C03C27/02

Method of manufacturing hybrid parts consisting of metallic and non-metallic materials at high temperature
11584115 · 2023-02-21 · ·

This invention generally relates to a method of manufacturing hybrid parts comprising metallic and non-metallic materials at high temperature. During the method, a hollow metallic feedstock heated to a temperature in the austenite region may be placed in a die and filled with a non-metallic material in a viscous condition, after which the feedstock in the die is formed and then controlled-cooled to cause hardening of the non-metallic material in the region of contact between the metallic and non-metallic material. Afterwards, the semi-finished product is removed from the die and cooled to room temperature. The rate of cooling may be adjusted to generate compressive stress in the surface layer of the non-metallic material, which reduces the risk of cracking.

METHOD OF JOINING GLASS ELEMENTS WITH MATERIAL CONTINUITY, GLASS COMPONENT, AND HOUSING, AND VACUUM INSULATING GLASS PANEL COMPRISING THE GLASS COMPONENT

The present invention relates to a method of joining glass elements with material continuity, to a glass component, to a housing, and to a vacuum insulating panel. The method comprises the following steps providing first and second glass elements, with each of the glass elements having at least one joining region having an outer edge to be joined, introducing a metallic material into the first glass element in the region of the joining region of the first glass element, placing the first and second glass elements onto one another such that the first and second glass elements contact one another at least at one outer edge of the respective joining region; and heating the metallic material in the first glass element so that the glass element at least partially melts in the region of the joining region of the first glass element so that a connection with material continuity is produced between the first and second glass elements.

METHOD OF JOINING GLASS ELEMENTS WITH MATERIAL CONTINUITY, GLASS COMPONENT, AND HOUSING, AND VACUUM INSULATING GLASS PANEL COMPRISING THE GLASS COMPONENT

The present invention relates to a method of joining glass elements with material continuity, to a glass component, to a housing, and to a vacuum insulating panel. The method comprises the following steps providing first and second glass elements, with each of the glass elements having at least one joining region having an outer edge to be joined, introducing a metallic material into the first glass element in the region of the joining region of the first glass element, placing the first and second glass elements onto one another such that the first and second glass elements contact one another at least at one outer edge of the respective joining region; and heating the metallic material in the first glass element so that the glass element at least partially melts in the region of the joining region of the first glass element so that a connection with material continuity is produced between the first and second glass elements.

Low dielectric loss glasses for electronic devices

An article including a glass having that includes SiO.sub.2, Al.sub.2O.sub.3, and B.sub.2O.sub.3 and least one of Li.sub.2O, Na.sub.2O, K.sub.2O, MgO, CaO, SrO, BaO, SnO.sub.2, ZnO, La.sub.2O.sub.3, F, and Fe.sub.2O.sub.3, wherein the glass includes a dielectric constant of about 10 or less and/or a loss tangent of about 0.01 or less, both as measured with signals at 10 GHz.

GLASS-METAL FEEDTHROUGH
20220059337 · 2022-02-24 · ·

A glass-metal feedthrough includes: an external conductor having a coefficient of expansion α.sub.external, and having an opening formed therein; an internal conductor disposed in the opening, the internal conductor including iron and having a coefficient of expansion α.sub.internal, the external conductor and the internal conductor being configured to not release nickel when in contact with a human or animal body or biological cells of a cell culture; and a glass material surrounding the internal conductor within the opening and having a coefficient of expansion α.sub.glass, the coefficient of expansion of the internal conductor α.sub.internal and the coefficient of expansion of the external conductor α.sub.external are such that a joint pressure on the internal conductor of at least 30 MPa is generated in a temperature range of 20° C. to a glass transformation temperature of the glass material.

GLASS-METAL FEEDTHROUGH
20220059337 · 2022-02-24 · ·

A glass-metal feedthrough includes: an external conductor having a coefficient of expansion α.sub.external, and having an opening formed therein; an internal conductor disposed in the opening, the internal conductor including iron and having a coefficient of expansion α.sub.internal, the external conductor and the internal conductor being configured to not release nickel when in contact with a human or animal body or biological cells of a cell culture; and a glass material surrounding the internal conductor within the opening and having a coefficient of expansion α.sub.glass, the coefficient of expansion of the internal conductor α.sub.internal and the coefficient of expansion of the external conductor α.sub.external are such that a joint pressure on the internal conductor of at least 30 MPa is generated in a temperature range of 20° C. to a glass transformation temperature of the glass material.

Glass system for hermetically joining Cu components, and housing for electronic components
09807897 · 2017-10-31 · ·

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

Glass system for hermetically joining Cu components, and housing for electronic components
09807897 · 2017-10-31 · ·

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

METHOD FOR INTEGRALLY FORMING NON-METAL PART AND METAL PART
20170305790 · 2017-10-26 ·

A method for integrally forming a non-metal part and a metal part. The method comprises the following steps: A, arranging a non-transparent non-metal part in a mold; B, arranging a metal part on the periphery of the non-metal part in the mold, the metal part being a continuous structure located on the periphery of the non-metal part; C, heating the metal part so that the metal part is formed into semi-solid metal defined in a mold cavity; D, extruding the semi-solid metal through the mold, so that the semi-solid metal is combined with the periphery of the non-metal part in a seamless mode; and E, quickly cooling the semi-solid metal located on the periphery of the non-metal part, so that the semi-solid metal is formed into amorphous metal combined with the periphery of the non-metal part in a seamless mode. The method is simple and practicable, the rate of finished products is high, the metal part obtained through extrusion has high compactness and strength, and the difficulty in follow-up surface treatment of the metal part is reduced.

METHOD FOR INTEGRALLY FORMING NON-METAL PART AND METAL PART
20170305790 · 2017-10-26 ·

A method for integrally forming a non-metal part and a metal part. The method comprises the following steps: A, arranging a non-transparent non-metal part in a mold; B, arranging a metal part on the periphery of the non-metal part in the mold, the metal part being a continuous structure located on the periphery of the non-metal part; C, heating the metal part so that the metal part is formed into semi-solid metal defined in a mold cavity; D, extruding the semi-solid metal through the mold, so that the semi-solid metal is combined with the periphery of the non-metal part in a seamless mode; and E, quickly cooling the semi-solid metal located on the periphery of the non-metal part, so that the semi-solid metal is formed into amorphous metal combined with the periphery of the non-metal part in a seamless mode. The method is simple and practicable, the rate of finished products is high, the metal part obtained through extrusion has high compactness and strength, and the difficulty in follow-up surface treatment of the metal part is reduced.