A thermal print head includes a base member, an electrode layer formed on the base member, and a resistor layer formed on the base member. The electrode layer includes a common electrode and individual electrodes. The resistor layer includes heating units aligned in a main scanning direction. The heating units each include a first heating element and a second heating element spaced apart from each other. The first heating element and the second heating element are electrically connected to the common electrode and one of the individual electrodes to which the first heating element is electrically connected.

A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

A thermal head includes a substrate; a plurality of heating elements; a plurality of electrodes; a first covering layer; and a covering member. The thermal head further includes a second covering layer extending from the first covering layer onto the end surface. The housing is in contact with the second covering layer.

The present invention provides a thermal print head and a thermal printer that can deliver improved printing quality. The thermal print head includes a main substrate with a main surface, heating elements arranged along a main scanning direction, and a protection layer that covers the heating elements. A belt-shaped heating glaze layer is between the main surface and the heating elements, extends along the main scanning direction, and bulges towards the direction where the main surface faces. The surface shape of the protection layer has an equivalent radius of curvature Re between 6200 m and 15000 m. The equivalent radius of curvature Re is calculated by Hq and Wq. Hq is of the maximum height Hm of the bulging portion of the protection layer including the heating glaze layer. Wq is the width of the bulging portion along a sub-scanning direction, measured at a height equal to Hm minus Hq.

A thermal head capable of reducing a possibility of separation of a connector is provided. A thermal head includes a substrate; a plurality of heat generating portions disposed on the substrate; a plurality of electrodes which are disposed on the substrate and are electrically connected to the plurality of heat generating portions, respectively; and a connector including a plurality of connector pins which pinch the substrate and are electrically connected to the plurality of electrodes, respectively, and a housing for containing the plurality of connector pins. The housing is disposed adjacent to the substrate in a sub-scanning direction, and the housing includes a support portion disposed under the substrate. This can reduce a possibility of separation of the connector.

A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

The present invention provides a thermal print head and a thermal printer that can deliver improved printing quality. The thermal print head includes a main substrate with a main surface, heating elements arranged along a main scanning direction, and a protection layer that covers the heating elements. A belt-shaped heating glaze layer is between the main surface and the heating elements, extends along the main scanning direction, and bulges towards the direction where the main surface faces. The surface shape of the protection layer has an equivalent radius of curvature Re between 6200 m and 15000 m. The equivalent radius of curvature Re is calculated by Hq and Wq. Hq is of the maximum height Hm of the bulging portion of the protection layer including the heating glaze layer. Wq is the width of the bulging portion along a sub-scanning direction, measured at a height equal to Hm minus Hq.

A thermal head includes: a substrate; a thermal storage layer disposed on the substrate and having a ridge portion; heat generating portions disposed on the ridge portion; and electrodes which are disposed on the substrate. At least one of the electrodes has a first corner portion at which a side surface and an upper surface intersect, more upstream in the conveyance direction of the recording medium than the top portion of the ridge portion. In a cross section of the thermal head, an inclination angle of an imaginary line which connects an intersection point of an imaginary line which hangs downward from the top portion (13b1) of the ridge portion and the substrate, with the first corner portion, is 75 or less from the substrate. Thus, printing residue is less likely to adhere to the thermal head.

A thermal print head includes a base member, an electrode layer formed on the base member, and a resistor layer formed on the base member. The electrode layer includes a common electrode and individual electrodes. The resistor layer includes heating units aligned in a main scanning direction. The heating units each include a first heating element and a second heating element spaced apart from each other. The first heating element and the second heating element are electrically connected to the common electrode and one of the individual electrodes to which the first heating element is electrically connected.