[Object] To provide a thermal head that can reduce the probability of breakage of a connector.

[Solution] A thermal head X1 includes a substrate 7; a plurality of heating elements 9 disposed on the substrate 7; a plurality of electrodes disposed on the substrate 7 and electrically connected to the plurality of heating elements 9; a connector 31 disposed adjacent to the substrate 7 and including a plurality of connector pins 8a including connection portions 32, each of which is electrically connected to a corresponding one of the plurality of electrodes, and a housing 10 containing the plurality of connector pins 8a; and a covering member 12 covering the connection portions on the substrate. The housing includes an opening facing away from the substrate. The covering member 12 includes a first portion 12a located on the substrate 7 and a second portion 12b located on the housing 10. The second portion 12b includes a first protrusion 12b1 protruding toward the opening 10i in a plan view. Thus, the probability of breakage of the connector can be reduced.

A thermal head includes a substrate; a plurality of heat generating portions; a common electrode disposed on the substrate and electrically connected to the plurality of heat generating portions; a plurality of individual electrodes disposed on the substrate and each electrically connected to a corresponding one of the plurality of heat generating portions; a first insulation layer disposed on the heat generating portions, a part of the common electrode, and a part of the individual electrodes; a second insulation layer located adjacent to the first insulation layer and disposed on a part of the individual electrodes; and a static removing layer disposed on the first insulation layer and grounded. The static removing layer includes a first portion disposed on an upper surface of the first insulation layer and a second portion electrically connected to the first portion and disposed on an upper surface of the second insulation layer.

A heating circuit having an array of switching heating elements (e.g., field effect transistors, thin film transistors) provides a transient heat pattern over a surface (e.g., substrate, imaging member surface, transfer roll surface) moving relative to the heating circuit, to produce a pixelated heat image and heat a target pattern on the surface. Heat is generated by current flow in the heating elements, and the power developed by the heating circuit is the product of source-drain voltage and current in the channel. Digital addressing may accomplished by matrix addressing the array. Current may be supplied along data address lines by an external voltage controlled by digital electronics understood by a skilled artisan to provide the desired heat at a respective heating element pixels addressed by a specific gate line. The circuit may include a current return line that may be low resistance, for example, by using a 2-dimensional mesh.

A thermal print head includes a heat-generating substrate, a resistor layer, a conductive layer, a first substrate, a second substrate, and a third substrate. The heat-generating substrate includes a heat-generating substrate obverse face and a heat-generating substrate reverse face that are spaced apart from each other in a thickness direction. The resistor layer is supported by the heat-generating substrate. The conductive layer is supported by the heat-generating substrate, and electrically connected to the resistor layer. The first substrate is located upstream of the heat-generating substrate in a sub-scanning direction. The second substrate is located upstream of the first substrate in the sub-scanning direction. The third substrate is bonded to the first substrate and the second substrate and higher in flexibility than the first substrate.

A method for introducing a reflective, refractive, and/or diffractive variable and/or non-variable image to a substrate by use of thermal transfer printing includes simultaneously transferring a defined portion of each of a protective coating layer, an image layer, and an adhesive layer from a carrier film of a transfer ribbon to the substrate by applying heat to the transfer ribbon. The defined portions of the image layer and the protective coating layer are adhered to the substrate using the adhesive layer. Subsequent to transferring the protective coating layer, the image layer, and the adhesive layer, durability is provided to the image layer by cross-linking the protective coating layer that is over the image layer by exposing the protective coating layer to a radiation source after the defined portions of the protective coating layer, the image layer, and the adhesive layer are transferred from the carrier film.

A thermal head according to the present disclosure includes a substrate, a plurality of heat generating portions, a plurality of first electrodes, and a second electrode. The plurality of heat generating portions are located on the substrate. The plurality of first electrodes are located on the substrate and respectively connected to the plurality of heat generating portions. The second electrode is located on the substrate and is located across the plurality of first electrodes. The second electrode includes protruding portions protruding in a first direction from the second electrode toward corresponding ones of the first electrodes and being in contact with the corresponding ones of the first electrodes.

A liquid ejection head includes a recording element substrate including an ejection port member including a liquid ejection port, an electrical wiring layer including a pressure generating element that pressurizes the liquid to eject the liquid and an electrically connecting part connected to the pressure generating element to supply power for driving the pressure generating element to the pressure generating element, and a silicon substrate having the ejection port member and the electrical wiring layer. The silicon substrate includes a through-hole passing through the silicon substrate to expose the electrically connecting part. An outer shape of an opening of the through-hole on the back side of the silicon substrate has no side parallel to direction [110] of the silicon substrate or has a side parallel to the direction [110]. The side has a length equal to or less than half an entire length of the through-hole in the direction [110].

The present invention provides a thermal print head capable of better performing printing on a printing medium; the thermal print head including: a substrate (1), formed with single crystal semiconductor; a resistor layer (4), including a plurality of heating portions (41) arranged in a main scan direction; and a wiring layer (3), configuring a charging path to the plurality of heating portions. The substrate includes: a main surface (11), being a surface opposite to the resistor layer; and a convex portion (13), disposed as protruding from the main surface and extending in the main scan direction. The convex portion includes: an inclining surface (132), inclining relative to the main surface and extending in a linear manner when viewing from the main scan direction; and a curving surface (131), disposed, in a protruding direction of the convex portion, on a position farther away from the main surface than the inclining surface, and curving in a manner that protrudes toward the protruding direction. Each of the plurality of heating portions includes a heating curving portion (411) formed on a portion corresponding to the curving surface.

A formative surface having a conductive base covered with a dielectric and oleophobic/hydrophobic surface layer is created with defined pits to grow micro-puddles of a defined volume. The formative surface is brought into close proximity with a charge retentive surface carrying a charge image. Fountain solution vapor nucleates and grows preferentially on the base of the pits as micro-puddle droplets. The puddles are charged and extracted from the surface to provide a fog of charged droplets of narrow volume and charge distribution. The charged droplets are attracted and repelled respectively from the charged and discharged image regions of the charge retentive surface, thus developing the charged image into a fountain solution latent image. The developed latent image is then brought into contact with a transfer member blanket and split, thus creating on the blanket a fountain solution latent image ready for inking.

Ink-based digital printing systems useful for ink printing include a secondary roller having a rotatable reimageable surface layer configured to receive fountain solution. The fountain solution layer is patterned on the secondary roller and then partially transferred to an imaging blanket, where the fountain solution image is inked. The resulting ink image may be transferred to a print substrate. To achieve a very high-resolution (e.g., 1200-dpi, over 900-dpi) print with these secondary roller configurations, an equivalent very high-resolution fountain solution image needs to be transferred from the secondary roller onto the imaging blanket. To increase the resolution of the image on the secondary roller, examples include a textured surface layer added to the secondary roller for contact angle pinning the fountain solution on the roll. Approaches to introduce a micro-structure onto the surface layer of the secondary roller, and also superoleophobic surface coatings are described.