A recording device includes a recording section configured to perform recording on a medium; a control substrate 60 configured to be involved in the operation of the recording section; and a storage section including a metal partition 70 and covering the control substrate 60, wherein the control substrate 60 is in contact with the convex member 72 constitutes at least a part of the partition 70 via the elastic member 80 having heat conductivity.

A thermal head of the present disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode which is disposed on the substrate and is connected to the heat generating section; a protective layer covering the heat generating section and the electrode, the protective layer having a surface provided with a depression portion; at least one particle of metal disposed inside the depression portion; and an oxide layer covering the at least one particle, the oxide layer being formed of oxides of the metal. A surface of the oxide layer is exposed to an outside and is located in a deeper position of the depression portion than the surface of the protective layer around the depression portion.

A thermal head of the present disclosure includes a substrate, a heating part, an electrode, a protection layer, and a coating layer made of a resin material. The heating part is placed on or above the substrate. The electrode is placed on or above the substrate and connected to the heating part. The protection layer is placed on or above the heating part and the electrode. The coating layer is placed on or above the electrode and the protection layer. The protection layer includes a recessed part that is opened on an upper surface and that extends along a thickness direction of the protection layer. The recessed part includes an inner wall having a plurality of recesses and projections, and the resin material is disposed inside the recessed part.

On an element substrate having a multilayered structure in which a temperature detection element is provided in an intermediate layer of a wiring layer and a print element layer, a wiring layer and a temperature detection element formed on the first interlayer insulation film are connected by a first conductive plug which penetrates through the first interlayer insulation film. In addition, a wiring layer and a print element which are formed on the second interlayer insulation film formed on the first interlayer insulation film are connected by a second conductive plug which penetrates through the first and second interlayer insulation films. By manufacturing the element substrate by this arrangement, the thickness of an interlayer insulation film between a print element and a temperature detection element can be made thin, and the sensitivity of the temperature detection element can be improved.

A thermal head includes a substrate, a glaze layer, and a reinforced conductor layer. The glaze includes a first glaze and a second glaze. The first glaze extends in a predetermined direction on the surface of the substrate. The second glaze is spaced part from the first glaze to one side in a direction perpendicular to the predetermined direction on the surface of the substrate. The reinforced conductor layer includes a lateral side part. The lateral side part extends on the surface of the substrate from the first glaze side to the second glaze side and is partially located on the second glaze. An edge part on the first glaze side in the second glaze includes a cutout portion cut out toward the one side in the direction perpendicular to the predetermined direction. The lateral side part passes through the cutout portion.

A thermal head of the disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate, the electrode having a connecting portion connected to the heat generating section; and a protective layer which covers the heat generating section and the connecting portion of the electrode, a part of the protective layer which is disposed on the connecting portion having a closed first void therein.

A thermal head of the present disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode which is disposed on the substrate and is connected to the heat generating section; a protective layer covering the heat generating section and the electrode, the protective layer having a surface provided with a depression portion; at least one particle of metal disposed inside the depression portion; and an oxide layer covering the at least one particle, the oxide layer being formed of oxides of the metal. A surface of the oxide layer is exposed to an outside and is located in a deeper position of the depression portion than the surface of the protective layer around the depression portion.

A recording element substrate includes a substrate, a plurality of energy generating elements arranged on the substrate to form an element row, a plurality of supply ports arranged along the element row to form a supply port row, and a plurality of supply paths extending from the plurality of supply ports along the thickness direction of the substrate, wherein a plurality of beam portions disposed between adjacent supply ports in the direction of the supply port row has a plurality of conductor layers in which a conductor layer including a power supply conductor connected to the energy generating elements and a conductor layer including a ground conductor connected to the energy generating elements, are stacked along the thickness direction of the substrate, and wherein at least one of the plurality of conductor layers is occupied by one power supply conductor or one ground conductor.

A thermal head includes a substrate; a heat generating section disposed on the substrate; an electrode electrically connected to the heat generating section; a cover layer which covers part of the electrode; a pad electrically connected to the electrode; and a joining member electrically connected to the pad. The cover layer includes a first portion and a second portion which is smaller in thickness than the first portion. The second portion is placed on the pad. The pad has a convexity which exposes from the second portion. The joining member is connected to the convexity.

A thermal head according to the present disclosure includes: a substrate; a first electrode; a heat generating section; a second electrode; a resin layer; and a protective layer. The first electrode is located on the substrate. The heat generating section is located on the substrate. The second electrode is located on the substrate so as to be electrically connected to the heat generating section and the first electrode. The resin layer is located on the first electrode. The protective layer is located on the resin layer. Moreover, the resin layer includes a first portion inserted in the first electrode.