The method of manufacturing a liquid ejection head according to the invention includes a bonding step, that is, a step of placing a plurality of element substrates on an adhesive layer formed on a bonding surface and heating the adhesive layer to bond the element substrates to a base material. The bonding step is started from one or two of a plurality of bonding regions located at the center portion of the base material in an arrangement direction of the element substrates and then performed toward the bonding regions located at both end portions of the base material.

A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die.

A liquid ejection head includes an ejection orifice forming surface provided with an ejection orifice from which a liquid is ejected. The ejection orifice forming surface includes a first region in a vicinity of the ejection orifice, a second region that is further spaced apart from the ejection orifice than the first region and protrudes from the first region in a liquid ejection direction and a third region that connects the first region and the second region. When a contact angle of pure water in the first region is a first contact angle θ1 and a contact angle of pure water in the third region is a third contact angle θ3, θ1 is larger than θ3 by 10 degrees or more.

A coating head includes: a plurality of nozzles; a plurality of pressure chambers communicating with the plurality of nozzles; an ink flow path communicating with the plurality of pressure chambers; and a coating layer that is at least partially provided on liquid contact surfaces of the plurality of nozzles, the plurality of pressure chambers, and the ink flow path.

There are provided an inkjet head, an inkjet image forming apparatus, a nozzle plate manufacturing method, and an inkjet head manufacturing method capable of improving durability against wiping on an ink discharge surface. The inkjet head includes a nozzle substrate including nozzle holes from which ink is discharged. The nozzle substrate has an irregularity structure formed on an ink discharge surface such that neither ink particles contained in the ink nor a wiping member that wipes the ink discharge surface get caught by the irregularity structure.

In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.

An ejection head chip and method for a fluid ejection device and a method for reducing a silicon shelf width between a fluid supply via and a fluid ejector stack. The ejection head chip includes a silicon substrate and a fluid ejector stack deposited on the silicon substrate, wherein at least one metal layer of the fluid ejector stack is isolated from a fluid supply via etched in the ejection head chip by an encapsulating material.

A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

Provided is an inkjet head containing: a substrate having a nozzle hole, and a nozzle plate having a liquid repellent layer on an outermost surface of the substrate on an ink discharge surface side, wherein the nozzle plate has a conductive layer between the substrate and the liquid repellent layer.

A nozzle plate defines at least one nozzle connected to the nozzle plate at a base, wherein the at least one nozzle has a height and a top having an inner width and an outer width, wherein a ratio of the height to the inner width is greater than 5, and wherein the nozzle plate comprises a borosilicate glass. The nozzle plate is formed via a method including providing a silicon wafer having a surface; providing a borosilicate glass wafer having a surface; etching the surface of the silicon wafer to form a plurality of trenches in the surface; anodically bonding the etched surface of the silicon wafer to the surface of the borosilicate glass wafer to form a two layer composite; heating the two layer composite at a temperature of at least about 750° C.; and releasing the silicon wafer from the borosilicate glass to form the nozzle plate.