The present disclosure discloses a lithium and tellurium-silicate binary glass-oxide-complex system and a conductive paste containing the complex system, and belongs to the technical field of solar cells. The present disclosure uses a “functional modularity” strategy in the formula design of a glass-oxide-complex system (GOC). Alkali metal ions with high migration and reactivity are separated from a glass body with high fluidity, thus a binary complex system is constructed, that is, a lithium-containing glass-oxide-complex (Li-GOC) with high activity and a tellurium-silica-containing glass-oxide-complex (Si—Te-GOC) with high fluidity. Through the modularized formula strategy, active ingredients can be better controlled, so as to obtain more balanced contact and open circuit voltage and improve the photoelectric conversion efficiency of a solar cell.

The present disclosure discloses a lithium-tellurium silicon-lead bismuth multi-component glass-oxide-complex system and conductive paste containing same, belonging to the technical field of solar cells. According to the present disclosure, a “functional modularization” strategy is adopted in a formula design of the glass-oxide-complex system, and glass oxide systems with selective reactivity for different passivation layers are compounded based on the structures, compositions and thicknesses of the passivation layers, so that a paste formula is developed, which is composed of lithium-containing, tellurium-silicon-containing and lead-containing glass oxides. Due to adoption of the modularized formula strategy, active ingredients can be better controlled, and the overall paste formula is more optimized, so that the laminated passivation layers can be selectively burned through to obtain a more balanced contact, and better battery performance on silicon wafers with different passivation layer thicknesses can be achieved, thus achieving excellent photoelectric conversion efficiency.

The present invention is directed to a method for preparing a glass device comprising the steps of: —preparing a mixture comprising: —at least two glass components, —a solvent, —at least one binder system, —optionally at least one defoamer, —blending the mixture to form a blend mixture, —grinding the blend mixture to form a grinded mixture, —casting the grinded mixture to form a layer, and —drying the layer to form a dried layer of a glass device. The present invention is further directed to a glass device, a wavelength converter and a light emitting device comprising the glass device and/or the wavelength converter.

A conductive composition has excellent adhesiveness and conductivity. A conductive composition contains copper powder, cuprous oxide, a lead-free glass frit, and an acid-based additive. The lead-free glass frit is contained in an amount of 9 to 50 parts by mass relative to 100 parts of the copper powder. The lead-free glass frit contains a borosilicate zinc-based glass frit and a vanadium zinc-based glass frit. The borosilicate zinc-based glass frit contains boron oxide, silicon oxide, zinc oxide, and optional other components, among which boron oxide, silicon oxide, and zinc oxide serve as top-three oxide components in terms of content. The vanadium zinc-based glass frit contains vanadium oxide, zinc oxide, and optional other components, among which vanadium oxide and zinc oxide serve as top-two oxide components in terms of content. The acid-based additive is contained 0.1 to 5.0 parts by mass relative to 100 parts of the copper powder.

A conductive composition has excellent adhesiveness to a substrate and conductivity. For example, a conductive composition contains copper powder, cuprous oxide, a lead-free glass frit, and a carboxylic acid-based additive. The cuprous oxide is contained in an amount of at least 5.5 parts by mass and up to 25 parts by mass relative to 100 parts by mass of the copper powder. The lead-free glass frit contains a borosilicate zinc-based glass frit and a vanadium zinc-based glass frit. The borosilicate zinc-based glass frit contains boron oxide, silicon oxide, zinc oxide, and optional other components, among which boron oxide, silicon oxide, and zinc oxide serve as top-three oxide components in terms of content. The vanadium zinc-based glass frit contains vanadium oxide, zinc oxide, and optional other components, among which vanadium oxide and zinc oxide serve as top-two oxide components in terms of content.

A display panel may include a first display substrate, a second display substrate disposed over the first display substrate, and a sealing member bonding the first display substrate and the second display substrate. The sealing member may include a frit sealing member including an outer region and an inner region, with the inner region disposed next to an inner side of the outer region and having a first crystallization temperature lower than a second crystallization temperature of the outer region, and an organic sealing member disposed next to an inner side of the frit sealing member.

A particle mixture comprising particles of a first glass frit and particles of a second glass frit; wherein the first glass frit comprises ≥10 to ≤25 mol. % BaO; and ≥0 to ≤10 mol. % Bi.sub.2O.sub.3; and wherein the second glass frit comprises: ≥35 to ≤55 mol. % Bi.sub.2O.sub.3; ≥2 to ≤20 mol. % ZnO; and ≥10 to ≤40 mol. % B.sub.2O.sub.3.

A particle mixture comprising particles of a first glass frit and particles of a second glass frit; wherein the first glass frit comprises ≥10 to ≤25 mol. % BaO; and ≥0 to ≤10 mol. % Bi.sub.2O.sub.3; and wherein the second glass frit comprises: ≥35 to ≤55 mol. % Bi.sub.2O.sub.3; ≥2 to ≤20 mol. % ZnO; and ≥10 to ≤40 mol. % B.sub.2O.sub.3.

A mixture for coating a metal substrate to prevent or limit scale formation. The mixture comprises 20 to 90% by weight of at least one of: an oxide ceramic material, an aluminosilicate mineral or glass frit. The mixture further comprises 1 to 20% by weight of clay and 3 to 70% by weight of an alkali metal silicate.

Methods for fabricating wires insulated by low porosity glass coatings are provided, as are high temperature electromagnetic (EM) devices containing such wires. In embodiments, a method for fabricating a high temperature EM device includes applying a glass coating precursor material onto a wire. The glass coating precursor material contains a first plurality of glass particles having an initial softening point. After application onto the wire, the glass coating precursor material is heat treated under process conditions producing a crystallized intermediary glass coating having a modified softening point exceeding the initial softening point. The crystallized intermediary glass coating is then infiltrated with a filler glass precursor material containing a second plurality of glass particles. After infiltration, the filler glass precursor material is heat treated to consolidate the second plurality of glass particles into the crystallized intermediary glass coating and thereby yield a low porosity glass coating adhered to the wire.