Disclosed is a composition for sealing inorganic substrates. The composition includes a glass frit and optionally a filler material, wherein the glass frit contains: 30 to 65 wt % V.sub.2O.sub.5; 5 to 35 wt % P.sub.2O.sub.5; 0 to 30 wt % TeO.sub.2; 0 to 30 wt % Bi.sub.2O.sub.3; 0 to 15 wt % ZnO; 0 to 10 wt % MnO; 0 to 5 wt % B.sub.2O.sub.3; 0 to 5 wt % total alkali metal oxides; 0 to 2 wt % Nb.sub.2O.sub.5; 0 to 2 wt % WO.sub.3; 0 to 2 wt % MoO.sub.3; 0 to 2 wt % SiO.sub.2; and 0 to 2 wt % Al.sub.2O.sub.3.

An assembly includes a metal member containing a glass-forming component and a glass member bonded to the metal member in a glass-to-metal seal.

Provided are a glass composition capable of sealing through low-temperature firing without containing environmentally harmful lead, and a sealing material using the same. The glass composition includes, in terms of mol %, 1%, to 30% of MgO+CaO+SrO+BaO+ZnO, 30% to 80% of TeO.sub.2, and 5% to 30% of MoO.sub.3.

A glass coating composition for a fuel cell gasket is described. The coating comprises: a glass component effective to form an alkaline solution in the presence of an equivalent amount of water by weight, a binder component, a liquid carrier which is greater than 50% by volume: water, and a retarder effective to inhibit hardening of the composition. The glass coating composition is particularly useful in fuel cell gaskets and provides improved resistance to solidification in an aqueous dispersion.

A glass coating composition for a fuel cell gasket is described. The coating comprises: a glass component effective to form an alkaline solution in the presence of an equivalent amount of water by weight, a binder component, a liquid carrier which is greater than 50% by volume: water, and a retarder effective to inhibit hardening of the composition. The glass coating composition is particularly useful in fuel cell gaskets and provides improved resistance to solidification in an aqueous dispersion.

A glass frit according to this application may include a composition of P.sub.2O.sub.5, V.sub.2O.sub.5, TeO.sub.2, CuO, ZnO, and BaO configured to replace a conventional lead glass composition and enable a low temperature calcination. A coefficient of thermal expansion (CTE) of the glass frit may be matched with that of a glass substrate. The composition may not include an inorganic filler or at least reduce a content of an inorganic filler to reduce or prevent separation and breakage and to improve durability. The glass frit may be used as a paste for a vacuum glass assembly.

A glass frit according to this application may include a composition of P.sub.2O.sub.5, V.sub.2O.sub.5, TeO.sub.2, CuO, ZnO, and BaO configured to replace a conventional lead glass composition and enable a low temperature calcination. A coefficient of thermal expansion (CTE) of the glass frit may be matched with that of a glass substrate. The composition may not include an inorganic filler or at least reduce a content of an inorganic filler to reduce or prevent separation and breakage and to improve durability. The glass frit may be used as a paste for a vacuum glass assembly.

The present disclosure relates to a low temperature-calcined lead-free glass frit and paste, and a vacuum glass assembly using the same. The glass frit according to the present disclosure has a novel component system comprising V.sub.2O.sub.5, TeO.sub.2, CuO, BaO, one or more of Ag.sub.2O and Bi.sub.2O.sub.3, ZnO, and one or more of SnO and MoO.sub.3 at a characteristic composition ratio according to the disclosure, whereby the glass frit can replace a lead-based glass composition of the related art, can be calcined at a low temperature of 350° C. or lower and can ensure excellent chemical durability.

The present disclosure relates to a low temperature-calcined lead-free glass frit and paste, and a vacuum glass assembly using the same. The glass frit according to the present disclosure has a novel component system comprising V.sub.2O.sub.5, TeO.sub.2, CuO, BaO, one or more of Ag.sub.2O and Bi.sub.2O.sub.3, ZnO, and one or more of SnO and MoO.sub.3 at a characteristic composition ratio according to the disclosure, whereby the glass frit can replace a lead-based glass composition of the related art, can be calcined at a low temperature of 350° C. or lower and can ensure excellent chemical durability.

The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.