In a substrate of a liquid ejection head, there are formed a first through-hole which constitutes a liquid supply path, and a second through-hole in which a through-hole electrode electrically connected to a wiring layer is formed on the inner surface. The first through-hole has a first hole having a first opening and a second hole having a second opening, and the second through-hole has a third hole having a third opening and a fourth hole having a fourth opening. When the minimum width of the first opening is represented by D1, the minimum width of the second opening is represented by D2, the minimum width of the third opening is represented by D3, and the minimum width of the fourth opening is represented by D4, the first to fourth openings satisfy a relation of D1>D3>D4>D2.

Reliability of an electric wiring substrate against a change in temperature in a liquid ejection head can be achieved. The liquid ejection head has an element substrate and an electric wiring substrate. Upon manufacturing the liquid ejection head, a second portion of the electric wiring substrate overlaps a second support surface through an adhesive so that the electric wiring substrate straddles a groove between a first support surface to which a first portion, which is one end of an electric wiring substrate, is bonded and a second support surface, and a second portion and a third portion are pressed by a pressing tool so that the third portion of the electric wiring substrate, which is a portion between the first portion and the second portion, is pushed into the groove, and the second portion is bonded to the second support surface.

A liquid ejecting head includes first nozzles configured to eject a liquid in an ejecting direction, a first nozzle forming surface in which openings of the first nozzles are formed, a first surface being adjacent to the first nozzle forming surface when viewed in an opposite direction to the ejecting direction and provided in the ejecting direction relative to the first nozzle forming surface, and a first film member having water repellency on a surface directed to the ejecting direction and being detachably provided to the first surface in such a way as to expose the first nozzle forming surface in the ejecting direction.

A manufacturing method of narrow type inkjet print head chip is provided and includes steps of: (S1) providing a silicon substrate; (S2) arranging and disposing an active component layer by utilizing a first type photomask on at least two high-precision regions of each of a plurality of inkjet print head chip regions on the silicon substrate; (S3) arranging and disposing a passive component layer by utilizing a second type photomask on the active component layer; and (S4) cutting the silicon substrate according to the inkjet print head chip regions so as to form the plurality of narrow type inkjet print head chips.

A manufacturing method for a structure includes preparing a dry film supported on one surface of a support; bonding the dry film to a substrate so that the dry film and the substrate are in contact with each other; performing first exposure of the dry film bonded to the substrate via the support; removing the support after the first exposure; performing second exposure of the dry film after the support is removed via a photomask; and developing the dry film after the first exposure and the second exposure.

Systems and methods are provided for cover plates for printheads. One embodiment is an apparatus that includes a cover plate for a printhead. The cover plate includes multiple layers of electrically conductive material, a layer of nonconductive ferrite that is sandwiched between the multiple layers, and at least one connector that penetrates through the multiple layers and the layer of nonconductive ferrite to form a conductive pathway for electric current between the multiple layers through the layer of nonconductive ferrite. The cover plate also includes at least one opening that penetrates through the multiple layers and the layer of nonconductive ferrite, and that is configured to align with nozzles of the printhead.

In a liquid ejection head and a method of manufacturing the ejection head, an ejection port board is provided with an expanded portion that communicates with a supply port and has an open end that is larger than an opening of the supply port.

Systems, methods, and software for fabricating a printhead. In one embodiment, a method comprises punching first nozzle holes in a first nozzle plate with a first punch, where each of the first nozzle holes includes a first converging section. The method further comprises punching second nozzle holes in a second nozzle plate with a second punch, where each of the second nozzle holes includes a second converging section. The method further comprises bonding the first nozzle plate and the second nozzle plate to form a nozzle plate stack, where the first nozzle holes and the second nozzle holes define nozzles of the printhead.

In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.

A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.