A liquid ejection head includes an ejection-port formed member including liquid ejection ports, a substrate including liquid supply ports for supplying liquid to the ejection ports and a partition between the liquid supply ports, and a substrate supporting member. The liquid supply ports extend along the longitudinal direction of the substrate when viewed from a position facing the main surface of the substrate. The liquid supply ports are arrayed along the lateral direction of the substrate when viewed from the position facing the main surface. The partition includes a non-contact portion that is not in contact with the supporting member and a contact portion that is in contact with the supporting member. Of the liquid supply ports, adjacent liquid supply ports communicate with each other in the lateral direction through a gap between the non-contact portion and the supporting member, and liquid flows through the gap.

There is provided a liquid discharge head including a substrate having a pressure chamber, an actuator, and a channel member. The actuator has a first film arranged on the substrate and a second film arranged on a surface of the first film. The substrate and the channel member are attached to each other with an adhesive. A first through hole is formed in a part of the first film, and a second through hole is formed in a part of the second film. An edge of the first through hole is positioned further inward of the second through hole than an edge of the second through hole. The adhesive is applied to a part of the surface of the first film overlapping with the second through hole, so as to cover a boundary part between the first and second films.

A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The at least one inkjet chip is directly formed on the chip substrate by the semiconductor process, and the wafer is diced into the at least one inkjet chip, to be implemented for inkjet printing.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each ink-drop generator includes a barrier layer, an ink-supply chamber and a nozzle. The ink-supply chamber and the nozzle are integrally formed in the barrier layer.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing.

A liquid ejection head that includes ejection orifices and is configured by bonding a silicon substrate and a support substrate, flow passages which penetrate a bonding surface between the silicon substrate and the support substrate and through which different types of liquids flow. An in-partition wall space that is open to the bonding surface between the silicon substrate and the support substrate is formed in a partition wall for separating the flow passages. The internal pressure of the in-partition wall space is set to be lower than pressure of the liquid on each of the flow passages.

Various embodiments provide an ejection device for a fluid. The ejection device includes a first semiconductor wafer, housing, on a first side thereof, a piezoelectric actuator and an outlet channel for the fluid alongside the piezoelectric actuator; a second semiconductor wafer having, on a first side thereof, a recess and, on a second side thereof opposite to the first side, at least one inlet channel for said fluid fluidically coupled to the recess; and a dry-film coupled to a second side, opposite to the first side, of the first wafer. The first and the second wafers are coupled together so that the piezoelectric actuator and the outlet channel are set directly facing, and completely contained in, the recess that forms a reservoir for the fluid. The dry-film has an ejection nozzle.

An example fluidic device may comprise a fluidic die, a unitary molded structure, and a fluidic fan-out structure—The unitary molded structure may comprise thermo-electric traces and fluidic channels and may be coupled to the fluidic die. A first dimension of the fluidic channels is between ten μm to two hundred μm, or less. The fluidic fan-out structure may also be coupled to the molded structure. The fluidic die, the molded structure, and the fluidic fan-out structure may be arranged such that a first fluidic channel of the fluidic channels is in fluid communication with an aperture of the fluidic die at a first extremity and to a fluidic fan-out fluid channel through hole of the fluidic fan-out structure at a second extremity.

A liquid discharge head includes a channel unit. The channel unit is formed therein with: a plurality of individual channels aligning in a first direction, a common channel extending in the first direction, a supply hole in communication with the common channel, and a damper chamber provided in a position overlapping with the supply hole in a second direction orthogonal to the first direction. The channel unit includes a first plate having a first surface where a recess is formed to constitute the damper chamber, and a second plate having a second surface attached to the first surface via an adhesive. A protrusion is provided on a bottom of such a first part of the recess as overlaps with the supply hole in the second direction.