A nozzle plate includes, on a substrate: at least a base layer; an intermediate layer; and a liquid repellent layer. The base layer contains a silane coupling agent A having reactive functional groups at both terminals and including a hydrocarbon chain and a benzene ring at an intermediate part. The intermediate layer contains an inorganic oxide. The liquid repellent layer contains a fluorine (F)-containing coupling agent B.

The head has a passage member having a nozzle and a pressurizing chamber which is communicated with the nozzle and is positioned on the side opposite to the side where the nozzle is opened, a piezoelectric actuator substrate which is superimposed on the passage member so as to cover the pressurizing chamber, and a flexible printed circuit which faces the piezoelectric actuator substrate from the opposite side to the passage member. The piezoelectric actuator substrate has a piezoelectric body which is exposed on the flexible printed circuit side. The piezoelectric body has a via hole opened toward the flexible printed circuit and has a projection portion at the edge part of the via hole which projects to the flexible printed circuit side.

A liquid discharge head includes an actuator base, a case member, and a nozzle plate. The actuator base includes a plurality of grooves space from each other in a first direction. Each of the grooves extends in a second direction. The actuator base is formed of a piezoelectric ceramic material. The case member includes a frame portion spaced from the actuator base in the second direction. The frame portion has an end surface in the third direction that is level with an end surface of the actuator base in the third direction. The frame portion is formed of a ceramic material having aluminum titanate as a main component. The nozzle plate is contacting the end surface of the frame portion and the end surface of the actuator base.

An inkjet head manufacturing method for an inkjet head that includes a head chip including: a nozzle ejecting ink; and a flow path substrate including an ink flow path which communicates with the nozzle and through which the ink flows, the method including: composite substrate manufacturing that is manufacturing a composite substrate including a plurality of regions which forms flow path substrates by being split; first protective film forming that is forming a first protective film on a surface of the composite substrate and an inner wall surface of the ink flow path; splitting that is splitting the composite substrate into the flow path substrates; and second protective film forming that is forming a second protective film on at least an exposed face in a split face of the flow path substrate generated in the splitting, the exposed face being exposed in a surface of the head chip.

An electro-mechanical transducer includes a diaphragm plate on a substrate, a first electrode on the diaphragm plate, an electro-mechanical transducer film on the first electrode, and a second electrode on the electro-mechanical transducer film. One of the first electrode and the second electrode is a common electrode. Another of the first electrode and the second electrode is an individual electrode. At least a portion of the common electrode is laminated on and in contact with the diaphragm plate. The common electrode has a plurality of holes penetrating the common electrode in a lamination direction.

A fluid ejection head may include an integrated chamber-orifice layer forming an ejection chamber and an ejection orifice, a fluid actuator to eject fluid within the chamber through the ejection orifice, an orifice shield and an adhesive layer bonding the orifice shield to the integrated chamber-orifice layer.

A liquid discharge head includes a pressure chamber in which liquid can be stored, a diaphragm forming a bottom wall of the pressure chamber and having a nozzle opening through which liquid supplied from the pressure chamber is discharged in a first direction, and a drive element on a lower surface of the diaphragm and configured to change a volume of the pressure chamber. A protective film covers the drive element and having a first opening corresponding in position with the nozzle opening, and a liquid repellent film covers the protective film and the lower surface of the diaphragm within the first opening. The liquid repellent film has an opening aligned with the nozzle opening and has the same diameter as the nozzle opening. The liquid repellent film on the drive element is thinner than the liquid repellent film on the lower surface of the diaphragm within the first opening.

The trouble of removing a protective film such as a poly-paraxylene film from the part not requiring the protective film is reduced. A method of manufacturing a head chip according to an aspect of the present disclosure includes a substrate preparation step of preparing an actuator plate substrate having a jet channel communicated with a nozzle hole configured to jet ink, and a non-jet channel which does not jet the ink, and a protective film formation step of forming a protective film configured to protect a common electrode formed on an inner surface of the jet channel from the ink in a state in which the jet channel is exposed and the non-jet channel is covered after the substrate preparation step.

There are provided a head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing the head chip each capable of preventing the short circuit of electrodes by ink to maintain an excellent ejection performance over a long period of time. The head chip according to an aspect of the present disclosure includes an actuator plate, a cover plate, and an intermediate plate. In the actuator plate, open apertures which communicate an inside and an outside of a non-ejection channel with each other are formed in both end portions of the non-ejection channel in a Y direction. In the actuator plate, open apertures which communicate an inside and an outside of a non-ejection channel with each other are formed in both end portions of the non-ejection channel in the Y direction.

A wafer structure is disclosed and includes a chip substrate and an inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of 12 inches. The inkjet chips are formed on the chip substrate by the semiconductor process and diced into the inkjet chip. The inkjet chip includes plural ink-drop generators generated by the semiconductor process on the chip substrate. Each of the plurality of ink-drop generators includes a nozzle. A diameter of the nozzle is in a range between 0.5 micrometers and 10 micrometers. A volume of an inkjet drop discharged from the nozzle is in a range between 1 femtoliter and 3 picoliters. The ink-drop generators form plural longitudinal axis array groups having a pitch and plural horizontal axis array groups having a central stepped pitch equal to or less than 1/600 inches.