A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.

A thermal printhead includes a substrate having an obverse surface, a projection formed on the obverse surface and extending in a primary scanning direction, a plurality of heating elements arranged in the primary scanning direction on the top of the projection, a groove dented from the top of the projection and extending in the primary scanning direction, and a heat storage member filling at least an opening of the groove.

A thermal print head includes: a substrate; a resistor layer supported by the substrate and including a plurality of heat generating portions arranged in a main scanning direction; a wiring layer supported by the substrate and forming an energizing path to the plurality of heat generating portions; and an insulating layer interposed between the substrate and the resistor layer, wherein the substrate has a cavity portion overlapping the plurality of heat generating portions when viewed in a thickness direction of the substrate.

The present disclosure provides a thermal print head for achieving fine printing. A thermal print head of the disclosure includes: a substrate, having a substrate main surface and a substrate back surface facing opposite sides in a z direction; a resistor layer, disposed on a side of the substrate main surface and including a plurality of heat generating portions arranged in a main scan direction to generate heat by energization; a wiring layer, disposed on the side of the substrate main surface and including a conduction path for electrically conducting the plurality of heat generating portions; a metal layer, interposed between the substrate and the wiring layer with the resistor layer; and an insulating layer, interposed between the metal layer and the wiring layer with the resistor layer. The conduction path includes the metal layer. The metal layer includes tantalum (Ta).

A system and method for selective heating and/or sintering of a material including first and second substrates, an array of one or more resistive heating elements arranged on a planar surface of a substrate and material to be heated located on the other substrate.

The present disclosure provides a thermal print head and a method manufacturing the thermal print head, and a thermal printer including the thermal print head. The thermal print head includes: a substrate having a protruding surface; a resistance layer including multiple heating portions and a portion formed on the protruding surface; and a wiring layer conductive to the multiple heating portions. The thermal print head further includes a glaze layer having a pair of end edges arranged apart from each other in y direction and formed in contact with a top surface of the protruding surface. The multiple heating portions are formed on the glaze layer. When observed in z direction, each of the pair of end edges includes a receding section located closer to an inner side of the top surface than a junction of the top surface, and a pair of inclined surfaces of the protruding surface.

In some examples, a thermal imaging head includes a resistor and conductors connected to end portions of the resistor to pass an electrical current through the resistor. The resistor includes gaps at the end portions of the resistor, each gap of the gaps reducing a cross-sectional area of a respective end portion of the end portions of the resistor relative to a cross-sectional area of a central portion of the resistor.

Disclosed is an assembly line for processing products. The line includes, on one hand, a plurality of consecutive stations for processing the products and, on the other hand, a moving unit for moving the products between the stations within the line, in particular from an upstream station in which the products have just been processed, to a downstream station in which the products must later be processed. The moving unit essentially includes at least one self-contained, self-supported, movable carriage moving on the ground and having the products resting thereon during the movement thereof within the line. Also disclosed is a corresponding implementation method and to a corresponding use of the carriages.

A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.

A liquid discharge head includes a recording element substrate. The recording element substrate includes a discharge aperture forming member defining a discharge aperture from which a liquid is discharged and a substrate having a pressure generating element that pressurizes the liquid so as to discharge the liquid. The liquid discharge head also includes a cover member that defines an opening through which the discharge aperture is exposed. The cover member is disposed on a side of the recording element substrate on which the discharge aperture is formed. In the liquid discharge head, the recording element substrate further includes an electrode disposed on a side of the substrate on which the discharge aperture forming member is formed and an insulation member that covers the electrode. In addition, the insulation member is covered by the cover member.