An optoelectronic device, in particular an at least semi-transparent pane for example for a vehicle, comprises: a cover layer, a carrier layer, an intermediate layer between the cover layer and the carrier layer, wherein at least one and preferably a plurality of optoelectronic light sources, in particular μLEDS, is arranged on at least one surface of the intermediate layer and/or is at least partially embedded in the intermediate layer, wherein the intermediate layer is adapted such that light emitted by the optoelectronic light sources at least partially spreads in and along the intermediate layer and exits the intermediate layer within and/or at a pre-set distance to the respective optoelectronic light source in a direction through the cover layer and/or through the carrier layer.

A system such as a vehicle may have windows. A window may have a structural window layer formed from one or more glass layers. A conductive coating such as an infrared-light blocking coating or other optical filter layer may be formed on the window. The conductive coating may include one or more silver layers or other conductive material. Unpatterned portions of the conductive coating are conductive along orthogonal dimensions. A region of the conductive coating may have parallel line-shaped openings that render the coating conductive in only a single dimension while enhancing radio transparency. Another region of the conductive coating may have a two-dimensional pattern of openings such as a mesh-shaped opening formed from intersecting straight and/or curved lines. In this region, the coating is locally rendered insulating and radio-frequency transparent. Antennas and ohmic heating elements may be formed in the coating.

Embodiments disclosed herein include package substrates with glass stiffeners. In an embodiment, the package substrate comprises a first layer, where the first layer comprises glass. In an embodiment, the package substrate comprises a second layer over the first layer, where the second layer is a buildup film. In an embodiment, the package substrate further comprises an electrically conductive interconnect structure through the first layer and the second layer.

The present invention aims to provide an interlayer film for a laminated glass that generates heat under application of a voltage and warms frozen glass to melt frost or ice and also contributes to an excellent appearance of a laminated glass when used in the production of the laminated glass. The present invention can also provide a laminated glass produced using the interlayer film for a laminated glass. The present invention relates to an interlayer film for a laminated glass including: a conductive layer including a substrate containing a thermoplastic resin and a conductive film formed on the substrate; and a first resin layer containing a polyvinyl acetal stacked on the conductive film side of the conductive layer, the substrate having a thermal shrinkage measured in conformity with JIS C2151 of 1.0% to 3.5% in both of MD and TD directions after heat treatment at 150 C. for 30 minutes, the substrate and the first resin layer having a difference in the thermal shrinkage measured in conformity with JIS C2151 of 10% or less in absolute value in both of MD and TD directions after heat treatment at 150 C. for 30 minutes.