An article that includes: SiO.sub.2 from 40 mol % to 80 mol %; Al.sub.2O.sub.3 from 1 mol % to 15 mol %; B.sub.2O.sub.3 from 5 mol % to 50 mol %; WO.sub.3 from 1 mol % to 15 mol %; WO.sub.3 plus MoO.sub.3 from 1 mol % to 18 mol %; SnO.sub.2 from 0.01 mol % to 1 mol %; and R.sub.2O from 1.1 mol % to 16 mol %. The R.sub.2O is one or more of Li.sub.2O, Na.sub.2O, K.sub.2O, Rb.sub.2O and Cs.sub.2O. R.sub.2O minus Al.sub.2O.sub.3 ranges from +0.1 mol % to +4 mol %.

Photosensitive lithium zinc aluminosilicate glasses that can be selectively irradiated and cerammed to provide patterned regions of glass and lithium-based glass ceramic, and composite glass articles made from such glasses and glass ceramics are provided. Compressive and tensile stress at the interface of the lithium-based glass-ceramic and lithium zinc aluminosilicate glass may be used to frustrate crack propagation in such a composite glass/glass ceramic article. Methods of making composite glass articles comprising such lithium-based glass ceramics and lithium zinc aluminosilicate glasses are also provided.

Photosensitive lithium zinc aluminosilicate glasses that can be selectively irradiated and cerammed to provide patterned regions of glass and lithium-based glass ceramic, and composite glass articles made from such glasses and glass ceramics are provided. Compressive and tensile stress at the interface of the lithium-based glass-ceramic and lithium zinc aluminosilicate glass may be used to frustrate crack propagation in such a composite glass/glass ceramic article. Methods of making composite glass articles comprising such lithium-based glass ceramics and lithium zinc aluminosilicate glasses are also provided.

A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

Photosensitive lithium zinc aluminosilicate glasses that can be selectively irradiated and cerammed to provide patterned regions of glass and lithium-based glass ceramic, and composite glass articles made from such glasses and glass ceramics are provided. Compressive and tensile stress at the interface of the lithium-based glass-ceramic and lithium zinc aluminosilicate glass may be used to frustrate crack propagation in such a composite glass/glass ceramic article. Methods of making composite glass articles comprising such lithium-based glass ceramics and lithium zinc aluminosilicate glasses are also provided.

Photosensitive lithium zinc aluminosilicate glasses that can be selectively irradiated and cerammed to provide patterned regions of glass and lithium-based glass ceramic, and composite glass articles made from such glasses and glass ceramics are provided. Compressive and tensile stress at the interface of the lithium-based glass-ceramic and lithium zinc aluminosilicate glass may be used to frustrate crack propagation in such a composite glass/glass ceramic article. Methods of making composite glass articles comprising such lithium-based glass ceramics and lithium zinc aluminosilicate glasses are also provided.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

The present invention includes a device and method for making an RF circulator/isolator device comprising: a substrate comprising one or more conductive coils, wherein the one or more conductive coils are formed in, on, or about the substrate; an opening in the substrate comprising an iron core, wherein the iron core is formed in the substrate after the formation of the one or more conductive coils, wherein the iron core is positioned and shaped to create a circulator/isolator in the substrate; and one or more connectors, vias, resistors, capacitors, or other integrated circuits of devices connected to the conductive coils of the circulator/isolator.

The present invention includes a device and method for making an RF circulator/isolator device comprising: a substrate comprising one or more conductive coils, wherein the one or more conductive coils are formed in, on, or about the substrate; an opening in the substrate comprising an iron core, wherein the iron core is formed in the substrate after the formation of the one or more conductive coils, wherein the iron core is positioned and shaped to create a circulator/isolator in the substrate; and one or more connectors, vias, resistors, capacitors, or other integrated circuits of devices connected to the conductive coils of the circulator/isolator.

The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.