to cover a through hole; forming a protective film by an atomic layer deposition on a surface defining a liquid flow channel of the stacked body provided with the first mask; and removing the first mask after forming the protective film.

A method of poling piezoelectric elements of an actuator comprises applying an electric pulse heating waveform to the piezoelectric element(s) in order to increase the temperature thereof to a poling temperature (S202), applying an electric field poling waveform to the piezoelectric element(s) for a poling time period (S203), and apply an electric field holding poling waveform to the piezoelectric element(s) to maintain poling whilst the temperature of the actuator decreases (S204).