A thermal head of the disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate, the electrode having a connecting portion connected to the heat generating section; and a protective layer which covers the heat generating section and the connecting portion of the electrode, a part of the protective layer which is disposed on the connecting portion having a closed first void therein.

A printer printing an image on a print medium based on print data including print dot data for each of print lines. The printer includes a print head including heating elements arranged along a direction of the print lines, and a controller finding the number of print dots on each print line and determining a first or second control mode as a control mode of the heating elements for printing each print line based on the found number of print dots. In the first control mode, the heating elements are divided into first groups including two or more adjacent heating elements and are heated at a different timing. In the second control mode, the heating elements are divided into second groups including two or more heating elements with at least two thereof spaced apart and are heated at a different timing.

A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

A thermal head includes a substrate; a plurality of heating elements disposed on the substrate; a plurality of electrodes disposed on the substrate and electrically connected to the plurality of heating elements; a connector disposed adjacent to the substrate and including a plurality of connector pins including connection portions, each of which is electrically connected to a corresponding one of the plurality of electrodes, and a housing containing the plurality of connector pins; and a covering member covering the connection portions on the substrate. The housing includes an opening facing away from the substrate. The covering member includes a first portion located on the substrate and a second portion located on the housing. The second portion includes a first protrusion protruding toward the opening in a plan view.

The present disclosure provides a substrate for a thermal print head. The substrate for the thermal print head includes: a main surface on which a ridge portion is formed; a base material; and a glaze layer. The ridge portion extends along a first direction in a plan view and is formed of a pedestal portion which is a part of the base material and the glaze layer disposed on a top surface of the pedestal portion. A hollow portion is disposed inside the glaze layer.

A thermal print head includes: a substrate including a main surface; an insulating film arranged on the main surface; a first wiring layer arranged on the insulating film; a first interlayer insulating film arranged on the first wiring layer; a heat-generating body film; and a second wiring layer arranged on the first interlayer insulating film with the heat-generating body film interposed therebetween, wherein a bump is formed on the main surface, wherein the bump extends along a first direction in a plan view, wherein the second wiring layer extends along a second direction orthogonal to the first direction to intersect the bump in a plan view, and includes first, second, third, and fourth wirings arranged along the first direction, wherein the second wiring is located between the first wiring and the third wiring, and wherein the third wiring is located between the second wiring and the fourth wiring.

A thermal head includes a substrate; a heat generating section disposed on the substrate; an electrode electrically connected to the heat generating section; a cover layer which covers part of the electrode; a pad electrically connected to the electrode; and a joining member electrically connected to the pad. The cover layer includes a first portion and a second portion which is smaller in thickness than the first portion. The second portion is placed on the pad. The pad has a convexity which exposes from the second portion. The joining member is connected to the convexity.

[Object] To provide a thermal head having improved sealability.

[Solution] A thermal head X1 includes a substrate 7, a heat storage layer 13 disposed on the substrate 7 and including a bulging portion 13a, heating elements 9 disposed on the bulging portion 13a, a protective layer 25 disposed on the heating elements 9, and a covering layer 27 disposed on the protective layer 25. The covering layer 27 includes a first portion 27a disposed apart from the bulging portion 13a, and a second portion 27b disposed between the bulging portion 13a and the first portion 27a. The height of the second portion 27b from the substrate 7 is smaller than the height of the first portion 27a from the substrate 7. Thus, the sealability of the thermal head X1 can be improved.

A thermal print head includes: a substrate; an insulating layer; a wiring layer; a resistor layer; and a protective layer. The substrate has a first surface and a second surface opposite to the first surface. A raised portion protruding toward a side opposite to the second surface and extending along a first direction in a plan view is formed on the first surface. The insulating layer is disposed on the first surface. The wiring layer is disposed on the insulating layer with the resistor layer interposed therebetween. The wiring layer has a bonding pad. A constituent material of the wiring layer is aluminum or an aluminum alloy. The protective layer is disposed on the insulating layer to cover the wiring layer. An opening that exposes the bonding pad is formed in the protective layer.

A thermal head for a thermal transfer machine is provided to transfer a film onto a card. The thermal head may include a frame intended to be secured to the machine. The thermal head may also include a heating bar mounted on the frame, intended to create heat and having a heating surface designed to diffuse said heat towards the outside. The thermal head may yet also include a pad produced from a flexible material and fixed removably against the heating surface so as to be placed between the heating surface and the film.