Patent classifications
B41J2/1639
Manufacturing method of liquid ejection head
A manufacturing method of a liquid ejection head, which includes a step of preparing a substrate including a first layer, a step of forming a flow path mold for forming the flow path and a member located outside the mold with a gap between the mold and the member from the first layer, a step of providing a second layer so that the second layer fills the gap and covers the mold and the member located outside the mold with the gap between them, a step of forming an ejection orifice forming member for forming an ejection orifice from the second layer, a step of removing the member located outside the mold with the gap between them, and a step of forming a wall member located outside the ejection orifice forming member with at least a partial gap between the ejection orifice forming member and the wall member.
Liquid discharge head and method of manufacturing the same
A liquid discharge head provided with a member having discharge ports formed configured to discharge liquid thereon, wherein a discharge port surface of the member having discharge ports arrayed thereon includes fumed silica.
Liquid discharge head and method for producing liquid discharge head
A liquid discharge head is provided which has a substrate, a flow channel forming member provided on a substrate surface of the substrate and forming a flow channel of a liquid, and a discharge port forming member provided on the flow channel forming member and having a discharge port through which a liquid is discharged, wherein the discharge port forming member and the flow channel forming member are formed of materials different from each other, a thickness of the flow channel forming member is greater than a thickness of the discharge port forming member in a direction perpendicular to the substrate surface, the discharge port forming member is a cured product of a photosensitive resin composition, and the flow channel forming member contains at least one resin selected from the group consisting of a polyether amide resin, a polyether imide resin and a polyether amide-imide resin.
Molded die slivers with exposed front and back surfaces
In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
PRINTING ELEMENT AND METHOD FOR MANUFACTURING SAME
A printing element is used, which includes a substrate, an intermediate layer, and a channel forming member layered in this order. The substrate has a common liquid chamber. The channel forming member has a second surface that is a surface facing the substrate via the intermediate layer, and a first surface that is an opposite surface to the second surface. The first surface is formed with a plurality of ejection ports that eject liquid from the common liquid chamber. The second surface is formed with a plurality of channels that make each of the plurality of ejection ports and the common liquid chamber communicate with each other, and a plurality of substantially parallel beam structures, the plurality of beam structures forming a slit portion therebetween.
Dry film formulation
An improved photoimageable dry film formulation, a fluidic ejection head containing a thick film layer derived from the improved photoimageable dry film formulation, and a method for making a fluidic ejection head. The improved photoimageable dry film formulation includes a multifunctional epoxy compound, a photoinitiator capable of generating a cation, a non-photoreactive solvent, and from about 0.5 to about 5% by weight a silane oligomer adhesion enhancer based on a total weight of the photoimageable dry film formulation before drying.
MOLDED STRUCTURES WITH CHANNELS
An example fluidic device may comprise a fluidic die, a unitary molded structure, and a fluidic fan-out structure—The unitary molded structure may comprise thermo-electric traces and fluidic channels and may be coupled to the fluidic die. A first dimension of the fluidic channels is between ten μm to two hundred μm, or less. The fluidic fan-out structure may also be coupled to the molded structure. The fluidic die, the molded structure, and the fluidic fan-out structure may be arranged such that a first fluidic channel of the fluidic channels is in fluid communication with an aperture of the fluidic die at a first extremity and to a fluidic fan-out fluid channel through hole of the fluidic fan-out structure at a second extremity.
MICROFLUIDIC PASSAGE WITH PROTECTIVE LAYER
A microfluidic die may include a microfluidic passage and a protective layer provided adjacent to internal surfaces of the microfluidic passage. The protective layer may include a protective nano-crystalline material and a protective amorphous matrix encapsulating the protective nano-crystalline material.
Fluid ejection device
Examples include a fluid ejection die embedded in a molded panel. The fluid ejection die comprises a substrate, and the substrate includes an army of nozzles extending therethrough. The substrate has a first surface in which nozzle orifices are formed and a second surface, opposite the first surface, in which nozzle inlet openings are formed. The fluid ejection die is embedded in the molded panel such that the first surface of the substrate is approximately planar with a top surface of the molded panel. The molded panel has a fluid channel formed therethrough in fluid communication with the nozzle inlet openings of the array of nozzles.
FLUIDIC DEVICE WITH NOZZLE LAYER CONDUCTORS
One example provides a fluidic device including a substrate, a nozzle layer disposed on the substrate, the nozzle layer having an upper surface opposite the substrate including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A number of conductive traces are disposed in direct contact with the nozzle layer to provide electrical pathways above the substrate.