For direct chip-on-array for a multi-dimensional transducer array, the generally rigid and conductive dematching layer is extended beyond a footprint of the transducer array. The ASIC is directly connected to the dematching layer on one side, while the other side provides for electrical connection to the elements of the array and I/O pads for connections (e.g., flex-to-dematching layer) to the ultrasound imaging system. By using the dematching layer rigidity, the ASIC may be protected during formation of the acoustic stack. By using the dematching layer conductivity, any mis-alignment is compensated by the routing through the dematching layer, and/or a large flat region is provided for I/O, allowing for good low temperature asperity contact connections with larger area than flip-chip solder bumps. By providing the I/O for the system connections on a different side of the dematching layer than the ASIC, a large keep-out distance due to underfill may be avoided.

For direct chip-on-array for a multi-dimensional transducer array, the generally rigid and conductive dematching layer is extended beyond a footprint of the transducer array. The ASIC is directly connected to the dematching layer on one side, while the other side provides for electrical connection to the elements of the array and I/O pads for connections (e.g., flex-to-dematching layer) to the ultrasound imaging system. By using the dematching layer rigidity, the ASIC may be protected during formation of the acoustic stack. By using the dematching layer conductivity, any mis-alignment is compensated by the routing through the dematching layer, and/or a large flat region is provided for I/O, allowing for good low temperature asperity contact connections with larger area than flip-chip solder bumps. By providing the I/O for the system connections on a different side of the dematching layer than the ASIC, a large keep-out distance due to underfill may be avoided.

Systems, devices, and methods provide a solid-state intravascular ultrasound (IVUS) imaging system that includes an array of ultrasound transducers mounted on a structural uni-body made of a polymeric substance doped with acoustic dampening material. The use of the polymeric substance doped with acoustic dampening material to fabricate the uni-body assists in improving the signal-to-noise ratio associated with the IVUS imaging signals.

A backing member includes a resin layer having a first surface, and a second surface opposite to the first surface, and a plurality of linear conductors, embedded in the resin layer, and penetrating the resin layer from the first surface to the second surface. Each of the plurality of linear conductors includes a metal material having an ultrasonic wave insulating property, and includes at least one bent portion or curved portion.

An ultrasonic transducer includes a case, a piezoelectric element, a wiring member, a foaming member, and a vibration damping material. The case includes a bottom wall. The piezoelectric element is disposed on the bottom wall inside the case. The wiring member is electrically connected to the piezoelectric element. The foaming member is disposed on the piezoelectric element. The vibration damping material is disposed between the piezoelectric element and the foaming member. The foaming member has a bottom surface opposing the piezoelectric element in a thickness direction of the piezoelectric element. A plurality of depressions is formed on the bottom surface. The vibration damping material bonds the piezoelectric element and the bottom surface.

A deployable invasive device includes a transducer with a plurality of elements linked by at least one shape memory material configured to move the plurality of elements relative to one another between a first configuration and a second configuration in response to a stimulus. The shape memory material comprises at least one active region configured to facilitate transition between the first configuration and the second configuration. The deployable invasive device includes at least one integrated circuit configured to process signals from at least one of the plurality of elements and a plurality of conductive traces on or in the shape memory material and extending through the active region. The conductive traces are configured to conduct signals to the at least one integrated circuit, wherein the conductive traces are configured to conform as the shape memory material moves the elements between the first configuration and the second configuration.

A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.

An ultrasonic sensor having a case including a bottom section and a peripheral wall section; a piezoelectric device on the bottom section inside the case; and a resin foam filler filling at least part of the case and covering the piezoelectric device. An inner surface of the case includes a first region and a second region, a surface roughness of the first region is higher than a surface roughness of the second region, the first region includes at least part of the bottom section and/or a portion of the peripheral wall section facing the piezoelectric device, the second region is on the peripheral wall section and is farther from the piezoelectric device than the first region, and the resin foam filler contacts each of the first region and the second region.

A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.

Systems, methods, and apparatuses for conducting heat from an ultrasound transducer and reducing drop impact forces are disclosed. A thermal management system including a thermally conductive compliant component in an ultrasound probe is disclosed. The thermal management system may include thermally conductive compliant component coupled to a transducer assembly. A printed circuit assembly (PCA) may be coupled to the compliant component. The thermally compliant component may conduct heat from the transducer assembly to the PCA. The PCA may be further coupled to a cable that may conduct heat from the PCA and away from the ultrasound probe.