Methods and devices are provided for suppressing reverberations within an ultrasound transducer with a backing whereby the backing may not sufficiently attenuate the acoustic energy by means of acoustic absorption and scattering alone. At least a portion of a surface of the backing is segmented into a plurality of levels defined by surface segments. The levels may be are spatially offset so that acoustic reflections from the segmented surface are spread out in time, thereby decreasing the net amplitude of the internally reflected waves as they interact with the piezoelectric layer. Adjacent (neighboring) levels may be spatially offset by a longitudinal distance equaling approximately an odd number multiple of a quarter of an operational wavelength of the transducer, so that destructive interference occurs from acoustic waves reflected from adjacent levels. Various example configurations of segmented surfaces are described, and methods for selecting a profile of a segmented surface are provided.

A backing component configured to receive and attenuate transmitted acoustic signals from a transducer element in an ultrasound probe is disclosed. The backing component has a unitary structure of a first material and a second material, and a variation in packing density of the first material across at least a portion of a thickness of the backing component. Further, a method of making a backing component for a transducer element in an ultrasound probe is disclosed. The method includes performing an additive manufacturing technique using a first material and a second material to form the backing component that has a unitary structure of the first material and the second material. Performing the additive manufacturing technique involves varying a packing density of the first material across at least a portion of thickness of the backing component.

Provided are an ultrasonic probe and a method of manufacturing the same. The ultrasonic probe includes: a matching layer; a piezoelectric layer that is disposed on a bottom surface of the matching layer and generates ultrasonic waves; and a backing layer that is disposed on a bottom surface of the piezoelectric layer and includes plate-shaped carbon allotropes and a backing material provided between the plate-shaped carbon allotropes.

The present invention provides a flexible ultrasound transducer for an ultrasound monitoring system for examining a curved object. The ultrasound transducer comprises an integrated circuit structure and a multi-layered structure, said multi-layered structure comprising an array of ultrasound transducing elements arranged in a first layer structure and configured for generating ultrasonic energy propagating along a main transducer axis Z and an array of control circuits arranged in a second layer structure, and wherein the array of control circuits and the integrated circuit structure are configured for operating the array of ultrasound transducing elements in said first layer structure, Further, the multi-layered structure comprises at least one flexible layer arranged so that the bending flexibility of the multi-layered structure permits the ultrasound transducer to form a continuous contact with said curved object during operation.

A probe of an ultrasonic imaging apparatus and a method for manufacturing the same are disclosed. The probe for an ultrasonic imaging apparatus includes a piezoelectric unit including a piezoelectric substance and an electrode; a printed circuit board (PCB) unit having a printed circuit board (PCB), configured to be formed at a lateral surface of the piezoelectric unit; a matching layer formed at front surfaces of the piezoelectric unit and the PCB unit; and a backing layer formed at a back surface of the piezoelectric unit and the PCB unit. The probe and a method for manufacturing the probe can reduce a variation of ultrasonic acoustic characteristics caused by a printed circuit board (PCB) because the PCB is not arranged among a piezoelectric substance, a matching layer, and a backing layer. A PCB is provided at a lateral surface of the piezoelectric substance, so that strength against impact can be increased either during channel division based on dicing or during the usage time of a probe. In addition, a single crystal (monocrystal) may be used as a piezoelectric substance or the like, such that a probe having a large bandwidth can be formed, and low-frequency ultrasonic signals and high-frequency ultrasonic signals can be transmitted and received. In addition, the probe and the method for manufacturing the same can easily perform channel division of the acoustic module, and make the divided acoustic module using a curvature, and thus can be applied to various technical fields without being limited to the shapes of probes.

Disclosed is an ultrasound probe wherein a backing having built-in lead arrays is disposed on the rear surface side of a transducer array, and backing terminal arrays connected to the lead arrays are provided on the lower surface of the backing. A relay substrate is provided between the backing and an electronic substrate. The relay substrate is provided with electrode section arrays corresponding to the backing terminal arrays. An electrode section includes: a substrate terminal connected to a backing terminal; a via for substrate internal wiring, said via being formed at a position shifted from the substrate terminal; and a conducting path that connects the substrate terminal and the via to each other. The electrode section arrays include a transmission electrode section array, and a reception electrode section array. The shift direction of the transmission electrode section array and that of the reception electrode section array are different from each other.

A solidly mounted resonator structure includes an multi-layer acoustic reflector structure and a piezoelectric material layer arranged between the first and second electrode structures to form an active region, with the acoustic reflector structure providing enhanced reflection of shear and longitudinal modes of acoustic vibrations. The solidly mounted resonator structure is configured for transduction of an acoustic wave including a longitudinal component and a shear component. The acoustic reflector structure includes multiple sequentially arranged differential acoustic impedance layer units each including a low acoustic impedance material layer in contact with a high acoustic impedance material layer. A frequency corresponding to a minimum transmissivity of a second harmonic resonance of a longitudinal response is substantially matched to a frequency corresponding to a minimum transmissivity of a third harmonic resonance of a shear response.

The present application relates to the technical field of transducer, it provides an ultrasonic transducer and the manufacture method therefore. The ultrasonic transducer comprises: a piezoelectric layer for radiating sound signal forward or backward, each side thereof being plated with an electrode; a matching layer arranged in the front of the piezoelectric layer and suitable for sending the forward sound signal; a tuning layer arranged on the back of the piezoelectric layer, wherein the piezoelectric layer is disposed between the tuning layer and the matching layer; a backing layer for absorbing the backward sound signal from the piezoelectric layer, wherein the backing layer is arranged against the piezoelectric layer on the tuning layer.

A transducer assembly operable to transmit ultrasonic energy in a desired direction towards a zone adapted to be acoustically coupled to an object or area of interest, the assembly comprising: a transducer layer; a backing material disposed behind said transduction material with respect to the desired direction; a back-matching layer disposed between the transducer layer and the backing material to reflect towards said transducer layer part of the ultrasonic energy directed from the transducer layer to the backing material.

The backing layer has an acoustic impedance higher than the acoustic impedance of the back-matching layer, the back-matching material has an impedance less that the impedance of the transducer layer and the transducer layer has a thickness greater than a of the wavelength of the ultrasound waves the assembly is configured to generate.

A process for manufacturing a transducer assembly is also disclosed.

An ultrasonic probe includes: an acoustic element that generates an ultrasonic wave and detects the ultrasonic wave; a support that supports the acoustic element on a side opposite to a test object side; and a heat dissipation material disposed on a side of the support opposite to the acoustic element, wherein an attenuation/thermal conduction material made of an attenuating material containing a thermally conductive material is disposed in contact with the heat dissipation material.