A thermal head according to the present disclosure includes: a substrate; a first electrode; a heat generating section; a second electrode; a resin layer; and a protective layer. The first electrode is located on the substrate. The heat generating section is located on the substrate. The second electrode is located on the substrate so as to be electrically connected to the heat generating section and the first electrode. The resin layer is located on the first electrode. The protective layer is located on the resin layer. Moreover, the resin layer includes a first portion inserted in the first electrode.

A thermal head includes a substrate, a heat storage layer disposed on the substrate and including a bulging portion, heating elements disposed on the bulging portion, a protective layer disposed on the heating elements, and a covering layer disposed on the protective layer. The covering layer includes a first portion disposed apart from the bulging portion, and a second portion disposed between the bulging portion and the first portion. The height of the second portion from the substrate is smaller than the height of the first portion from the substrate.

The present disclosure provides a thermal print head. The thermal print head includes: a substrate; a glaze layer, disposed on the substrate; and a wiring layer, disposed on the glaze layer. The wiring layer includes a plurality of bonding pads. The plurality of bonding pads are divided into a plurality of groups. Each of the plurality of groups includes a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad. A first group of the plurality of groups is adjacent to a second group of the plurality of groups along a first direction. The second bonding pad of the first group is located between a center of the first bonding pad of the first group and a center of the third bonding pad of the first group along the first direction.

A thermal print head includes: a substrate having an obverse surface; a plurality of heat generators arranged on the substrate in a main scanning direction; and a wiring layer provided on the substrate and constituting an energization path to the heat generators. The substrate has a protrusion protruding from the obverse surface and extending in the main scanning direction. The protrusion has a top portion having the largest distance from the obverse surface, and an inclined portion connected to the top portion in a sub-scanning direction. The inclined portion is inclined relative to the obverse surface at a predetermined angle. Each of the plurality of heat generators extends across a boundary between the top portion and the inclined portion. Each of the heat generators is formed on at least a part of the top portion and at least a part of the inclined portion in the sub-scanning direction.

A thermal head according to the disclosure includes: a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate so as to be electrically connected to the heat generating section; a protective layer which covers the heat generating section and part of the electrode, the protective layer being formed of an inorganic material; a cover layer disposed on the protective layer, the cover layer being formed of a resin material; and inorganic particles disposed on a surface of the protective layer so as to protrude from the surface. Moreover, the inorganic particles each comprise a first portion located inside the cover layer and a second portion located inside the protective layer.

A thermal head includes a substrate; a plurality of heat generating portions; a common electrode disposed on the substrate and electrically connected to the plurality of heat generating portions; a plurality of individual electrodes disposed on the substrate and each electrically connected to a corresponding one of the plurality of heat generating portions; a first insulation layer disposed on the heat generating portions, a part of the common electrode, and a part of the individual electrodes; a second insulation layer located adjacent to the first insulation layer and disposed on a part of the individual electrodes; and a static removing layer disposed on the first insulation layer and grounded. The static removing layer includes a first portion disposed on an upper surface of the first insulation layer and a second portion electrically connected to the first portion and disposed on an upper surface of the second insulation layer.

A thermal head includes: a head base body including a substrate and a plurality of heat generating sections disposed on the substrate; connection portions which are electrically connected to the head base; a connection member which is electrically connected to the connection portions; and a first cover member which covers the connection portions, the first cover member including a plurality of protruding portions provided on an upper surface of the first cover member at predetermined intervals in a main scanning direction.

A thermal head includes: a substrate; a heat generating section which is disposed on the substrate; a plurality of driving ICs including first and second driving ICs which are disposed on the substrate and electrically coupled to the heat generating section; and a cover member covering the first and second driving ICs. The cover member is disposed in an inter-driving IC region between the first driving IC and the second driving IC and above and below the inter-driving IC region, and includes a first void.

A thermal print head includes a substrate, a resistor layer and a wiring layer. The substrate is made of a single crystal semiconductor and includes an obverse surface facing in one sense of a thickness direction. The resistive layer is supported by the substrate and includes a plurality of heat generating parts arranged side by side in a main scanning direction. The wiring layer is supported by the substrate and forms a conductive path to the plurality of heat generating parts. The wiring layer includes a conductive part and a heat generating sub-part for each of the plurality of heat generating parts, where the conductive part has a lower resistance value per unit length in a sub-scanning direction than the heat generating part, and where the heat generating sub-part has a resistance value per unit length in the sub-scanning direction that falls between the respective resistance values of the heat generating part and the conductive part. The substrate includes a ridge raised from the obverse surface and extending in the main scanning direction. The heat generating part, the heat generating sub-part and the conductive part are disposed on the ridge. The heat generating sub-part is located between the heat generating part and the conductive part in the sub-scanning direction.

A thermal head includes a substrate, a bonding material, an electrically conductive member, and a gold electrode. The bonding material is located on the substrate and contains gold and tin. The electrically conductive member is located on the bonding material. The gold electrode is located on the substrate and electrically connected to the bonding material.