A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.

A thermal head includes a substrate, a plurality of heat generating portions, electrodes, pads, driving ICs, and a wire. The plurality of heat generating portions are positioned on the substrate and arranged in a main scanning direction. The electrodes are positioned on the substrate and electrically coupled to each of the plurality of heat generating portions. The pads are positioned on the substrate and coupled to the electrodes. The driving ICs drive the heat generating portions. The wire couples the driving ICs and the electrodes to each other. The thermal head according to the present disclosure includes a plurality of the pads. At least one of the pads is a multi pad that has a first region to which the wire is connected and a second region to which each of a plurality of probes is connected.

A thermal printhead includes a substrate having an obverse surface, a projection formed on the obverse surface and extending in a primary scanning direction, a plurality of heating elements arranged in the primary scanning direction on the top of the projection, a groove dented from the top of the projection and extending in the primary scanning direction, and a heat storage member filling at least an opening of the groove.

A thermal print head includes: a substrate; a resistor layer supported by the substrate and including a plurality of heat generating portions arranged in a main scanning direction; a wiring layer supported by the substrate and forming an energizing path to the plurality of heat generating portions; and an insulating layer interposed between the substrate and the resistor layer, wherein the substrate has a cavity portion overlapping the plurality of heat generating portions when viewed in a thickness direction of the substrate.

In some examples, a thermal imaging head includes a resistor and conductors connected to end portions of the resistor to pass an electrical current through the resistor. The resistor includes gaps at the end portions of the resistor, each gap of the gaps reducing a cross-sectional area of a respective end portion of the end portions of the resistor relative to a cross-sectional area of a central portion of the resistor.

Disclosed is an assembly line for processing products. The line includes, on one hand, a plurality of consecutive stations for processing the products and, on the other hand, a moving unit for moving the products between the stations within the line, in particular from an upstream station in which the products have just been processed, to a downstream station in which the products must later be processed. The moving unit essentially includes at least one self-contained, self-supported, movable carriage moving on the ground and having the products resting thereon during the movement thereof within the line. Also disclosed is a corresponding implementation method and to a corresponding use of the carriages.

A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.

A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.

A thermal head of the present disclosure includes a substrate 7, a heat generating unit 9, an electrode, a covering layer 27, and a covering member 29. The heat generating unit 9 is positioned above the substrate 7. The electrode is positioned above the substrate and connected to the heat generating unit 9. The covering layer 27 covers at least a part of the electrode when viewed in plan. The covering member 29 is positioned on the covering layer 27. The covering layer 27 has an upper surface 27a and a lateral surface 27b that is positioned on a side of the heat generating unit 9. An arithmetic-average surface roughness Ra of the lateral surface 27b is higher than an arithmetic-average surface roughness Ra of the upper surface 27a.

A thermal head includes: an underglaze layer provided on an insulating substrate; an electrode provided on the underglaze layer; a heat generator provided on the electrode; a first protective layer containing a glass material and covering at least the heat generator; and a second protective layer provided on the first protective layer, having a melting point higher than that of the first protective layer, and made of a material whose thermal expansion coefficient at a temperature of 1000 C. or lower is substantially constant.