A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The at least one inkjet chip is directly formed on the chip substrate by the semiconductor process, and the wafer is diced into the at least one inkjet chip, to be implemented for inkjet printing.

A microfluidic die may include a microfluidic passage and a protective layer provided adjacent to internal surfaces of the microfluidic passage. The protective layer may include a protective nano-crystalline material and a protective amorphous matrix encapsulating the protective nano-crystalline material.

Example implementations relate to fluid feed holes. For example, a method of forming a fluid feed hole can include forming a via of a threshold size in a plurality of thin films of a fluid ejection die by removing a portion of the plurality of thin films, forming a fluid-attack-resistant material on the plurality of thin films and in the via, planarizing the fluid-attack-resistant material using chemical mechanical planarization (CMP), and forming the fluid feed hole by removing a portion of the planarized fluid-attack-resistant material in the via.

A liquid discharge head includes a nozzle from which a liquid is to be discharged; a pressure chamber communicating with the nozzle; a substrate defining a side wall the pressure chamber; a diaphragm having a surface on the substrate, the diaphragm defining a part of a wall of the pressure chamber and a part of the nozzle; and a piezoelectric element on another surface of the diaphragm opposite to the surface of the diaphragm on the substrate, the piezoelectric element including: a piezoelectric portion configured to vibrate; and a pair of electrodes sandwiching the piezoelectric portion between the pair of electrodes, and an area of at least one of the pair of electrodes of the piezoelectric element is larger than an area of the pressure chamber in a plane of the diaphragm.

Printheads and methods for forming printheads are described herein. In one example, a printhead includes a single resistor window in a conducting layer within the printhead. The printhead also includes a number of resistors formed in a resistor film deposited over the single resistor window. The resistors have two different widths, and each of the two different widths ejects a different droplet size when energized.

An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.

The present invention provides a method for forming a thermal inkjet printhead, comprising at least the following steps: providing a semiconductor wafer including an integrated electronic circuit and a section for forming a thermal actuator element, the integrated circuit comprising at least: a thermal insulating layer formed over a substrate; and a first metal layer formed over the thermal insulating layer; wherein the first metal layer extends into the section for forming the thermal actuator element; and etching a section for forming a thermal actuator element to the first metal layer such that the first metal layer is acting as an etch stop layer. Further there is provided a thermal inkjet printhead formed by a method of the present invention and a semiconductor wafer for forming the thermal inkjet printheads by a method of the present invention.

A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. A number of fluidic actuators are proximate to the fluid feed holes, to eject fluid received from the fluid feed holes A number of field-effect transistors are parallel to the fluid feed holes, where each of the fluidic actuators is powered by an associated field effect transistor. Logic circuitry to actuate the plurality of field-effect transistors is disposed on the die on an opposite side of the fluid feed holes from the field-effect transistors, wherein traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the field-effect transistors. The die has a repeating structure comprising one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.

A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays, proximate to a number of fluid feed holes. A number of address lines are disposed proximate to a number of logic circuits on a low-voltage side of the fluid feed holes. An address decoder circuit is coupled to at least a portion of the address lines to select a fluidic actuator in a fluidic actuator array for firing. The address decoder circuit is customized to select a different address for each fluidic actuator in the fluidic actuator array. A logic circuit triggers a driver circuit located in a high-voltage side of the plurality of fluid feed holes opposite the low-voltage side, based, at least in part, on a bit value for the fluidic actuator array, the fluidic actuator selected by the address decoder circuit, and a firing signal.

A liquid discharge head includes a substrate, a pressure chamber through which a first liquid and a second liquid flow while being in contact with each other, a pressure generating element configured to pressurize the first liquid, and a discharge port configured to discharge the second liquid. The substrate has a first channel and a second channel that each extend through the substrate. The first channel is used to supply the first liquid to the pressure chamber. The second channel is used to supply the second liquid to the pressure chamber. A viscosity of the second liquid is greater than a viscosity of the first liquid. An average cross-section area of the second channel is greater than an average cross-section area of the first channel.