Provided is an UFB generating apparatus and an UFB generating method capable of efficiently generating an UFB-containing liquid with high purity. The ultrafine bubble generating apparatus includes a generating unit that generates ultrafine bubbles in a liquid and a post-processing unit that performs predetermined post-processing on the ultrafine bubble-containing liquid generated by the generating unit. The generating unit generates the ultrafine bubbles by causing a heating element, which is provided in the liquid on which the pre-processing is performed, to generate heat to generate film boiling on an interface between the liquid and the heating element.

According to an embodiment of this invention, the following data transfer between a printhead and a printing apparatus is performed. That is, a priority is set for each of a plurality of data to transfer the plurality of data. Print timings of the printhead are generated in accordance with a relative moving speed between the printhead and a print medium, and the print resolution of the printhead. Data to be transferred to the printhead in an interval between the generated print timing and the next print timing following the print timing are selected from the plurality of data based on the interval, the data length of each of the plurality of data, and the set priorities. The selected data are transferred to the printhead.

A liquid ejection head unit includes a first energy generating element that generates energy that applies pressure to a liquid in the first pressure chamber; a second energy generating element that generates energy that applies pressure to a liquid in the second pressure chamber; a nozzle flow path which communicates the first pressure chamber and the second pressure chamber and in which a nozzle that ejects a liquid is provided; a drive circuit that drives the first energy generating element and the second energy generating element by applying a drive pulse; a detection circuit that detects a parameter related to a physical property of a liquid in the second pressure chamber; wherein a controller drives the first energy generating element by the drive circuit, and performs a first detection operation of detecting the parameter in the second pressure chamber by the detection circuit.

A printhead manufacturing method includes preparing a printing element substrate including a receiver, first and second input pads, and plural selection pads, and preparing a head substrate including first and second transmission lines. The receiver includes first and second terminals for receiving signals, and the first and second input pads are connected to the first and second terminals, respectively, and the plural selection pads connected to the second terminal via at least two from among plural resistive elements to selectively obtain one of plural combined resistances. At least one of the plural selection pads is selected to be connected to the first transmission line to obtain a value of the one of the plural combined resistances. The selected selection pad is connected to the first transmission line, the first input pad is connected to the first transmission line, and the second input pad is connected to the second transmission line.

A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays, proximate to a number of fluid feed holes. A number of address lines are disposed proximate to a number of logic circuits on a low-voltage side of the fluid feed holes. An address decoder circuit is coupled to at least a portion of the address lines to select a fluidic actuator in a fluidic actuator array for firing. The address decoder circuit is customized to select a different address for each fluidic actuator in the fluidic actuator array. A logic circuit triggers a driver circuit located in a high-voltage side of the plurality of fluid feed holes opposite the low-voltage side, based, at least in part, on a bit value for the fluidic actuator array, the fluidic actuator selected by the address decoder circuit, and a firing signal.

Methods and apparatus to control a heater associated with a printing nozzle are disclosed. A method comprising controlling a heater associated with a printing nozzle to reduce a heat output of the heater based on a determination that the printing nozzle is outside a print area and printing an image on a substrate using other printing nozzles while the heat output of the heater is reduced.

A memory circuit for a print component including a plurality of I/O pads, including an analog pad, to connect to a plurality of signals paths which communicate operating signals to the print component, and a memory component to store memory values associated with the print component. A control circuit to, in response to identifying a sequence of operating signals representing a memory read, provide a first analog signal on the analog pad in parallel with a second analog signal from the print component to provide an analog electrical value on the analog pad representing stored memory values selected by the memory read.

An element substrate including a liquid discharge element, comprising a memory element capable of storing individual information of the element substrate by a write, the memory element being configured to change an impedance value by the write, a plurality of current supply elements capable of supplying a current to the memory element, and a determination unit configured to determine presence/absence of the write based on a voltage generated in the memory element by the current selectively supplied from the plurality of current supply elements, wherein the plurality of current supply elements constitute a part of a current mirror circuit and each supply the current in an amount according to a size ratio to the memory element.

A method for processing a silicon substrate includes forming a structure having a bottom surface and a depth of 200 μm or more or 300 μm or more from a first surface of a silicon substrate, forming a protective film on an inner wall of the structure, and performing plasma etching so as to selectively remove the protective film disposed on the bottom surface of the structure with respect to the protective film disposed on the substantially perpendicular side wall of the structure, wherein the plasma etching is performed under the condition in which plasma with a sheath length at least 10 times the depth when the depth is 200 μm or more, or at least 5 time the depth when the depth is 300 μm or more, is generated and a mean free path of ions generated in the plasma is longer than the sheath length.

A firing circuit for a thermal inkjet-printing nozzle includes a heater resistor and a switch. The heater resistor heats ink to cause the ink to be ejected from the nozzle. The heater resistor has a first end and a second end, the second end connected to a ground. The switch controls activation of the heater resistor. The switch has a first end connected to a voltage source and a second end connected to the first end of the heater resistor. The switch operates in a constant current mode, such that an at least substantially constant current flows through the heater resistor upon activation.