Patent classifications
B41J2/162
Method for manufacturing molded member and liquid ejecting head, liquid ejecting head, and mold
There is provided a method for manufacturing a molded member having a hollow part. The method comprises a step for molding the hollow part by extracting a first piece, a second piece, a third piece and a fourth piece of a mold in four different directions. The second piece has an elongated shape in its extracting direction, the second piece and the fourth piece have extracting directions substantially opposed to each other, and at the molding, each of the first piece, the second piece, the third piece and the fourth piece abuts on at least one of the first piece, the second piece, the third piece and the fourth piece.
Preparing a printer cartridge for transport
A method of preparing a printer cartridge for transport may comprise applying a volume of immiscible fluid to a nozzle bore of a printhead. A printer cartridge may comprise a volume of immiscible fluid deposited into a nozzle bore of a nozzle of the printhead and a layer of immiscible fluid applied over the nozzle bore opening. A printhead die may comprise a volume of immiscible fluid deposited into a nozzle bore of the die and a layer of immiscible fluid applied over the nozzle bore opening.
FLUID EJECTION FACE SELECTIVE COATING
A fluid ejection head may include a fluid ejection face through which fluid ejection orifices extend. A coating is selectively coated over first portions of the fluid ejection face. Second portions of the fluid ejection face omit the coating.
Liquid discharge head and method of producing liquid discharge head
There is provided a liquid discharge head including a substrate having a pressure chamber, an actuator, and a channel member. The actuator has a first film arranged on the substrate and a second film arranged on a surface of the first film. The substrate and the channel member are attached to each other with an adhesive. A first through hole is formed in a part of the first film, and a second through hole is formed in a part of the second film. An edge of the first through hole is positioned further inward of the second through hole than an edge of the second through hole. The adhesive is applied to a part of the surface of the first film overlapping with the second through hole, so as to cover a boundary part between the first and second films.
Liquid ejecting apparatus and liquid ejecting unit
A liquid ejecting unit includes: a liquid ejecting head configured to eject a liquid; a holding portion holding the liquid ejecting head; a coupling member; and a first fixing member fixing the liquid ejecting head to the holding portion, in which the coupling member is provided with a first coupling portion and a first through-hole, the liquid ejecting head is provided with a second coupling portion that is configured to be coupled to the first coupling portion, and the first fixing member passes through the first through-hole in a state in which the first coupling portion and the second coupling portion are coupled to each other.
DEVICE AND METHOD FOR COATING SURFACES
The present invention relates to devices and methods for coating surfaces including surfaces of medical devices, in particular the coating of microprojections on microprojection arrays. The present invention also relates to print head devices and their manufacture and to methods of using the print head devices for manufacturing articles such as microprojection arrays as well as to coating the surfaces of microprojection arrays. The present invention also relates to high throughput printing devices that utilize the print heads of the present invention.
LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD
A liquid discharge head includes a channel unit. The channel unit is formed therein with: a plurality of individual channels aligning in a first direction, a common channel extending in the first direction, a supply hole in communication with the common channel, and a damper chamber provided in a position overlapping with the supply hole in a second direction orthogonal to the first direction. The channel unit includes a first plate having a first surface where a recess is formed to constitute the damper chamber, and a second plate having a second surface attached to the first surface via an adhesive. A protrusion is provided on a bottom of such a first part of the recess as overlaps with the supply hole in the second direction.
METHOD FOR MANUFACTURING LIQUID EJECTION HEAD AND LIQUID EJECTION HEAD
A method for manufacturing a liquid ejection head including a substrate that includes a liquid supply port on a first surface, a liquid ejection port on a second surface, and a flow path that connects the supply port and the ejection port to each other such that the supply port and the ejection port do not communicate with each other in a direction intersecting with the first surface and the second surface, comprises: a liquid repellent film forming step of forming a liquid repellent film on the substrate; a masking step of covering a surface of the liquid repellent film on the second surface; and a plasma treatment step of generating plasma from the first surface toward the second surface to remove the liquid repellent film, wherein a portion of the liquid repellent film which remains inside the ejection port after the plasma treatment step is hydrophilized.
FLUIDIC DEVICE WITH NOZZLE LAYER CONDUCTORS
One example provides a fluidic device including a substrate, a nozzle layer disposed on the substrate, the nozzle layer having an upper surface opposite the substrate including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A number of conductive traces are disposed in direct contact with the nozzle layer to provide electrical pathways above the substrate.
Method for producing substrate, substrate, and liquid ejection head
A method for producing a substrate that includes a protective layer made from a metal oxide protecting silicon against corrosion and an organic resin layer on a substrate surface of a silicon substrate includes the following steps in this order: step A of forming the protective layer on the substrate surface; step B of removing the protective layer from the substrate surface in a region Z1 that is a part of the region in which the protective layer has been formed; and step C of providing an organic resin layer on the substrate surface in a region Z2 including the region Z1.