Provided is a liquid ejection head substrate including: a substrate; a liquid ejection element that generates liquid ejection energy on the substrate; and an electrode pad that is electrically connected to the liquid ejection element, in which the electrode pad includes a barrier metal layer and a bonding layer on the barrier metal layer, and an end side surface of the barrier metal layer is covered with a silicon-based film containing carbon.

According to an embodiment of the present disclosure, to improve a layout efficiency of an element substrate to be integrated in a printhead and reduce a production cost of the element substrate, a driving method and a size of a first driver transistor used for driving a first heater for ink circulation and a driving method and a size of a second driver transistor used for driving a second heater for discharging ink to print are optimized, respectively. More specifically, the first driver transistor and the second driver transistor have multi-finger configurations, gate widths of the multi-finger configurations are equal to each other, and the number of fingers forming each first driver transistor is different from the number of fingers forming each second driver transistor.

The liquid ejection head includes a plurality of element substrates including first and second element substrates and an electrical wiring substrate. The first and second element substrates each has a heating element array in which a plurality of heating elements producing heat energy for liquid ejection is arrayed, an electrically conductive protection layer covering the plurality of heating elements, an insulating layer arranged between the plurality of heating elements and the electrically conductive protection layer, and a connecting terminal for connecting to the outside. The electrical wiring substrate is electrically connected with the first and second element substrates via the connecting terminal. On the first and second element substrates, the connecting terminal includes a connecting terminal for the electrically conductive protection layer, and the electrically conductive protection layer is electrically connected to a common wiring provided on the electrical wiring substrate via the connecting terminal.

A method, a panel and equipment to form a digital print by applying dry ink, preferably including particles of pigment coated wood fibres, on a surface, bonding a part of the particles with a liquid blank ink drops and removing the non-bonded particles from the surface. A panel having a surface with a wood grain dcor, the panel including a first surface portion that is formed by a continuous basic layer including wood fibres having a first color, and a second surface portion that is formed by wood fibres having a second color, wherein the wood fibres having the second color are applied on and bonded to the continuous basic layer, and wherein the second surface portion covers a part of the first surface portion.

A liquid ejection head and its manufacturing method are capable of reducing the thickness of a protective layer as compared to the traditional technique so as to efficiently transfer the heat energy generated by a heating resistance element to a droplet of liquid such as ink. To achieve this, power supply wirings are provided in the same layer below the heating resistance element.

The printing apparatus includes a support part (platen) configured to support a recording medium (roll sheet), a printing part (printing unit) configured to form an image by discharging ink to a roll sheet supported on a platen while reciprocating in a main scanning direction, and a drying acceleration part configured to accelerate drying of the ink discharged by the printing unit and applied on the roll sheet in a state where the roll sheet is supported on the platen, in which a drying capacity of the drying acceleration part is higher in an end region of the platen than in a central region of the platen in a reciprocation direction of the printing unit.

A method of manufacturing a liquid supply unit includes a first molding step and a second molding step. In a first molding step, a resin is injected into different positions inside a mold assembly and a first member having a first contact portion, a second member having a second contact portion and an intermediate passage member having a passage structure to connect the first contact portion to the second contact portion are molded. In a second molding step, the mold assembly is disassembled, a die slide mold disposed inside the mold assembly is moved for positioning the members. Then, the mold assembly is clamped again and a resin is injected into the mold assembly. The first contact portion and the second contact portion are respectively held on the same surfaces inside the mold assembly during a period from the first molding step to completion of the second molding step.

An element substrate including heaters, drivers for each heater, and a diode, and connected to an external apparatus having a circuit for detecting a temperature based on a detection signal from the diode, comprises: a first wiring grounded, connected to one end of the diode, and serving as a reference voltage of the detection signal; a second wiring connected to the first wiring near the diode; a first pad connected to the first wiring; and a second pad connected to the second wiring. When the substrate is connected to the apparatus, a wiring serving as a reference voltage for a side where the detection signal of the circuit of the apparatus is inputted is connected to the second pad via the first pad connected to a ground serving as a reference voltage of the apparatus.

In example implementations, an apparatus with an interposer is provided. The apparatus may include an epoxy molded compound (EMC). A print head die and a drive integrated circuit (IC) may be embedded in the EMC. An interposer may also be embedded in the EMC. The print head die, the drive IC and the interposer may be wire bonded within the EMC.

An element substrate comprises: a first insulation layer between a heater layer where plural heaters are formed, and a first wiring layer; and a second wiring layer formed within the first insulation layer, where an individual wiring connected to each heater is formed; a first metal plug that fills an interior of a first through-hole penetrating from the heater layer to the second wiring layer; and a second metal plug, provided in a place different from a place where the first through-hole is formed, that fills an interior of a second through-hole penetrating from the second wiring layer to the first wiring layer. Each heater is connected to the second wiring layer via the first metal plug, and the second wiring layer is connected to the first wiring layer via the second metal plug.