A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.

A leak mitigation device includes a planar portion and a tail portion. The planar portion has a first width. The tail portion has a proximal end and a distal end. The proximal end is attached to the planar portion and has a second width less than the first width. The planar portion and the tail portion comprise an absorbent material.

A liquid discharging head includes a pressure chamber partitioning portion that includes a plurality of partitioning walls that partition a pressure chamber in which a pressure to discharge a liquid is applied to the liquid, a diaphragm that includes a wall surface that faces the pressure chamber. The pressure chamber is located between the partitioning walls in a second direction. The wall surface of the diaphragm includes a first portion at a first position, and a second portion. A position of the second portion in the first direction is on an opposite side in the first direction with respect to a position of the first portion in the first direction.

Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction. Further, the irradiation operation with the laser is performed a plurality of times for each of the laser processing lines, and the irradiation operations with the laser performed along the same laser processing line of the plurality of laser processing lines are performed at a time interval from when ending a previous irradiation operation with the laser to when starting a subsequent irradiation operation with the laser.

A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.

Provided are an MEMS device, a liquid ejecting head, a liquid ejecting apparatus, a manufacturing method of a MEMS device, a manufacturing method of a liquid ejecting head and a manufacturing method of a liquid ejecting apparatus. Provided is a MEMS device that includes a first substrate on which a flexibly deformable thin film member is laminated, a second substrate disposed at an interval with respect to the first substrate, and an adhesion layer that adheres the first substrate to the second substrate, in which an end of the thin film member extends to the outside of the end of the first substrate in an in-plane direction of the first substrate.

A head chip capable of suppressing the degradation of the reliability, and a liquid jet head and a liquid jet recording device using the head chip are provided. The head chip includes an actuator plate having a plurality of ejection channels respectively communicated with nozzle holes and electrodes disposed on inner walls of the respective ejection channels, a bonded plate to be bonded to the actuator plate, and having a liquid contact surface which liquid entered the ejection channels has contact with, an adhesive layer disposed between the bonded plate and the actuator plate, and adapted to bond the bonded plate and the actuator plate to each other, and a protective film adapted to cover continuously from inner walls of the respective ejection channels to at least a part of the liquid contact surface via an end surface of the adhesive layer exposed on the ejection channel side.

A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

The fluid ejection microfluidic device, has a substrate; a buried cavity within the first substrate; a membrane formed by the first substrate and extending between the buried cavity and a first main surface of the substrate; and an access channel extending through the substrate, laterally and externally to the buried cavity and to the membrane and isolated with respect to the buried cavity. A sealed actuation structure extends over the first main surface of the substrate. A containment layer, of polymeric material, extends over the first main surface of the substrate and forms a fluid containment chamber accommodating the sealed actuation structure. A nozzle body of semiconductor material closes the fluid containment chamber at the top and is traversed by an ejection opening, forming, together with the fluid containment chamber and the access channel, a fluidic path.