Patent classifications
B41J2/1643
Inkjet head and image forming method
Provided is an inkjet head containing: a substrate having a nozzle hole, and a nozzle plate having a liquid repellent layer on an outermost surface of the substrate on an ink discharge surface side, wherein the nozzle plate has a conductive layer between the substrate and the liquid repellent layer.
SINGLE CRYSTAL SILICON SUBSTRATE, LIQUID DISCHARGE HEAD, AND METHOD FOR MANUFACTURING SINGLE CRYSTAL SILICON SUBSTRATE
A single crystal silicon substrate at least a part of which constitutes a flow path for liquid includes a first through-hole including an inclined side wall inclined with respect to a substrate surface of the single crystal silicon substrate, and a second through-hole constituting the flow path and including a side wall constituted by a vertical side wall more nearly vertical to the substrate surface than the inclined side wall is. The first through-hole is formed by crystal anisotropic etching. The second through-hole is formed by metal-assisted chemical etching.
SINGLE CRYSTAL SILICON SUBSTRATE, LIQUID DISCHARGE HEAD, AND METHOD FOR MANUFACTURING SINGLE CRYSTAL SILICON SUBSTRATE
A single crystal silicon substrate at least a part of which constitutes a flow path for liquid includes a through-hole constituting a part of the flow path and extending through the single crystal silicon substrate in a direction intersecting a substrate surface of the single crystal silicon substrate. The through-hole is formed by metal-assisted chemical etching, and includes a striped portion in which at least one of a concave portion or a convex portion along a direction in which the liquid flows extends.
Liquid ejecting head and manufacturing method thereof
In a liquid ejecting head, an electrical connection portion between an element substrate and a wiring substrate can be satisfactorily sealed, and a decrease in yield and an increase in manufacturing cost can be suppressed. The liquid ejecting head includes the element substrate having a plurality of energy generating elements and a plurality of electrodes, and the wiring substrate having a plurality of electrode terminals connected to the plurality of electrodes. The element substrate and the wiring substrate are overlapped with each other in a state where the electrode and the electrode terminal face each other, a connection portion is surrounded by a resin layer, and the resin layer is covered with a sealing resin. The resin layer is divided into a plurality of portions by a gap provided in a portion between both end portions of the electrode terminal in an arrangement direction. An inside of the gap is filled with the sealing resin.
ELEMENT SUBSTRATE, LIQUID DISCHARGE HEAD, AND MANUFACTURING METHOD OF SAME
An element substrate used in a liquid discharge head that discharges liquid to a recording material includes a substrate, an energy generating element that generates energy used to discharge the liquid, circuit wiring that has an electrode portion for external electrical connection and that drives the energy generating element, and that is implemented on the substrate, a first protective film layer that has an opening portion for exposing the electrode portion and that covers the circuit wiring, an electroplating ground layer formed on the electrode portion, and an electroplated bump layer made of a metal material formed on the electroplating ground layer. A bent portion is formed in the first protective film layer by the first protective film layer covering a protruding portion that the circuit wiring has. A second protective film layer is formed on the first protective film layer and covers the bent portion.
MOLDED STRUCTURES WITH CHANNELS
At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.
ACTUATOR, LIQUID DISCHARGE HEAD, AND LIQUID DISCHARGE APPARATUS
An actuator includes a substrate, a diaphragm over the substrate, a lower electrode over the diaphragm, a lead titanate (PbTiO.sub.3) layer over the lower electrode, a piezoelectric body over the PbTiO.sub.3 layer, and an upper electrode over the piezoelectric body. The piezoelectric body comprises particles of lead zirconate titanate (PZT). An average diameter of the particles of the PZT is 40 nm or more. The average diameter is measured by capturing an electron backscatter diffraction image of the piezoelectric body in an image area of 20 μm 20 μm, fitting each of the particles in the image area, and determining an average value of diameters of the circles.
Fluidic dies with conductive members
Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of a back surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.
Method for Manufacturing Piezoelectric Actuator
A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.
INKJET HEAD AND IMAGE FORMING METHOD
Provided is an inkjet head containing: a substrate having a nozzle hole, and a nozzle plate having a liquid repellent layer on an outermost surface of the substrate on an ink discharge surface side, wherein the nozzle plate has a conductive layer between the substrate and the liquid repellent layer.