A manufacturing method for a structure includes preparing a dry film supported on one surface of a support; bonding the dry film to a substrate so that the dry film and the substrate are in contact with each other; performing first exposure of the dry film bonded to the substrate via the support; removing the support after the first exposure; performing second exposure of the dry film after the support is removed via a photomask; and developing the dry film after the first exposure and the second exposure.

A head includes: a silicon substrate; an insulating film on the silicon substrate; an electrode wiring on the insulating film; a flexible wiring connected to the electrode wiring; and a conductive film electrically connects the flexible wiring and the electrode wiring in a bonding area. The silicon substrate has an exposed area on a surface of the silicon substrate facing the insulating film, and the exposed area is in a vicinity of the bonding area and is exposed from the insulating film.

A dicing method including the steps of: bonding a first wafer having a first wafer resistivity and a second wafer having a second wafer resistivity higher than the wafer first resistivity, thereby forming a bonded wafer; irradiating the bonded wafer with a laser while varying focal lengths in a thickness direction of the bonded wafer, thereby forming a plurality of modified regions along a dicing line; and dicing the bonded wafer along the dicing line by performing an expansion process on the bonded wafer formed with the modified regions.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate.

A flow passage forming member includes flow passage forming member main bodies 140 and 146 that are formed of a resin material and define at least a part of a flow passage, a metal protective film 200 that is provided on a surface of the flow passage forming member main body 140 and a surface of the flow passage forming member main body 146 defining at least the flow passage and is formed of a metal material, and a protective film 210 that is laminated on the metal protective film 200 and contains an oxide or a nitride of at least on element selected from the group consisting of tantalum (Ta), titanium (Ti), zirconium (Zr), niobium (bib), vanadium (V), hafnium (Hf), silicon (Si), aluminum (Al), tungsten (W), and yttrium (Y).

A method of manufacturing a plurality of semiconductor chips for a liquid discharge head from a substrate includes forming trenches of a linear form through etching from the second surface along intended cutting portions, forming modified portions in the substrate by irradiating a laser beam from the first surface side along the intended cutting portions, and splitting the substrate into the plurality of semiconductor chips for a liquid discharge head, by cutting the substrate with stress applied to the modified portions. The intended cutting portions include inclined portions extending in a direction inclined with respect to a crystal orientation plane of the substrate and uninclined portions extending in a direction along the crystal orientation plane of the substrate, and the trenches are formed at least along the inclined portions.

A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X≧30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.

A piezoelectric device includes a diaphragm, a piezoelectric actuator, and an orientation layer between the diaphragm and the piezoelectric layer. The piezoelectric actuator has a first electrode, a piezoelectric layer, and a second electrode, with the first electrode, a piezoelectric layer, and a second electrode on the diaphragm. The orientation layer is a stack of two or more tiers.

A planarization layer and method therefor. The planarization layer has a thickness ranging from about 2 to about 3 microns, and contains from about 8.0 to about 8.5 wt. % photoacid generator; from about 2 to about 3.6 wt. % photoinitiator; from about 0.35 to about 0.5 wt. % green dye; from about 35 to about 46 wt. % multifunctional epoxy compound; from about 35 to about 50 wt. % of one or more difunctional epoxy compounds; and from about 1 to about 2.6 wt. % silane adhesion promoter, wherein all weight percent is based on a total weight of the layer devoid of solvent.

A fluid ejecting device including a die including a perimeter defined by a first edge, a second edge opposing the first edge, a third edge, and a fourth edge opposing the third edge, wherein the third and fourth edges are disposed at an angle to the first and second edges to form angular corners, an active area including circuitry for controlling the fluid ejecting device to eject fluid, an inactive area positioned between the perimeter and the active area, and a termination ring encircling the active area, the termination ring including sides extending parallel to the first, second, third, and fourth edges and corners coupling adjacent sides, the corners having a corner radius greater than a first distance between the first edge and one of the sides of the termination ring, and a nozzle to eject fluid.