In some examples, a media conditioner includes a conveying component to convey a sheet of printable media, a heating element to heat the conveying component, a temperature sensor to measure a temperature of the conveying component, a media sensor to detect the sheet of printable media, and a controller to provide a power level to the heating element. A temperature set-point is set to a pre-established value. Based on data from the temperature sensor, the controller is to maintain the temperature of the conveying component at the temperature set-point by varying the power level. The controller is to apply a boost to the power level based on a signal from the media sensor while the temperature set-point remains at the pre-established value.

An inkjet print apparatus includes a print head discharging ink onto a substrate, the print head including a first heater; a reservoir storing the ink; a first pipe supplying the ink to the reservoir; a second pipe collecting surplus ink; a mixing unit located on the first pipe and mixing the ink; a pump located on the second pipe and pressurizing and supplying the surplus ink to the reservoir; a temperature sensor located between the mixing unit and the print head and sensing a temperature of the ink; and a controller controlling a temperature of at least one of the first heater and the second heater in response to information received from the temperature sensor. The print head includes a heat insulator blocking heat emitted from the first heater between the substrate and the first heater.

A liquid ejection head includes an ejection orifice forming member having a liquid ejection orifice and a substrate having a liquid flow path such that a liquid circulation flow path is formed between the ejection orifice forming member and the substrate. The liquid circulation flow path includes a bubble generation chamber facing the liquid ejection orifice and is branched from the liquid flow path so as to pass through the bubble generation chamber and join the liquid flow path. The substrate has an ejection energy generation element arranged to face the bubble generation chamber and a circulation energy generation element arranged at a different position to face the liquid circulation flow path. The gap between the ejection energy generation element and the ejection orifice forming member is different from the gap between the circulation energy generation element and the ejection orifice forming member.

A substrate for liquid ejection head comprising, a base material, a heating element including a heating resistor layer for generating thermal energy for discharging a liquid, a wiring layer for supplying electric power to the heating element, and an interlayer insulating film for insulating the heating resistor layer and the wiring layer. A part of a first interlayer insulating film for insulating the heating resistor layer and a first wiring layer adjacent to the heating resistor layer, and a second interlayer insulating film for insulating the first wiring layer and a second wiring layer adjacent to the second interlayer insulating film, includes a material layer represented by Si.sub.wO.sub.xC.sub.yN.sub.z (w+x+y+z=100 (at. %), 37≤w≤60 (at. %), 30≤x≤53 (at. %), 6≤y≤−29 (at. %), 4≤z≤9 (at. %)).

The present invention provides a fine bubble generating apparatus capable of generating fine bubbles efficiently. The present invention includes a fluid flow passage that includes a narrow portion in at least a part thereof, a heating part capable of heating a liquid flowing through the fluid flow passage, and a controlling unit that controls the heating part. The controlling unit controls the heating part to generate film boiling in the liquid to generate ultrafine bubbles.

In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.

A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer structure is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a barrier layer, an ink-supply chamber and a nozzle, and the ink-supply chamber and the nozzle are integrally formed in the barrier layer.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing.

A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes plural ink-drop generators produced by the semiconductor process and formed on the chip substrate. The ink-drop generators are arranged in a longitudinal direction to form plural longitudinal axis array groups having a pitch maintained between two adjacent ink-drop generators in the longitudinal direction, and arranged in a horizontal direction to form plural horizontal axis array groups having a central stepped pitch equal to or less than 1/600 inches maintained between two adjacent ink-drop generators in the horizontal direction.

Provided is a liquid ejection module capable of enhancing the strength of an orifice plate while achieving favorable ejection operation at each ejection port. To that end, the liquid ejection module includes a functional layer in which a plurality of energy generating elements are arranged, a flow channel forming layer in which pressure chambers, individual flow channels, and a common flow channel are formed, and an orifice plate having ejection ports formed therein. The functional layer, the flow channel forming layer and the orifice plate are stacked. In the flow channel forming layer, a beam is formed, extending from a flow channel wall of the common flow channel toward the individual flow channels and supporting the orifice plate in a region facing a first opening.