A liquid discharge head including a first recording element substrate, a second recording element substrate, and a third recording element substrate successively arranged in a longer direction of the liquid discharge head, the first, second, and third recording element substrates each including a discharge port configured to discharge a liquid and an energy-generating element configured to generate energy used for discharging the liquid; a first support member supporting an end part of the first recording element substrate on a side of the second recording element substrate and an end part of the second recording element substrate on a side of the first recording element substrate; and a second support member supporting an end part of the second recording element substrate on a side of the third recording element substrate and an end part of the third recording element substrate on a side of the second recording element substrate.

A method for forming piezoelectric transducers for inkjet printheads includes: forming at least one piezoelectric layer on a substrate; forming at least one electrode pattern by depositing a conductive material on an exposed surface of the at least one piezoelectric layer; and forming a plurality of individual piezoelectric elements from the at least one piezoelectric layer before or after the forming of the at least one electrode pattern.

An ink-jet recording head includes a plurality of recording element substrates each having an ejection pressure generating element configured to generate pressure for ejecting ink from an ink discharge port. The plurality of recording element substrates each include a first surface on which the corresponding ejection pressure generating element is disposed and a second surface, serving as an end surface intersecting with the first surface, being at least partially formed by etching.

A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, continuous slotted recesses in a first surface of a wafer. The continuous slotted recesses may be arranged in parallel, spaced apart relation, and each continuous slotted recess may extend continuously across the first surface. The method may further include forming discontinuous slotted recesses in a second surface of the wafer to be aligned and coupled in communication with the continuous slotted recesses to define alternating through-wafer channels and slotted recess portions. The method may further include selectively filling the residual slotted recess portions to define through-wafer ink channels.

A piezoelectric element includes a first electrode, a piezoelectric layer formed of a first piezoelectric film which is formed on the first electrode and which includes potassium, sodium, and niobium and a plurality of second piezoelectric films which are formed on the first piezoelectric film and which include potassium, sodium, and niobium, and a second electrode formed on the piezoelectric layer, in which the piezoelectric layer is a stack of a plurality of piezoelectric films, the first piezoelectric film has a thickness of 30 nm to 70 nm, a concentration of sodium in each of the piezoelectric films is along a gradient in the film thickness direction with the first electrode side being high and the second electrode side being low.

Provided is a manufacturing method of a liquid ejection head, and the manufacturing method includes steps of: providing an ejection orifice forming member on one surface of a wafer, in which an energy-generating element is provided on the one surface of the wafer; forming a recess on the other surface of the wafer; and dicing the wafer along a plurality of dicing lines. The plurality of dicing lines include a dicing line extending in one direction and a dicing line extending in a direction crossing the one direction, and the recess is formed on each of positions overlapping the dicing lines except for an intersection part where the dicing line extending in the one direction intersects the dicing line extending in the direction crossing the one direction.

A piezoelectric device includes a diaphragm, a piezoelectric actuator, and an orientation layer between the diaphragm and the piezoelectric layer. The piezoelectric actuator has a first electrode, a piezoelectric layer, and a second electrode, with the first electrode, a piezoelectric layer, and a second electrode on the diaphragm. The orientation layer is a stack of two or more tiers.

An electro-mechanical transducer includes a diaphragm plate on a substrate, a first electrode on the diaphragm plate, an electro-mechanical transducer film on the first electrode, and a second electrode on the electro-mechanical transducer film. One of the first electrode and the second electrode is a common electrode. Another of the first electrode and the second electrode is an individual electrode. At least a portion of the common electrode is laminated on and in contact with the diaphragm plate. The common electrode has a plurality of holes penetrating the common electrode in a lamination direction.

A fluid ejection head may include an integrated chamber-orifice layer forming an ejection chamber and an ejection orifice, a fluid actuator to eject fluid within the chamber through the ejection orifice, an orifice shield and an adhesive layer bonding the orifice shield to the integrated chamber-orifice layer.

A process for handling MEMS wafers includes the steps of: (i) attaching a first carrier substrate to a first side of a MEMS wafer, the first carrier substrate being attached via a first wafer bonding tape and a silicone-free peel tape, the peel tape contacting the first side of the MEMS wafer; (ii) performing wafer processing steps on an opposite second side of the MEMS wafer; (iii) releasing the first carrier substrate from the first side of the MEMS wafer via exposure to an energy source, the energy source selectively releasing the wafer bonding tape from the first side of the MEMS wafer; and (iv) peeling the peel tape away from the first side of the MEMS wafer.