The present disclosure provides a display panel motherboard, including a first substrate and a second substrate arranged opposite to each other to form a cell. A display region and a non-display region surrounding the display region are provided at the first substrate and the second substrate. At the non-display region of the first substrate, a first spacer and a second spacer are arranged sequentially in a direction away from the display region of the first substrate. A vertical distance d1 between an end surface of the first spacer adjacent to the second substrate and a surface of the second substrate adjacent to the first substrate is equal to a vertical distance d2 between an end surface of the second spacer adjacent to the second substrate and the surface of the second substrate adjacent to the first substrate.

An electrochromic structure can include a substrate and an electrochromic residue disposed on the substrate. The electrochromic structure can include an electrochromic stack on the substrate. A process can be used to separate the structure. The process can include forming a filament in the substrate and applying a thermal treatment to the substrate. Forming a filament can be performed by applying a pulse of laser energy to the substrate. In a particular embodiment, a filament pattern including a plurality of filaments can be formed in the substrate. The substrate can include mineral glass, sapphire, aluminum oxynitride, spinel, or a transparent polymer.

Methods and apparatus provide for: sourcing an ultra-thin glass sheet having first and second opposing major surfaces and perimeter edges therebetween, the glass sheet having a thickness between the first and second surfaces of less than about 400 microns; adhering at least one polymer layer directly or indirectly to at least one of the first and second surfaces of the glass sheet to form a laminated structure; and cutting the laminated structure using at least one of the following techniques: shear cutting, burst cutting, slit cutting, and crush cutting.

Provided is an apparatus for cutting a glass laminated substrate, the apparatus including a first rotating plate, a second rotating plate, and a connection member interposed between the first rotating plate and the second rotating plate and configured to rotate around the first axis, in which a channel having a ring shape surrounding an outer circumferential surface of the connection member is formed between the first rotating plate and the second rotating plate.

Polarizing optical devices described herein, and polarizing optical devices resulting from methods described herein, can be small and can have high heat tolerance. Wires of wire grid polarizers can be attached directly to prisms of the polarizing optical devices, allowing for small size. Multiple polarizing optical devices can be attached by adhesive-free bonding techniques, allowing high heat tolerance.

Polarizing optical devices described herein, and polarizing optical devices resulting from methods described herein, can be small and can have high heat tolerance. Wires of wire grid polarizers can be attached directly to prisms of the polarizing optical devices, allowing for small size. Multiple polarizing optical devices can be attached by adhesive-free bonding techniques, allowing high heat tolerance.

A process for manufacturing a bent laminated glazing, includes manufacturing a first bent laminated glazing including at least two glass substrates locally comprising, in each of the at least two glass substrates and facing each other in all the at least two glass substrates, a zone including compressive stresses, and cutting the first bent laminated glazing through its entire thickness along a line included in the zone in order to form local cut edges and, after cutting, a second bent laminated glazing with the local cut edges having compressive edge stresses.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Apparatuses and methods for heating moving continuous glass ribbons at desired lines of separation and/or for separating glass sheets from continuous glass ribbons are disclosed. An apparatus includes a translatable support portion and a heating apparatus coupled to the support portion. The heating apparatus is configured to contact the continuous glass ribbon across at least a portion of a width of the continuous glass ribbon at the desired line of separation as the support portion moves in a draw direction, thereby preferentially applying heat to a first side of the continuous glass ribbon at the desired line of separation as the continuous glass ribbon moves in the draw direction.

A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion .sub.core, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion .sub.clad, where .sub.clad>.sub.core; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.