The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A method of fabricating a metal thin film-on-glass structure. A glass substrate, on a top surface of which a layer is formed, is prepared. A local area of the glass substrate is etched from a bottom of the glass substrate to expose the layer downwardly, thereby forming an exposed area of the layer. The layer is a metal thin film. The etching includes first-etching the glass substrate to a depth less than a thickness of the glass substrate using a first etching solution containing hydrofluoric acid and at least one of nitric acid and sulfuric acid, resulting in a first-etched portion of the glass substrate; and second-etching the first-etched portion of the glass substrate using an etching solution containing hydrofluoric acid without nitric acid or sulfuric acid, so that the layer is exposed downwardly, whereby the metal thin film is supported by a remaining portion of the glass substrate.

A wafer including a glass substrate is provided. The glass substrate includes a first surface defining a plane and including a surface roughness R.sub.a of approximately 0.3 nm in an outer via region and a second surface. The glass substrate defines a plurality of vias extending from the first surface. The plurality of vias each include an entrance defined by the first surface.

A wafer including a glass substrate is provided. The glass substrate includes a first surface defining a plane and including a surface roughness R.sub.a of approximately 0.3 nm in an outer via region and a second surface. The glass substrate defines a plurality of vias extending from the first surface. The plurality of vias each include an entrance defined by the first surface.

A glass filler of the present disclosure includes glass having a composition, the composition including iron oxide. For the content in mass % of the iron oxide in the composition, 0.005≤FeO≤0.30 and 0.01≤T-Fe.sub.2O.sub.3≤0.80 (T-Fe.sub.2O.sub.3 represents total iron oxide calculated as Fe.sub.2O.sub.3) are satisfied. For the iron oxide in the composition, Fe.sup.2+/(Fe.sup.2++Fe.sup.3+), which represents the proportion by mass of Fe.sup.2+ to total iron, is 0.15 or more and 1.00 or less. The glass filler of the present disclosure is a glass filler having a new composition including a coloring component, the glass filler having a high visible transmittance and a controlled color which can be, for example, within a range of colors different from those of conventional glass fillers that have a low visible transmittance.

A superstrate for forming a planarization layer on a substrate can include a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface. An opaque layer can coat the chamfered edge. In another embodiment, an opaque layer can coat the chamfered edge and a portion of the second surface. The superstrate can be used for more planarization or other processing sequences without causing extrusion defects.

A superstrate for forming a planarization layer on a substrate can include a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface. An opaque layer can coat the chamfered edge. In another embodiment, an opaque layer can coat the chamfered edge and a portion of the second surface. The superstrate can be used for more planarization or other processing sequences without causing extrusion defects.

A window glass structure according to one aspect of the present invention includes a window glass for a vehicle that has a surface provided with a conductive layer having a predetermined pattern, and a connection terminal that is soldered to the conductive layer. The connection terminal includes a first joining portion that is joined to the conductive layer by soldering using a lead-free solder, a first side plate that is linked to the first joining portion and extends in a direction of separation from the surface of the window glass, a second joining portion that is joined to the conductive layer by soldering using a lead-free solder, a second side plate that is linked to the second joining portion and extends in a direction of separation from the surface of the window glass, a bridge portion that extends so as to link the two side plates, and a terminal portion configured to be linked to the bridge portion so as to have a face that is oriented in a direction different from directions in which faces of the two side plates and the bridge portion are oriented, at a position separated from regions to which the first side plate and the second side plate are linked.

A process that anneals a surface of a substrate bearing a coating includes running the substrate under a flash lamp emitting intense pulsed light and irradiating the coating with the pulsed light through a mask located between the flash lamp and the coating. A frequency of the flash lamp and a run speed of the substrate are adjusted so that each point of the coating to be annealed receives at least one light pulse. A distance between a lower face of the mask and the surface of the coating to be annealed is at most equal to 1 mm. A shape and extent of a slit in the mask are such that the mask occults the coating to be annealed in all zones where the light intensity that, in an absence of the mask, would arrive at the coating to be annealed is lower than a threshold light intensity.

A process that anneals a surface of a substrate bearing a coating includes running the substrate under a flash lamp emitting intense pulsed light and irradiating the coating with the pulsed light through a mask located between the flash lamp and the coating. A frequency of the flash lamp and a run speed of the substrate are adjusted so that each point of the coating to be annealed receives at least one light pulse. A distance between a lower face of the mask and the surface of the coating to be annealed is at most equal to 1 mm. A shape and extent of a slit in the mask are such that the mask occults the coating to be annealed in all zones where the light intensity that, in an absence of the mask, would arrive at the coating to be annealed is lower than a threshold light intensity.