A thermal head includes: a substrate; a heat generating section which is disposed on the substrate; a plurality of driving ICs including first and second driving ICs which are disposed on the substrate and electrically coupled to the heat generating section; and a cover member covering the first and second driving ICs. The cover member is disposed in an inter-driving IC region between the first driving IC and the second driving IC and above and below the inter-driving IC region, and includes a first void.

A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

A thermal head of the present disclosure includes a substrate, a heating part, an electrode, a protection layer, and a coating layer made of a resin material. The heating part is placed on or above the substrate. The electrode is placed on or above the substrate and connected to the heating part. The protection layer is placed on or above the heating part and the electrode. The coating layer is placed on or above the electrode and the protection layer. The protection layer includes a recessed part that is opened on an upper surface and that extends along a thickness direction of the protection layer. The recessed part includes an inner wall having a plurality of recesses and projections, and the resin material is disposed inside the recessed part.

A thermal head includes a substrate, a glaze layer, and a reinforced conductor layer. The glaze includes a first glaze and a second glaze. The first glaze extends in a predetermined direction on the surface of the substrate. The second glaze is spaced part from the first glaze to one side in a direction perpendicular to the predetermined direction on the surface of the substrate. The reinforced conductor layer includes a lateral side part. The lateral side part extends on the surface of the substrate from the first glaze side to the second glaze side and is partially located on the second glaze. An edge part on the first glaze side in the second glaze includes a cutout portion cut out toward the one side in the direction perpendicular to the predetermined direction. The lateral side part passes through the cutout portion.

A thermal head of the disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate, the electrode having a connecting portion connected to the heat generating section; and a protective layer which covers the heat generating section and the connecting portion of the electrode, a part of the protective layer which is disposed on the connecting portion having a closed first void therein.

The present disclosure provides a thermal print head. The thermal print head includes a substrate, having a main surface facing one side in a thickness direction; a resistor layer, including a plurality of heat generating portions arranged in a main scanning direction and supported by the substrate; and a wiring layer, forming a power path to the plurality of heat generating portions and supported by the substrate. The substrate includes a convex portion protruding from the main surface and extending along the main scanning direction. The convex portion includes: a flat first surface on which each of the plurality of heat generating portions is disposed; and a first curved convex surface connected to the first surface.

A thermal head includes a substrate, an electrode, a bonding material, an electrically conductive member, and a sealing material. The electrode is located on the substrate. The bonding material is located on the substrate or the electrode. The electrically conductive member is located on the bonding material and is electrically connected to the electrode via the bonding material. The sealing material is located on the substrate and covers the bonding material and the electrically conductive member. The bonding material includes a protruding portion located at an outer circumferential edge of the electrically conductive member away from the substrate and the electrically conductive member.

A thermal head of the present disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode which is disposed on the substrate and is connected to the heat generating section; a protective layer covering the heat generating section and the electrode, the protective layer having a surface provided with a depression portion; at least one particle of metal disposed inside the depression portion; and an oxide layer covering the at least one particle, the oxide layer being formed of oxides of the metal. A surface of the oxide layer is exposed to an outside and is located in a deeper position of the depression portion than the surface of the protective layer around the depression portion.

The invention provides an inkjet print apparatus and a recovery method of an inkjet print apparatus, which can suppress deterioration of productivity. For that purpose, timing, at which a recovery operation is practiced in accordance with a facing time period of a print head and a print medium and a not facing time period thereof, is set.

A thermal head includes a substrate; a heat generating section disposed on the substrate; an electrode electrically connected to the heat generating section; a cover layer which covers part of the electrode; a pad electrically connected to the electrode; and a joining member electrically connected to the pad. The cover layer includes a first portion and a second portion which is smaller in thickness than the first portion. The second portion is placed on the pad. The pad has a convexity which exposes from the second portion. The joining member is connected to the convexity.