One example provides a fluidic die including a semiconductor substrate, and a nozzle layer disposed on the substrate, the nozzle layer having a top surface opposite the substrate and including a nozzle formed therein, the nozzle including a fluid chamber disposed below the top surface and a nozzle orifice extending through the nozzle layer from the top surface to the fluid chamber, the fluid chamber to hold fluid, and the nozzle to eject fluid drops from the fluid chamber via the nozzle orifice. An electrode is disposed in contact with the nozzle layer about a perimeter of the nozzle orifice, the electrode to carry an electrical charge to adjust movement of electrically charged components of the fluid.

A liquid discharge head includes a flow channel member, a pressurization part, a plurality of discharge holes, a flexible substrate, a cover member, and a heater. The flow channel member includes a first surface and a second surface that is positioned on an opposite side of the first surface. The pressurization part is positioned on the first surface. The plurality of discharge holes are positioned on the second surface. For the flexible substrate, a one-end part thereof that is positioned on the pressurization part is electrically connected to the pressurization part. The cover member covers the one-end part of the flexible substrate. The heater is positioned on the cover member.

A microfluidic device has a chamber; a fluidic access channel in fluidic connection with the chamber; a plurality of nozzle apertures in fluidic connection with the chamber; and an actuator, operatively coupled to the fluid containment chamber and configured to cause ejection of drops of fluid through the nozzle apertures in an operating condition of the microfluidic device. The chamber has an elongated shape, with a length and a maximum width, wherein an aspect ratio between the length and the maximum width of the chamber is at least 3:1. The nozzle apertures are configured to generate, in use, a plurality of drops having a total drop volume, wherein a ratio total drop volume to a chamber volume is at least 15%.

A liquid ejection head includes a recording element substrate having a substrate provided with a plurality of flow paths for liquid to be ejected on a recording material by a recording element and a cover member that is provided with a plurality of communication holes in communication with the plurality of flow paths and that is joined to the substrate, a liquid supply member supplying the liquid to the plurality of flow paths through the plurality of communication holes of the cover member, and an adhesive member adhering the cover member and the liquid supply member. At least a part of an abutment region of the cover member in abutment against the substrate and apart from a region provided with the plurality of communication holes has a cover member opening for contacting the adhesive member and the substrate to each other.

A print element substrate comprises print elements generating thermal energy for ejecting liquid; and a temperature detection element circuit including temperature detection elements provided corresponding to each of the print elements, and reading temperature information by selectively energizing one of the temperature detection elements, wherein the temperature detection element circuit includes: a signal processing portion outputting a selection signal having a second voltage amplitude larger than a first voltage amplitude, based on an input signal having the first voltage amplitude; a selection switch provided for each of the plurality of temperature detection elements, selecting the temperature detection element; and a first read switch provided for each of the plurality of temperature detection elements, reading a voltage of a terminal of one of the temperature detection element selected by the selection switch, and wherein the selection switch and the first read switch are driven by using the selection signal.

A liquid discharge head includes a plurality of discharge elements, a plurality of driving elements, a plurality of control circuits, a first ground wiring and a first power supply wiring configured to supply power to the plurality of discharge elements and the plurality of driving elements, and a second ground wiring and a second power supply wiring configured to supply power to the plurality of control circuits. The first ground wiring and the first power supply wiring include, in a first conductive layer of a plurality of conductive layers, a first wiring group extending in a first direction, and in a second conductive layer, a second wiring group extending in a second direction which intersects with the first direction. The second power supply wiring is arranged on one of the first conductive layer and the second conductive layer.

A liquid ejection head includes a recording element substrate including an energy generating element configured to generate energy for ejecting liquid from an ejection port; an electrical wiring board electrically connected to the recording element substrate to supply an electric signal for driving the energy generating element; a first support member supporting the recording element substrate; and a second support member supporting the first support member and having a greater linear expansion coefficient than the electrical wiring board, wherein the electrical wiring board is bonded to a first surface of the first support member and a second surface of the second support member, and an adhesive that bonds the electrical wiring board to the second surface has a lower elastic modulus than an adhesive that bonds the electrical wiring board to the first surface.

A multi-chip module (MCM) assembly comprising: a graphite substrate comprising a plurality of silicon chips directly attached to the graphite substrate, and a Printed Wiring Board (PWB) attached to the graphite substrate by means of a solvent-resistant adhesive glue and provided with openings surrounding outer profiles of the silicon chips. A printing bar comprising a plurality of the MCM assemblies is also disclosed.

A method of forming a print head, by forming a heater chip. Via zones having peripheries are defined on a substrate, with heaters formed along the entire peripheries of the via zones. Traces that electrically connect to each of the heaters are formed. In some embodiments, the heater chip is then stored for a period of time. After storing the heater chip, vias are formed in only a selected portion of the via zones, which is a subset of the via zones. A channel layer is formed on the heater chip by forming a first layer on the heater chip. Flow channels are formed in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones. Bubble chambers are formed in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones. A nozzle plate in formed on the channel layer by forming a second layer on the first layer, and forming nozzles in the second layer above only those heaters on the heater chip that are disposed along the selected portion of the via zones.

An integrated circuit to drive a plurality of fluid actuation devices includes an interface, a first sensor, a second sensor, and control logic. The interface is to connect to a single contact pad of a host print apparatus. The first sensor is of a first type and is coupled to the interface. The second sensor is of a second type and is coupled to the interface. The second type is different from the first type. The control logic enables the first sensor or the second sensor to provide an enabled sensor. A voltage bias or a current bias applied to the interface generates a sensed current or a sensed voltage, respectively, on the interface indicating the state of the enabled sensor.