Systems and methods to improve weld quality are described. For example, certain systems and methods described use weld quality monitoring as feedback to an ultrasonic welding process to improve weld quality. Still other systems and methods provide improvement to double sided and single sided ultrasonic welding through the use of selected multiple pulses.

Systems and methods to improve weld quality are described. For example, certain systems and methods described use weld quality monitoring as feedback to an ultrasonic welding process to improve weld quality. Still other systems and methods provide improvement to double sided and single sided ultrasonic welding through the use of selected multiple pulses.

Systems and methods to improve weld quality are described. For example, certain systems and methods described use weld quality monitoring as feedback to an ultrasonic welding process to improve weld quality. Still other systems and methods provide improvement to double sided and single sided ultrasonic welding through the use of selected multiple pulses.

Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

A medical device-includes a scaffold crimped to a catheter having an expansion balloon. The scaffold is crimped to the balloon by a process that includes inflating the delivery balloon during a diameter reduction to improve scaffold retention and maintaining an inflated balloon during the diameter reduction and prior and subsequent dwell periods.

A method of bonding a second object to a first object includes: providing the first object, which includes a thermoplastic liquefiable material in a solid state; providing the second object, which includes a surface portion that has a coupling structure with an undercut such that the second object can make a positive-fit connection with the first object; and pressing the second object against the first object with a tool that is in physical contact with a coupling-in structure of the second object while mechanical vibrations are coupled into the tool. The step of pressing and coupling vibrations into the tool continues until a flow portion of the thermoplastic material of the first object is liquefied and flows into the coupling structures of the second object. Thereafter, the thermoplastic material of the first object is permitted to re-solidify to yield a positive-fit connection between the first and second objects.

A compact pressing body with a pressing surface smaller in area than a welding range welds together sheet-like members over the whole area of the welding range by pressing the sheet-like members being reliably moved in a direction substantially orthogonal to a pressing direction of the pressing body.

Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

A method of anchoring a connector in a first object is provided, the connector having a thermoplastic material in a solid state. The method includes providing the first object and the connector, bringing the connector into contact with the first object from a distal side thereof, causing mechanical vibration energy to impinge on the first object from a proximal end face thereof, the proximal end face being opposite the distal side, while the object and the connector are pressed against each other, until a proximally facing end of connector is at least partially flowable forming a flow portion of the thermoplastic material, and causing the flow portion to flow into structures of the first object, and letting the flow portion re-solidify to cause a positive-fit connection between the first object and the connector.

A method of bonding a connector to a first object includes providing the first object and the connector, the connector extending between a proximal end and a distal end and has a connector body that forms a distally facing punching edge. At least one of the connector and of the first object includes a thermoplastic material in a solid state. The method further includes driving the connector into the first object and coupling mechanical vibration into the connector until the connector extends through a portion of the first object from a proximal side to a distal side thereof and material of the first object is punched out by the connector body, and until at least a flow portion of the thermoplastic material becomes flowable and flows relative to the first object and the connector body while the connector body remains solid. Thereafter, the thermoplastic material is allowed to re-solidify.