An ultrasonic transducer that includes a delay line, a piezoelectric element, and a metal conductive layer between the delay line and the piezoelectric element. The delay line and the piezoelectric element are acoustically joined with an atomic diffusion bond to facilitate coupling ultrasonic waves from the piezoelectric element into the delay line or from the delay line into the piezoelectric element.

A method of producing an ultrasonic transducer includes providing a delay line substrate, providing a piezoelectric substrate as a transducer element, depositing a metal conductive layer on one of the delay line substrate and the piezoelectric substrate, forming an atomic diffusion bond between the metal conductive layer and one of the delay line substrate and the piezoelectric substrate, patterning removal of a portion of the piezoelectric substrate to expose the metal conductive layer, depositing a first patterned electrode on the exposed metal conductive layer to allow external electrical connection to the exposed metal conductive layer, and depositing a second patterned electrode on the piezoelectric substrate to form an active area of the ultrasonic transducer and to allow external electrical connection to be made.

An ultrasonic transducer that includes a delay line, a piezoelectric element, and a metal conductive layer between the delay line and the piezoelectric element. The delay line and the piezoelectric element are acoustically joined with an atomic diffusion bond to facilitate coupling ultrasonic waves from the piezoelectric element into the delay line or from the delay line into the piezoelectric element.