A liquid ejection head has at least a structure including an ejection orifice forming member having an ejection orifice for ejecting a liquid and a flow path communicating with the ejection orifice and a flow path forming substrate having a liquid introduction flow path communicating with the flow path and supplying the liquid, and includes: a first titanium oxide film with a pure water contact angle of 40° or less; and a second titanium oxide film with a pure water contact angle of 70° or more, wherein the first titanium oxide film covers the structure including inner walls of the flow path and the liquid introduction flow path and is exposed in the flow path and the liquid introduction flow path, and the second titanium oxide film has a portion covering the first titanium oxide film in a vicinity of an opening end.

A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.

Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.

A liquid discharge head includes a substrate, a pressure chamber through which a first liquid and a second liquid flow while being in contact with each other, a pressure generating element configured to pressurize the first liquid, and a discharge port configured to discharge the second liquid. The substrate has a first channel and a second channel that each extend through the substrate. The first channel is used to supply the first liquid to the pressure chamber. The second channel is used to supply the second liquid to the pressure chamber. A viscosity of the second liquid is greater than a viscosity of the first liquid. An average cross-section area of the second channel is greater than an average cross-section area of the first channel.

A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

A liquid ejection head substrate includes a base layer, a heating resistance element provided over the base layer to generate a heat energy for ejecting a liquid, a first insulation layer covering the heating resistance element, and a protective layer having, on the first insulation layer, a first region which overlaps the heating resistance element via the first insulation layer and a second region which does not overlap the heating resistance element and formed of a material including a metal which is eluted by an electrochemical reaction. The liquid ejection head substrate further includes a second insulation layer provided over a region overlying the base layer and not provided with the protective layer and over the second region of the protective layer.

A liquid discharge head includes: a flow passage substrate which is formed with individual flow passages, the individual flow passages including nozzles and pressure chambers communicated with the nozzles respectively; actuators which are fixed to a surface of the flow passage substrate and which overlap with the pressure chambers respectively in an orthogonal direction; and a protective substrate which is fixed to the surface and which covers the actuators. The protective substrate has at least one wall portion for defining actuator accommodating chambers which accommodate the actuators respectively. The wall portion overlaps in the orthogonal direction with a partition wall for partitioning two pressure chambers in the flow passage substrate. The wall portion is adhered to the surface via an adhesive portion. A protective film is formed at portions of the protective substrate and the adhesive portion which define the actuator accommodating chambers.

Atomic-to-Nanoscale Matter Emission/Flow Regulation Devices, Systems and methods are set forth. An exemplary device can include a through-hole that has a top, and a nozzle configured to facilitate atomic-to-nanoscale matter emission/flow regulation formed in an etchable nozzle substrate. The nozzle can be configured at the smallest cross-section of the through-hole. A bottom can be formed in the nozzle substrate or selectively connected to the nozzle. Systems can include matter transportation/flow regulation columns, printing systems, etching systems and the like through which self-aligned nanodroplets or single-to-finite numbered ionic species/gas phase matter can flow under spontaneous or external excitation conditions (such as voltages) at atmospheric as well as regulated pressures.

A liquid discharge head including: a substrate having a liquid supply port; a flow channel forming member that is provided on the substrate and has discharge ports for discharging a liquid and a liquid flow channel that makes the liquid supply port and the discharge ports communicate with each other; and a support member that is provided on the substrate and arranged to be in contact with at least one surface of the flow channel forming member, with the one surface not being in contact with the liquid, wherein the flow channel forming member includes a cured product of a first photosensitive resin composition including a photosensitive resin, the support member includes a cured product of a second photosensitive resin composition including the epoxy resin A having a structure represented by formula (a1) or (a2) below in main chain structure: ##STR00001##
where, n.sub.1 and n.sub.2 represent integers of at least 2.