A method for producing a substrate that includes a protective layer made from a metal oxide protecting silicon against corrosion and an organic resin layer on a substrate surface of a silicon substrate includes the following steps in this order: step A of forming the protective layer on the substrate surface; step B of removing the protective layer from the substrate surface in a region Z1 that is a part of the region in which the protective layer has been formed; and step C of providing an organic resin layer on the substrate surface in a region Z2 including the region Z1.

At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

A liquid ejection head includes an ejection orifice forming surface provided with an ejection orifice from which a liquid is ejected. The ejection orifice forming surface includes a first region in a vicinity of the ejection orifice, a second region that is further spaced apart from the ejection orifice than the first region and protrudes from the first region in a liquid ejection direction and a third region that connects the first region and the second region. When a contact angle of pure water in the first region is a first contact angle θ1 and a contact angle of pure water in the third region is a third contact angle θ3, θ1 is larger than θ3 by 10 degrees or more.

A printing element includes a substrate, an intermediate layer, and a channel forming member layered in this order. The substrate has a common liquid chamber. The channel forming member has a second surface that is a surface facing the substrate via the intermediate layer, and a first surface that is an opposite surface to the second surface. The first surface is formed with a plurality of ejection ports that eject liquid from the common liquid chamber. The second surface is formed with a plurality of channels that allow each of the plurality of ejection ports and the common liquid chamber to communicate with each other, and a plurality of substantially parallel beam structures, the plurality of beam structures forming a slit portion therebetween.

Provided is a photosensitive structural body including: a substrate having a hydroxy group on a first surface thereof; and a cured product of a negative photosensitive resin composition arranged on the substrate, wherein the negative photosensitive resin composition contains an epoxy compound (A), a photobase generator (B), and an aromatic compound (C), and the aromatic compound (C) is a compound represented by the following general formula (1):

##STR00001##

in the general formula (1), four of R.sub.1 to R.sub.6 each independently represent a hydrogen atom or an alkyl group, and remaining two thereof each independently represent a functional group selected from an unsubstituted amino group (—NH.sub.2), a hydroxy group (—OH), and a carboxyl group (—COOH), provided that the two functional groups each selected from an unsubstituted amino group, a hydroxy group, and a carboxyl group are functional groups different from each other.

A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate includes an array of nozzle holes and a fluid channel layer attached to an exposed surface of the nozzle plate, wherein the fluid channel layer comprises a fluid channel formed in the fluid channel layer adjacent to each nozzle hole for urging fluid from each nozzle hole.

A method of manufacturing a structure that includes a substrate provided with a through hole, and a resin layer provided on a front surface of the substrate to close the through hole, includes, in order, preparing the substrate including the through hole and including a support substrate on a back surface of the substrate to close the through hole, bonding a dry film to a front surface of the substrate, the dry film including a support member and a resin layer on the support member, to close the through hole with the resin layer and turn the through hole into a closed space with the substrate, the support substrate, and the dry film, opening the through hole turned into the closed space from the support substrate side, and separating the support member from the dry film while retaining the resin layer on the front surface of the substrate.

A thermal bend actuator includes: a thermoelastic beam for connection to drive circuitry; and a passive beam mechanically cooperating with the thermoelastic beam, such that when a current is passed through the thermoelastic beam, the thermoelastic beam expands relative to the passive beam resulting in bending of the actuator. The thermoelastic beam wherein the thermoelastic beam is comprised of an aluminium alloy. The aluminium alloy comprises a first metal which is aluminium, a second metal, and at least 0.1 at. % of a third metal selected from the group consisting of: copper, scandium, tungsten, molybdenum, chromium, titanium, silicon and magnesium.

A hydrophilic coating material including an alginic acid compound and a resin, in which the alginic acid compound is granulated and dispersed in the resin. In a coating film using the material, it is preferred that the granulated alginic acid compound is exposed on the surface. Such a hydrophilic coating film is suitable as a hydrophilization treatment film of a nozzle face surface of an inkjet recording head.

A method for producing a laminate of a cured material from a photosensitive resin composition (1) and a photosensitive resin composition (2), wherein the method includes a step of obtaining a laminated material by laminating the composition (2) onto the composition (1); a step of subjecting the laminated material to photoexposure to obtain a photocured material; a step of developing the photocured material to obtain a developed material; and a step of heating the developed material to obtain a laminate, wherein the photoexposure dose required to cure the composition (2) is smaller than the dose required to cure the composition (1), and wherein the composition (1) contains an epoxy resin (1) having a weight-average molecular weight Mw of 5,000 to 600,000, a softening point of at least 140° C., and an epoxy equivalent weight of not more than 2,300.