A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer structure is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a barrier layer, an ink-supply chamber and a nozzle, and the ink-supply chamber and the nozzle are integrally formed in the barrier layer.

A droplet discharging device includes a head including a nozzle configured to discharge a droplet onto a medium, a heater configured to heat, the medium onto which the droplet is discharged from the head, at a position opposing to the head, an air blowing fan configured to blow outside air from an outside toward an inside of a housing that accommodates the head and the heater, a temperature sensor configured to detect a temperature of the outside air blown by the air blowing fan, and a control unit, and when the temperature of the outside air detected by the temperature sensor is lower than a preset temperature, the control unit changes a set temperature of the heater to a temperature lower than a predetermined temperature.

The present invention provides a method for forming a thermal inkjet printhead, comprising at least the following steps: providing a semiconductor wafer including an integrated electronic circuit and a section for forming a thermal actuator element, the integrated circuit comprising at least: a thermal insulating layer formed over a substrate; and a first metal layer formed over the thermal insulating layer; wherein the first metal layer extends into the section for forming the thermal actuator element; and etching a section for forming a thermal actuator element to the first metal layer such that the first metal layer is acting as an etch stop layer. Further there is provided a thermal inkjet printhead formed by a method of the present invention and a semiconductor wafer for forming the thermal inkjet printheads by a method of the present invention.

A service tank includes a container having an internal space, the container being provided with an inlet through which ink is introduced into the internal space and a plurality of supply ports through which the ink is supplied, a divider configured to divide the internal space into a plurality of compartments, and a detector configured to detect that the liquid surface of the ink is at an upper limit or a lower limit. The divider is attached between the inlet and a supply port located closest to the inlet. The divider includes a plate that prevents flow of the ink and air between adjacent compartments, an ink opening through which the ink flows between the adjacent compartments, and an air opening through which the air flows between the adjacent compartments. The plate, the ink opening, and the air opening are located in, below, and above the proper area, respectively.

Provided is a liquid ejection module capable of enhancing the strength of an orifice plate while achieving favorable ejection operation at each ejection port. To that end, the liquid ejection module includes a functional layer in which a plurality of energy generating elements are arranged, a flow channel forming layer in which pressure chambers, individual flow channels, and a common flow channel are formed, and an orifice plate having ejection ports formed therein. The functional layer, the flow channel forming layer and the orifice plate are stacked. In the flow channel forming layer, a beam is formed, extending from a flow channel wall of the common flow channel toward the individual flow channels and supporting the orifice plate in a region facing a first opening.

In a droplet ejection apparatus and a droplet ejection method using the droplet ejection apparatus, the droplet ejection apparatus includes a liquid supply unit, a nozzle and a standing wave generating unit. The liquid supply unit is configured to provide a pressure to a liquid. The nozzle is connected to the liquid supply unit through a connecting conduit, to eject the liquid with a droplet. The standing wave generating unit is configured to generate a standing wave around the nozzle at which the droplet is formed, to detach the droplet from the nozzle.

An element substrate comprises: a first insulation layer between a heater layer where plural heaters are formed, and a first wiring layer; and a second wiring layer formed within the first insulation layer, where an individual wiring connected to each heater is formed; a first metal plug that fills an interior of a first through-hole penetrating from the heater layer to the second wiring layer; and a second metal plug, provided in a place different from a place where the first through-hole is formed, that fills an interior of a second through-hole penetrating from the second wiring layer to the first wiring layer. Each heater is connected to the second wiring layer via the first metal plug, and the second wiring layer is connected to the first wiring layer via the second metal plug.

The printing apparatus includes a support part (platen) configured to support a recording medium (roll sheet), a printing part (printing unit) configured to form an image by discharging ink to a roll sheet supported on a platen while reciprocating in a main scanning direction, and a drying acceleration part configured to accelerate drying of the ink discharged by the printing unit and applied on the roll sheet in a state where the roll sheet is supported on the platen, in which a drying capacity of the drying acceleration part is higher in an end region of the platen than in a central region of the platen in a reciprocation direction of the printing unit.

A liquid discharge apparatus includes a heater configured to heat a medium, a detector configured to detect a temperature of the heater, a conveyor configured to convey the medium during a printing operation, and circuitry configured to control the heater to heat the medium with a first output during a preheating operation before the printing operation, control the heater to heat the medium with a second output that is equal to or higher than the first output when the temperature of the heater reaches a predetermined threshold value to complete the preheating operation, and control the conveyor to start conveying the medium to start the printing operation.

An inkjet chip including a substrate, a plurality of control elements, an insulating layer, a plurality of first conductive patterns, a plurality of second conductive patterns and a plurality of heaters is provided. The insulating layer is disposed on the control element and has a plurality of openings. The openings each have a first length in a first direction. Each first conductive pattern has a first sidewall overlapping one of the openings and is electrically connected between one of the control elements and one of the heaters. Each second conductive pattern has a second sidewall overlapping the one of the openings and is electrically connected to one of the heaters. A distance in the first direction is included between the first sidewall and the second sidewall opposing to each other. The distance is less than the first length. A thermal bubble inkjet printhead adopting the inkjet chip is also provided.