According to a method or an apparatus for fastening bristles in a bristle carrier (10) without using an anchor a heating (39) is provided in a tool part configured to transport the bristles. After inserting the bristles into anchoring openings (12) in the bristle carrier (10), the anchoring openings are closed by applying pressure.

A medical device includes a balloon expanded scaffold crimped to a catheter having a balloon. The scaffold has a network of rings formed by struts connected at crowns and links connecting adjacent rings. The scaffold is crimped to the balloon by a process that includes using protective polymer sheaths or sheets during crimping, and adjusting the sheaths or sheets during the crimping to avoid or minimize interference between the polymer material and scaffold struts as the scaffold is reduced in size.

An aerospace vessel including a fuselage, a means for causing the fuselage to fly coupled to the fuselage, and an environmental control system within the fuselage. The environmental control system includes a duct made of closed cell thermoplastic foam, such as polyvinylidene fluoride foam.

An aerospace vessel including a fuselage, a means for causing the fuselage to fly coupled to the fuselage, and an environmental control system within the fuselage. The environmental control system includes a duct made of closed cell thermoplastic foam, such as polyvinylidene fluoride foam.

According to a method or an apparatus for fastening bristles in a bristle carrier (10) without using an anchor a heating (39) is provided in a tool part configured to transport the bristles. After inserting the bristles into anchoring openings (12) in the bristle carrier (10), the anchoring openings are closed by applying pressure.

An ultrasonic processing system (1) which comprises an ultrasonic vibrator (10) having an ultrasonic sonotrode (30) and a working surface (31) for ultrasonic processing of a workpiece. The vibrator (10) comprises a longitudinal axis (L), an enclosed cavity (32, 51) extends along the longitudinal axis at least in the sonotrode (30), a medium inlet (52) through which a cooling medium is fed into the cavity (32, 51), at least one vortex generator (53) which arranged between the medium inlet (52) and the cavity (32, 51) such that a swirl motion of the medium is generated inside the cavity (32, 51) around the longitudinal axis. A cooling channel (34) is fluidly connected to the enclosed cavity (32, 51) to guide the medium in the vicinity of the working surface (31) such that the working surface (31) is cooled. A first medium outlet (33) is fluidly connected to the cooling channel (34).

It is provided an electronic control device including a resin molded body, a metal body, and an electronic component, wherein the resin molded body and a main surface of the metal body are bonded, and at least a part of a side surface continuous to the main surface of the metal body is in contact with a side contact portion provided in the resin molded body.

Systems and methods are provided for consolidating thermoplastic parts. One embodiment is a method of automatically forming a thermoplastic composite structure. The method includes heating a thermoplastic preform to a forming temperature, forming the thermoplastic preform into a thermoplastic part having a desired shape, aligning multiple thermoplastic parts together, and consolidating the multiple thermoplastic parts together while controlling crystallization to form a complex thermoplastic part.

An apparatus and method of closing a wide variety of thermoplastic tubes, in particular with Shore hardnesses of around 50 (A) to above 100 (A), where the tubes having inside diameters of 1.6 mm to 35 mm and/or wall thicknesses of 0.8 to 4.8 mm. The method involves use of a tube heater having at least one heating element. The heating element has at least four heatable regions which are movable with respect to one another. The tube heater is configured to enclose, in the applied state, at least 75% of the circumference of the tube while bearing against the latter over its circumference at at least four points which are spaced apart from one another. One of the key advantages is that, prior to compression, the tube can already have been heated at a plurality of points on the tube.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.